TFBGA240 Search Results

Contextual Info: Package outline TFBGA240: plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm D B SOT868-1 A ball A1 index area A E A2 A1 detail X C e1 ∅v ∅w b e M M y y1 C C A B C U T R P N e M L K e2 J H G F E D C B A ball A1 index area

sot868

Abstract: TFBGA240
Contextual Info: Package outline Philips Semiconductors TFBGA240: plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm D SOT868-1 B A ball A1 index area A E A2 A1 detail X C e1 ∅v ∅w b e M M y1 C C A B C y U T R P N e M L K e2 J H G F E D C

17015e

Abstract: C24MI LR38666Y 240-ball io12u T-TFBGA240-1414 TCNT22
Contextual Info: BACK LR38666Y LR38666Y One-chip System LSI for Digital Still Cameras DESCRIPTION • Power supplies – +2.5 V for digital/analog circuits – +3.3 V for digital circuits • Package : 240-ball CSP T-TFBGA240-1414 The LR38666Y is a CMOS digital signal processor

AIC-8381

Abstract: sram 16x16-bit AIC-5465-DIE L5510 STMicroelectronics date code format
Contextual Info: L5510 HIGHLY INTEGRATED, AUTOMATED SINGLE-CHIP DRIVE MANAGER AND DISK DRIVE CONTROLLER DATA BRIEF 1 • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 2 ■ ■ ■ ■ ■ ■ ■ 3 ■ ■ ATA Host Interface Block Figure 1. Package Synchronous DMA modes 0-4

qualcomm msm 8255

Abstract: lm089hb1t04 GW 5819 DIODE IR3E11M1 IRM053U7 BS2F7VZ0165 lr36b11 LQ065T9DZ03 SHARP LM089HB1T04 LM081
Contextual Info: ✲_❄on❏❆n❏•.❇m ✷❂❈❆ ✣ ✳❍❊❅❂❖, J❑l❖ ✥✣, ✥✣✣✪ ✦:✤✬ ✷M CONTENTS Advanced Measures for Environmental Conservation as Management Policy. PACKAGES

AIC-8381

Abstract: AIC-5465-DIE L5510
Contextual Info: L5510 HIGHLY INTEGRATED, AUTOMATED SINGLE-CHIP DRIVE MANAGER AND DISK DRIVE CONTROLLER DATA BRIEF 1 • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 2 ■ ■ ■ ■ ■ ■ ■ 3 ■ ■ ■ ■ ■ ■ ■ 4 ■ ■ ATA Host Interface Block Synchronous DMA modes 0-4