TDP01 Search Results

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

Contextual Info: TDP www.vishay.com Vishay Dale Thin Film Molded, Dual-In-Line Thin Film Resistor, Through Hole Network FEATURES Actual Size Vishay Dale Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100  to 100 k resistance range. The networks feature ratio

TDP1603

Abstract: TDP1403
Contextual Info: TDP Vishay Thin Film Molded, Dual-In-Line Resistor, Through Hole Network FEATURES Actual Size Vishay Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100 Ω to 100 kΩ resistance range. The networks feature ratio tolerance to

1601 resistor dale

Abstract: TDP-1401
Contextual Info: TDP www.vishay.com Vishay Dale Thin Film Molded, Dual-In-Line Thin Film Resistor, Through Hole Network FEATURES Actual Size Vishay Dale Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100  to 100 k resistance range. The networks feature ratio

net eN8

Abstract: TDN01 crpa 8B10B P802 TLK3118 XGXS quad video processor
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)

K297

Abstract: net eN8 TDN01
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)

Contextual Info: TDP www.vishay.com Vishay Dale Thin Film Molded, Dual-In-Line Thin Film Resistor, Through Hole Network FEATURES Actual Size Vishay Dale Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100  to 100 k resistance range. The networks feature ratio

8B10B

Abstract: P802 TLK3118 RXD17
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

prbs parity checker and generator

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

tdp1603

Abstract: TDP1403 tdp1603 1002 TDPT
Contextual Info: TDP Vishay Thin Film Molded, Dual-In-Line Resistor Networks FEATURES • Lead Pb -free available • Standard Rugged, molded case construction (14 and 16 Pin) • Highly stable thin film (500 ppm at + 70 °C at 2000 hrs.) • Low temperature coefficient (± 25 ppm/°C)

TTP-111V

Abstract: TTA-111AVT TTA-111AVR TTA-111AV rj45 female TDP414V TDP016 bnc male to rj45 TTP-444V TTP-414VD
Contextual Info: Passive Series Twisted Pair Transmission Active Series Twisted Pair Transmission Smart twisted pair transmission products are designed for CCTV signal transmission over unshielded twisted pair wire CAT 5 network cable . These smart cabling system transmission are an alternative solution to coaxial and fiber based systems,

tdp1603

Contextual Info: TDP Vishay Thin Film Molded, Dual-In-Line Resistor, Through Hole Network FEATURES Actual Size Vishay Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100 Ω to 100 kΩ resistance range. The networks feature ratio tolerance to

TDP1603

Contextual Info: TDP Vishay Thin Film Molded, Dual-In-Line Resistor Networks FEATURES • Lead Pb -free available • Standard Rugged, molded case construction (14 and 16 Pin) • Highly stable thin film (500 ppm at + 70 °C at 2000 hours) • Low temperature coefficient (± 25 ppm/°C)

TDP1603

Contextual Info: TDP Vishay Thin Film Molded, Dual-In-Line Resistor Networks FEATURES • Standard Rugged, molded case construction 14 and 16 Pin • Highly stable thin film • Low temperature coefficient ± 25ppm/°C • Compatible with automatic insertion equipment Actual Size

TDN01

Abstract: TDP01/TDN01 net eN8 acq2 RDN01 130nm CMOS
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

Contextual Info: STANDARD PRODUCTS A C O M P A N Y OF OHMTEK Standard Precision Resistor Networks Dual-ln-Line Non-Hermetic ▼ Models: TDP1401 and TDP1601 13 or 15 resistors with one pin common TDP1403 and TDP1603 7 or 8 isolated resistors Features ▲ Rugged, molded case construction

Contextual Info: p R b C I S I N T H I N F I L M T F H M o ld ed , Dual-Hn-Line R e s is to r N e tw o rk s N O L O G v T h in F ilm TOP Series F eatures T H R O U G H HOLE Standard Rugged, molded case construction 14 and 16 Pin Highly stable thin film Low temperature coefficient

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

TDP01/TDN01

Abstract: TDN21 XAUI 8B10B P802 TLK3118 c20d10
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

tdp1603

Abstract: TDP1403
Contextual Info: TDP Vishay Thin Film Molded, Dual-In-Line Resistor Networks FEATURES • Lead Pb -free available • Standard Rugged, molded case construction (14 and 16 Pin) • Highly stable thin film (500 ppm at + 70 °C at 2000 hours) • Low temperature coefficient (± 25 ppm/°C)

TDP1403

Abstract: TDP1603 TDP-1403
Contextual Info: P R E C I S I O N T H I N F I L M T E C H N O L O G Y Molded, Dual-In-Line Resistor Networks TDP Series FEATURES • Standard Rugged, molded case construction 14 and 16 Pin • Highly stable thin film • Low temperature coefficient ±25 ppm/°C Actual Size

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

Contextual Info: TDP Vishay Thin Film Molded, Dual-In-Line Resistor Networks FEATURES Actual Size • Lead Pb -Free available • Standard Rugged, molded case construction (14 and 16 Pin) • Highly stable thin film • Low temperature coefficient ± 25ppm/°C • Compatible with automatic insertion equipment

SERDES 10G

Abstract: TDN01
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)