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    Omega Engineering TEMP-0989

    Temp-0989 |Omega TEMP-0989
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    Melcor peltier

    Abstract: peltier melcor Peltier element Melcor thermo peltier Melcor footprint soic28 Melcor peltier 40 peltier peltier cooler peltier application notes
    Contextual Info: MEASURING THE EFFECTS OF ENERGY FLOW ON IC PACKAGE THERMAL PERFORMANCE APPLICATION NOTE AN-160 Integrated Device Technology, Inc. By Chris Wyland ABSTRACT Heat to Air This paper is an examination of how to model PCB conduction effects when modeling IC package thermal performance.


    Original     		AN-160 EIA/JESD51-1 MRL-92-TIR-2 EIA/JESD51-3 Melcor peltier peltier melcor Peltier element Melcor thermo peltier Melcor footprint soic28 Melcor peltier 40 peltier peltier cooler peltier application notes PDF