TAPE AND REEL BGA Search Results

BGA 328

Contextual Info: u Chapter 8 Tape and Reel CHAPTER 8 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Publication Revision A 3/1/03 8-1 u Chapter 8 Tape and Reel INTRODUCTION AMD offers a tape-and-reel packing container for PLCC, SOIC,

LGA 1150

Contextual Info: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch

Contextual Info: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch

639X

Abstract: LGA 1150
Contextual Info: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter 150mm for SBGA and contain between 250 and 2500 devices.

MO-205

Abstract: TAPE AND REEL BGA 54-BALL
Contextual Info: Revised May 2001 BGA Tape and Reel Specifications Tape and Reel Quantities Package Code GX Package Description Package Drawing Number Tape and Reel Container Quantity 54-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide BGA54A 2500 96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide

Contextual Info: Technical Brief 347 Tape and Reel Specification for Integrated Circuits Introduction Many Surface Mounted Devices SMDs are being packaged for shipment in embossed tape and wound onto reels. The Intersil tape and reel specifications are in compliance with

948D

Abstract: FC-09A
Contextual Info: FC-09A 2 x 2 mm MOSFET BGA Tape and Reel Dimensions FC-09A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-09A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film

948d

Contextual Info: FC-12A 2 x 2.5 mm MOSFET BGA Tape and Reel Dimensions FC-12A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-12A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film

QFn 64 tape carrier

Abstract: Techwell 7x7x1 TB347 MO-169 1748 QFN
Contextual Info: Technical Brief 347 Author: Laszlo Nemeth Tape and Reel Specification for Integrated Circuits Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The Intersil Tape and Reel specifications are in compliance with

f948

Abstract: F63TNR FDZ6966
Contextual Info: FC-12A 2 x 2.5 mm MOSFET BGA with 12 balls Tape and Reel Data FC-12A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: FC-12A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled

FC-09A

Abstract: f948 F63TNR FDZ6966 corrugated box spec
Contextual Info: FC-09A 2 x 2 mm MOSFET BGA with 9 balls Tape and Reel Data FC-09A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: FC-09A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled

TQFN 48 7X7

Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
Contextual Info: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2

SM-69

Abstract: ods-1072 ODS-1079 ODS-1306 PQFN-12 sm2 1056 SOIC-AC90 W1 sot 363 M513 SM-46
Contextual Info: Tape and Reel Packaging for Surface Mount Components M513 V11 Introduction M/A-COM supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and tape

ods-1072

Abstract: SM-69 ODS-1056 VHHC W1 sot 363 M513 MO-220 MSOP-10 PQFN-12 ODS-54
Contextual Info: Tape and Reel Packaging for Surface Mount Components M513 V9 Introduction M/A-COM supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and tape

Contextual Info: Tape and Reel Specifications Description Loading the Reel Surface-mounted devices are packaged in embossed tape and wound onto reels for shipment in compliance with Electronics Industries Association Standard EIA-481 Rev. A. Empty pockets are not permitted between the first and last

intel 04195

Abstract: BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3
Contextual Info: 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media Overview NOTE: Please refer to the web-based Mechanical Spec for most up to date information at: 4.2 Shipping Media 4.2.1 Tape and Reel The µBGA package shipped in Tape and Reel

k1 522

Abstract: VFBGA EIA-481-B 07JAN200 pd0002
Contextual Info: PD0002 Packing information Chip scale packages for memory products tape and reel shipping media Introduction Surface mounting packages can be supplied with tape and reel packing. The reels are standard 330 mm 13” diameter, 180 mm (7”) for very small packages, and

PQFN-32

Abstract: STQFN-14 ODS-1056 PQFN-12 PQFN-24 SM-46 STQFN-12 SOW-24 ODS-1072 MO-229
Contextual Info: Application Note M513 Tape and Reel Packaging for Surface Mount Components Rev. V15 Introduction M/A-Com Technology Solutions supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and

f 948

Abstract: TOP 948 f948
Contextual Info: FC-36A 5.5 x 5 mm MOSFET BGA Tape and Reel Dimensions FC-36A MOSFET BGA Packaging Configuration: Figure 1 F63TNR Label Packaging Description: Antistatic Cover Tape FC-36A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled

Contextual Info: S PEC I FI C AT I ON SHE E T Tape and Reel Tap e a n d R ee l UltraLite designs Available Now Reel only Optimized for high speed assembly of small components Confor ms to EIA-481 Peak Tape and Reel designs protect your high-value, small components through your high-speed assembly processes. Available for a

FDZ6966

Abstract: F63TNR SK 150 BGA
Contextual Info: FC-18A 2.5 x 4 mm MOSFET BGA with 18 balls Tape and Reel Data FC-18A MOSFET BGA Packaging Configuration: Figure 1.0 Packaging Description: Moisture Sens itive Sticker Antistatic Cover Tape FC-18A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled

AT 30B

Abstract: F63TNR FC-30B FDZ6966 D9942
Contextual Info: FC-30B 4 x 3.5 mm MOSFET BGA with 30 balls Tape and Reel Data FC-30B MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-30B MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled

948c

Contextual Info: FC-18A 2.5 x 4 mm MOSFET BGA Tape and Reel Dimensions FC-18A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-18A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film

F63TNR

Abstract: FDZ6966 F942B
Contextual Info: FC-36A 5 x 5.5 mm MOSFET BGA with 36 balls Tape and Reel Data FC-36A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-36A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled