TA31001F Search Results

TA31002P

Abstract: max2918 TA31001P TA31002A
Contextual Info: TA31001P, TA31002P, TA31002AP TA31001F, TA31002F, TA31002AF TONE RINGER For telephone set . . . . Current consumption is small. (at no-load) Package is compact. (DIP-8 pin) Oscillation frequency is variable. Built-in threshold circuits prevent false triggering due to power noise as well as

TA31002P

Abstract: TA31001P TA31002AP TA3100 TA310 TA31002AF DIP8-P-300A CI047
Contextual Info: i TOSHIBA INTEGRATED CIRCUIT TECHNICAL DATA TA31001P. TA31002P, TA31002AP TA31001F, T A 3 10 0 2 F .T A 3 1002AF TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TONE RINGER For telephone set Current consumption is small. (at no-load) Package is compact.

TA31002P

Contextual Info: f TOSHIBA INTEGRATED CIRCUIT TA31001P. TA31002P, TA31002AP TA31001F, TA31002F. TA31002AF TECHNICAL DATA TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TONE RINGER For telephone set Current consumption is small. (at no-load) Package is compact.

Contextual Info: 5. Taping Specifications for Flat Packages 1. Application Scope These specifications are applicable to taping finish and related matters on flat packages of BIP ICs delivered by Toshiba Corporation. When taping is required, customers are requested to obtain the actual taping specifications

TA31023P

Abstract: TA8104F TA31028P 10-pin compander IC ta31065n TA31065F ta31056 TA31062N TA31101AP TA31024N
Contextual Info: 1. A LIST OF BIPOLAR IC SERIES FOR TELEPHONE SET FUNCTION NAME NAME of IC Variable initiation supply Voltage type Variable initiation current Tone Ringer Generates ringing tone High performance Type built-in non-linear circuit Low operating voltage type

LTA 703 S

Abstract: TA31002P TA31001P TA31002AP LTA 703
Contextual Info: TONE RINGER ICs TONE RINGER FOR TELEPHONE SET FEATURES • C u rre n t c o n s u m p tio n is sm all, a t n o -lo a d • Package is com pact. (DIP -8 pin) • O scilla tio n fre q u e n c y is va riab le . • B u ilt-in th re s h o ld circuits p re v e n t false trig g e r in g d u e to

1500IC

Contextual Info: 6. Embossed Taping Specifications for Flat Packages 1. Scope Embossed taping package specification for bipolar IC flat package products and related matters are, as a rule, in accordance with EIAJ RC-1009B and JEDEC (EIA481A). 2. Shapes and Sizes of Tapes