BGA and QFP Package mounting
Abstract: MCP Technology Trend EE13 jwg2 EE13 JWG SC47D tfBGA PACKAGE thermal resistance EIA and EIAJ standards Combo (Spindle VCM) Driver BGA and QFP Package EE-13
Contextual Info: PACKAGE TRENDS 1-1 Packaging Trends Needs of electronic equipment Optimized System Integration Performance • Multiple functions • High speed • High output Outline • Small • Thin • Light Assembly • Automation • Systematization • High density
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1P100
Abstract: LVCMOS25 QL1P100
Contextual Info: QuickLogic PolarPro Device Data Sheet — 86-Pin TFBGA QL1P100 •••••• Combining Low Power, Performance, Density, and Embedded RAM • Quadrant-based segmentable clock networks Device Highlights 16 quad clock networks per device Low Power Programmable Logic
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86-Pin
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PU86
Contextual Info: QuickLogic PolarPro Device Data Sheet — 86-Pin TFBGA QL1P100 •••••• Combining Low Power, Performance, Density, and Embedded RAM • Quadrant-based segmentable clock networks Device Highlights 16 quad clock networks per device Low Power Programmable Logic
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86-Pin
QL1P100
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QL1P1000
Abstract: QL1P100 100 pin vqfp drawing TFBGA196 12x12 bga thermal resistance vqfp 44 thermal resistance 100C QL8050 LBGA thermal SSDL18
Contextual Info: PolarPro Solution Platform Family Data Sheet •••••• Family of Solution Platforms Integrating Low Power Programmable Fabric and Embedded SRAM Platform Highlights Flexible Programmable Fabric • 8 to 240 customizable building blocks CBBs (see
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1P100
Abstract: LVCMOS25 QL1P100 PU86
Contextual Info: QuickLogic PolarPro® Device Data Sheet — 86-Pin TFBGA QL1P100 •••••• Combining Low Power, Performance, Density, and Embedded RAM • Quadrant-based segmentable clock networks Device Highlights 16 quad clock networks per device Low Power Programmable Logic
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86-Pin
QL1P100
1P100
LVCMOS25
QL1P100
PU86
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JESD51-9
Abstract: VFBGA package tray AN 7823 JESD51-2 vFBGA* 96 bALL WFBGA lfbga Encapsulation thermal resistance TRAY 15X15 tfBGA PACKAGE thermal resistance tray vfbga
Contextual Info: FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm LFBGA , 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of
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mmc 304
Abstract: jedec package TFBGA 12
Contextual Info: QuickLogic PolarPro II Solution Platform Data Sheet •••••• Combining Low Power Programmable Fabric and Embedded SRAM Solution Platform Highlights Flexible Programmable Fabric • Up to 27 customizable building blocks CBBs (see Programmable Fabric Architectural Overview
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LVCMOS18,
mmc 304
jedec package TFBGA 12
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thetaja wlcsp
Abstract: QL2P150 mmc 304 121-ball QUICKLOGIC SDIO Host
Contextual Info: QuickLogic PolarPro II Solution Platform Data Sheet •••••• Combining Low Power Programmable Fabric and Embedded SRAM Solution Platform Highlights Flexible Programmable Fabric • Up to 27 customizable building blocks CBBs (see Programmable Fabric Architectural Overview
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LVCMOS18,
thetaja wlcsp
QL2P150
mmc 304
121-ball
QUICKLOGIC SDIO Host
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jedec package TFBGA 12
Abstract: 100 pin vqfp drawing LBGA thermal 8mm pitch BGA 256 pin 14x14 QUICKLOGIC SDIO Host
Contextual Info: PolarPro Solution Platform Family Data Sheet •••••• Family of Solution Platforms Integrating Low Power Programmable Fabric and Embedded SRAM Platform Highlights Flexible Programmable Fabric • 8 to 240 customizable building blocks CBBs (see
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marking k4 MPS
Abstract: marking dh10 DH17 DH19 ICS83841 tfBGA 8 x 8 tray
Contextual Info: ICS83841 Integrated Circuit Systems, Inc. 20 BIT, DDR SDRAM 2:1 MUX GENERAL DESCRIPTION FEATURES The ICS83841 is a 20 Bit, DDR SDRAM 2:1 MUX and is a member of the HiPerClockS family of HiPerClockS™ High Performance Clock Solutions from ICS. The device has 20 host lines and each host line can
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ICS83841
ICS83841
180ps
83841BH
marking k4 MPS
marking dh10
DH17
DH19
tfBGA 8 x 8 tray
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PMP 11.48
Abstract: power one pmp 5.24 thetaja wlcsp QL2P150 ql2p UART/keyboard controller
Contextual Info: QuickLogic PolarPro II Solution Platform Data Sheet •••••• Combining Low Power Programmable Fabric and Embedded SRAM Solution Platform Highlights Flexible Programmable Fabric • Up to 27 customizable building blocks CBBs (see Programmable Fabric Architectural Overview
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power one pmp 5.24
thetaja wlcsp
QL2P150
ql2p
UART/keyboard controller
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transistor DB19
Abstract: tfBGA PACKAGE thermal resistance transistor DB15 DH11 transistor DA19
Contextual Info: PRELIMINARY Integrated Circuit Systems, Inc. ICS83841 20 BIT, DDR SDRAM 2:1 MUX GENERAL DESCRIPTION FEATURES The ICS83841 is a 20 Bit, DDR SDRAM 2:1 MUX and is a member of the HiPerClockS family of HiPerClockS™ High Performance Clock Solutions from ICS. The
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transistor DB19
tfBGA PACKAGE thermal resistance
transistor DB15
DH11
transistor DA19
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DH17
Abstract: transistor da3 DH19 ICS83841 DBX application note
Contextual Info: ICS83841 Integrated Circuit Systems, Inc. 20 BIT, DDR SDRAM 2:1 MUX GENERAL DESCRIPTION FEATURES The ICS83841 is a 20 Bit, DDR SDRAM 2:1 MUX and is a member of the HiPerClockS family of HiPerClockS™ High Performance Clock Solutions from ICS. The device has 20 host lines and each host line can
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ICS83841
ICS83841
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83841BH
DH17
transistor da3
DH19
DBX application note
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QUICKLOGIC SDIO Host
Abstract: nand flash sdio quicklogic
Contextual Info: PolarPro Solution Platform Family Data Sheet •••••• Family of Solution Platforms Integrating Low Power Programmable Fabric and Embedded SRAM Platform Highlights Flexible Programmable Fabric • 8 to 240 customizable building blocks CBBs (see
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256Mx8
Abstract: VR7EU127258GBD 2628 S-108 tfBGA PACKAGE thermal resistance
Contextual Info: DDR3 UNBUFFERED DIMM VR7EUxxxx58xxx Module Configuration Non-ECC Viking Part Number Capacity Module Configuration Device Configuration Device Package Module Ranks Performance CAS Latency VR7EU286458FBZ VR7EU286458FBA VR7EU286458FBB VR7EU286458FBC VR7EU286458FBD
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VR7EUxxxx58xxx
VR7EU286458FBZ
VR7EU286458FBA
VR7EU286458FBB
VR7EU286458FBC
VR7EU286458FBD
VR7EU286458FBE
VR7EU566458GBZ
VR7EU566458GBA
VR7EU566458GBB
256Mx8
VR7EU127258GBD
2628
S-108
tfBGA PACKAGE thermal resistance
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DH11
Abstract: DH17 DH-14
Contextual Info: DATA SHEET ICS83841 ICS83841 Integrated 2:1 MUX 20 BIT, DDR SDRAM Circuit 20 BIT, DDR SDRAM 2:1 MUX Systems, Inc. GENERAL DESCRIPTION FEATURES The ICS83841 is a 20 Bit, DDR SDRAM 2:1 MUX and is a member of the HiPerClockS family of HiPerClockS™ High Performance Clock Solutions from ICS. The
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ICS83841
ICS83841
199707558G
DH11
DH17
DH-14
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QL2P150
Abstract: mmc 304 block diagram Wireless Bluetooth 2.0 EDR quicklogic multimedia 325 MMC
Contextual Info: QuickLogic PolarPro II Solution Platform Data Sheet •••••• Combining Low Power Programmable Fabric and Embedded SRAM Solution Platform Highlights Flexible Programmable Fabric • Up to 27 customizable building blocks CBBs (see Programmable Fabric Architectural Overview
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QL2P150
