TA 2119 Search Results
TA 2119 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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54112-119261100LF |
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch. | |||
51952-119LF |
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PwrBlade®, Power Supply Connectors, 48S Vertical Header. | |||
10128492-119500ULF |
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ExaMEZZ® 56Gb/s High Speed Mezzanine 4-pair, 19 column, 19.5mm stacking height, 266contacts | |||
54122-119341300LF |
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch | |||
54122-128721190LF |
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch |
TA 2119 Price and Stock
Century Spring Corp TA-2119CSTAPERED STAINLESS STEEL 0.440" |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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TA-2119CS | Box | 1 |
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IQD Frequency Products LFXTAL021198BulkCrystals 22.5792MHz 30pF -10C 60C |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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LFXTAL021198Bulk | 673 |
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IQD Frequency Products LFXTAL012119BulkCrystals 16.9344MHz 10pF -10C 60C |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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LFXTAL012119Bulk |
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Century Spring Corp TA-2119 |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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TA-2119 | 100 |
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Toshiba America Electronic Components TA2119AFN(EL,SG) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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TA2119AFN(EL,SG) | 5,296 |
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TA 2119 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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249-2078-000
Abstract: 030-1975-008 CET-20D-1 S-249-2079-000 P-249-2073-000 249-2109-000 249-2080-000 S-249-2076-000 249-2079-000 P-249-2072-000
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MIL-C-81659 249-2078-000 030-1975-008 CET-20D-1 S-249-2079-000 P-249-2073-000 249-2109-000 249-2080-000 S-249-2076-000 249-2079-000 P-249-2072-000 | |
flash "high temperature data retention" mechanism
Abstract: A3P060 A3P1000 A3P125 A3P250 AECQ100 AEC-Q100 FG144 FG256 FG484
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AEC-Q100 flash "high temperature data retention" mechanism A3P060 A3P1000 A3P125 A3P250 AECQ100 FG144 FG256 FG484 | |
Contextual Info: Automotive ProASIC 3 Datasheet P ro du c t Br ie f ® 1 – Automotive ProASIC®3 Flash Family FPGAs Features and Benefits Low Power High-Temperature AEC-Q100–Qualified Devices • • • Grade 2 105°C TA 115°C TJ Grade 1 125°C TA (135°C TJ) PPAP Documentation |
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AEC-Q100 130-nm, 64-Bit | |
A3P600
Abstract: A3P060 A3P1000 A3P125 A3P250 AECQ100 AEC-Q100 FG144 FG256 FG484
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AEC-Q100 A3P600 A3P060 A3P1000 A3P125 A3P250 AECQ100 FG144 FG256 FG484 | |
1100 847 e11
Abstract: c 1383
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AEC-Q100 1100 847 e11 c 1383 | |
Contextual Info: Automotive ProASIC 3 Datasheet P ro du c t Br ie f ® 1 – Automotive ProASIC®3 Flash Family FPGAs Features and Benefits Low Power High-Temperature AEC-Q100–Qualified Devices • • • Grade 2 105°C TA 115°C TJ Grade 1 125°C TA (135°C TJ) PPAP Documentation |
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AEC-Q100 130-nm, 64-Bit A3P1000 IO181RSB2 IO178RSB2 IO175RSB2 IO169RSB2 IO166RSB2 IO160RSB2 | |
A3P600
Abstract: A3P060 A3P1000 A3P125 A3P250 AECQ100 AEC-Q100 FG144 FG256 FG484
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AEC-Q100 A3P600 A3P060 A3P1000 A3P125 A3P250 AECQ100 FG144 FG256 FG484 | |
PBIT2119
Abstract: MTBF fit IGBT 1200 powerbox
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ES-08902 ES-28027 SE-646 PBIT2119 MTBF fit IGBT 1200 powerbox | |
DSP5600X
Abstract: DSP16xx DSP561xx Motorola Base Station Architecture of TMS320C54X VLIW architecture ADSP-2100 NM6403 ATI 7500
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ADSP-2100 ADSP-21 csp01 16-bit TMS320C8x NM6403 32-bit DSP5600X DSP16xx DSP561xx Motorola Base Station Architecture of TMS320C54X VLIW architecture ADSP-2100 NM6403 ATI 7500 | |
HM-6564-5
Abstract: HM-6504 HM-6564 HM-6564-9 hmb6 M6564
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HM-6564 280mW/MHz 350ns HM-6564-5 HM-6564-9. HM-6504 HM-6564-5 HM-6504 HM-6564 HM-6564-9 hmb6 M6564 | |
A3P600
Abstract: A3P060 A3P1000 A3P125 A3P250 AECQ100 AEC-Q100 FG144 FG256 FG484
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AEC-Q100 Repr00 A3P600 A3P060 A3P1000 A3P125 A3P250 AECQ100 FG144 FG256 FG484 | |
Ultrasonic amplifier schematic circuit
Abstract: TLV2322 TLV2332 TLV2332ID TLV2332IDR TLV2332IP TLV2332IPWLE TLV2332Y TLV23321
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TLV2332I, TLV2332Y SLOS112- TLV2332 d01s3Ã SLOS112-MAY 6Tbl724 00TS354 Ultrasonic amplifier schematic circuit TLV2322 TLV2332ID TLV2332IDR TLV2332IP TLV2332IPWLE TLV23321 | |
Contextual Info: Revision 1 Automotive ProASIC3 Flash Family FPGAs Features and Benefits Low Power • 1.5 V Core Voltage • Support for 1.5-V-Only Systems • Low-Impedance Flash Switches High-Temperature AEC-Q100–Qualified Devices • Grade 2 105°C TA 115°C TJ |
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AEC-Q100 | |
1117 L
Abstract: soc 1044
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AEC-Q100 1117 L soc 1044 | |
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Contextual Info: Revision 3 Automotive ProASIC3 Flash Family FPGAs Features and Benefits Low Power • 1.5 V Core Voltage • Support for 1.5-V-Only Systems • Low-Impedance Flash Switches Extended Temperature AEC-Q100–Qualified Devices • Grade 2: –40°C to 105°C TA 115°C TJ |
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AEC-Q100â | |
ProASIC3 Flash FamilyContextual Info: Revision 5 Automotive ProASIC3 Flash Family FPGAs Features and Benefits Low Power • 1.5 V Core Voltage • Support for 1.5-V-Only Systems • Low-Impedance Flash Switches Extended Temperature AEC-Q100–Qualified Devices • Grade 2: –40°C to 105°C TA 115°C TJ |
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AEC-Q100 ProASIC3 Flash Family | |
Contextual Info: Gla ss-to -m e ta l s e a l hermetic connectors military qpl and commercial connectors for harsh environment air-tight-seal applications APRIL 2013 mission critical high pressure hermetics Resolve gas, moisture, and particle ingress problems with advanced performance glasssealed hermetic connectors—the world’s |
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Mil-DTL-38999 MIL-DTL-24308 1X10-7 1X10-10 comp100 | |
E1061Contextual Info: 25 E984J Print Bohrplan Bestückungsseite PCB-Layout conponen t side 18,3 E720J 2,7 E1061 Frontplattenausschnitt ( Rückseite) Panel cut out ( rear side) p p r .R f.6 i nin, Einbauabstand nin, assembling distance 23 [,906] hi W e rk s to ff' M a s s s ta b ' |
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E984J E720J E1061 FL-9494 E1061 | |
Contextual Info: HM-6564 ¡2 HARRIS 8K x 8, 16K x 4 CMOS RAM Features Pinout • Low Pow er S ta n d b y . 4m W M axim um TO P VIEW • Low P ow er O p e ra tio n .2 8 0 m W /M H z M axim um |
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HM-6564 350ns 64x64 | |
11791
Abstract: si117
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70/iV 250pA 85kHz LT1178/LT1179 LT1178 LT1179 14-pin 150mV LT1078/LT1079 11791 si117 | |
74f574d
Abstract: 74F574DW
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DD1M20D M74F574P L--50pF 74f574d 74F574DW | |
2137J
Abstract: RXSG1 power integrations Application Note an-11
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HFA3824A HFA3824A HFA3724/6 2137J RXSG1 power integrations Application Note an-11 | |
TA 2119 AF
Abstract: 1N3064 1N916
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7413A/67413 7413A 35-MHz 25-MHz 1N916 1N3064. TA 2119 AF 1N3064 | |
capacitor electrolytic nichiconContextual Info: HIP6005B in t e r r ii D a ta S h e e t F e b ru a ry 1 999 Buck Pulse-Width Modulator PWM Controller and Output Voltage Monitor The H IP6005B provides complete control and protection for a D C-D C converter optimized for high-performance F ile N u m b e r |
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HIP6005B IP6005B IP6005B 1000jiF BR2535CTL RFP70N03. T60-52; 17AWG. capacitor electrolytic nichicon |