mmc 304
block diagram Wireless Bluetooth 2.0 EDR
quicklogic multimedia
325 MMC
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transistor DA3 S 18
Abstract: DH11 DH17 transistor da3 transistor DB15 DH19 21MUX DA17 DH12 transistor DB19
Contextual Info: PRELIMINARY Integrated Circuit Systems, Inc. ICS83841 20 BIT, DDR SDRAM 2:1 MUX GENERAL DESCRIPTION FEATURES The ICS83841 is a 20 Bit, DDR SDRAM 2:1 MUX and is a member of the HiPerClockS family of HiPerClockS High Performance Clock Solutions from ICS. The
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transistor DA3 S 18
DH11
DH17
transistor da3
transistor DB15
DH19
21MUX
DA17
DH12
transistor DB19
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MARVELL PXA 940
Abstract: CE-ATA version 1.1 marvell pxa TDS7404B QL1A100 Marvell CEA-936 CEA-936-A PDIUSBP11A marvell ethernet
Contextual Info: ArcticLink Solution Platform Data Sheet •••••• Programmable Solution Platform Including Hi-Speed Universal Serial Bus USB 2.0 On-The-Go (OTG) and SD/SDIO/MMC/CE-ATA Platform Highlights Programmable I/O • Bank programmable drive strength Hi-Speed USB 2.0 OTG Controller
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MARVELL PXA 940
CE-ATA version 1.1
marvell pxa
TDS7404B
QL1A100
Marvell
CEA-936
PDIUSBP11A
marvell ethernet
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Embedded SDIO
Abstract: usb to SD CEA-936 CEA-936-A PDIUSBP11A TDS7404B QL1A100 CE-ATA version 1.1 sdio mmc connector marvell ethernet PHY transceivers
Contextual Info: ArcticLink Solution Platform Data Sheet •••••• Programmable Solution Platform Including Hi-Speed Universal Serial Bus USB 2.0 On-The-Go (OTG) and SD/SDIO/MMC/CE-ATA Platform Highlights Programmable I/O • Bank programmable drive strength Hi-Speed USB 2.0 OTG Controller
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Embedded SDIO
usb to SD
CEA-936
PDIUSBP11A
TDS7404B
QL1A100
CE-ATA version 1.1
sdio mmc connector
marvell ethernet PHY transceivers
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12x12 bga thermal resistance
Abstract: QUICKLOGIC SDIO Host
Contextual Info: PolarPro Solution Platform Family Data Sheet •••••• Family of Solution Platforms Integrating Low Power Programmable Fabric and Embedded SRAM Platform Highlights Flexible Programmable Fabric • 8 to 240 customizable building blocks CBBs (see
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4B 22 25V
Abstract: CBTV4010 ICS3840ALF ICS83840 ICS83840AH ICS83840AHLF ICS83840AHLFT ICS83840AHT hp8k tfBGA 8 x 8 tray
Contextual Info: ICS83840 Integrated Circuit Systems, Inc. DDR SDRAM MUX GENERAL DESCRIPTION FEATURES The ICS83840 is a DDR SDRAM MUX and is a member of the HiPerClock S family of High HiPerClockS™ Performance Clock Solutions from ICS. The device has 10 Host Lines and each host line can
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ICS83840
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83840AH
4B 22 25V
CBTV4010
ICS3840ALF
ICS83840AH
ICS83840AHLF
ICS83840AHLFT
ICS83840AHT
hp8k
tfBGA 8 x 8 tray
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C1608X5R0J106MT
Abstract: C2012X5R0J106MT GRM188R60J106ME47D JMK212BJ106MG-T JMK212BJ226MG-T 3x3x12-0
Contextual Info: STw4141 Single-coil dual-output step-down DC/DC converter for digital base band and multimedia processor supply Features • Single coil dual output switching converter for digital core supply & digital I/Os supply – Digital I/O supply:VOUT1 @ 200 mA – CPU CORE supply:VOUT2 @ 400 mA
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STw4141
C1608X5R0J106MT
C2012X5R0J106MT
GRM188R60J106ME47D
JMK212BJ106MG-T
JMK212BJ226MG-T
3x3x12-0
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JMK212BJ226MG-T
Abstract: st-ericsson JESD-020-C C1608X5R0J106MT C2012X5R0J106MT GRM188R60J106ME47D JMK212BJ106MG-T
Contextual Info: IMPORTANT NOTICE Dear customer, As from February 2nd 2009, ST and Ericsson have merged Ericsson Mobile Platforms and ST-NXP Wireless into a 50/50 joint venture "ST‐Ericsson". As a result, the following changes are applicable to the attached
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