T3D 14 Search Results

T3D 65 diode

Abstract: t3d diode
Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 0603 Package Chip LED 0.2mm Height 19-219/T3D-AQ2R2TY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow

T3D 65 diode

Abstract: smd code t03 12-21/T3D-AQ2S2M/2C
Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet Chip LED with Right Angle Lens 12-21/T3D-AQ2S2M/2C Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow

T3D 55

Abstract: Diode T3D Diode T3D 55 T3D 55 diode T3D 70 diode dse16
Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 0402 Package Chip LED 0.35mm Height 16-216/T3D-AQ1R2TY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow

t3d diode

Abstract: T3D 70 diode t3d 68 T3D 76 diode T3D W01 SMD T3D-AQ2R2TY SMD w01 T3D 28 diode t3d 68 diode
Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 0603 Package Chip LED 0.2mm Height 19-219/T3D-AQ2R2TY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow

Diode T3D

Abstract: t3d diode smd code W01 T3D 28 diode T3D 6 W01 SMD
Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 0402 Package Chip LED 0.35mm Height 16-216/T3D-AQ1R2TY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow

Contextual Info: Technical Data Sheet 0402 Package Chip LED 0.35mm Height 16-216/T3D-AQ1R2TY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type.

T3D 70 diode

Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 1206 Package Chip LED with Inner Lens 11-21/T3D-AQ1R1QY/2T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow

Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet Chip LED with Right Angle Lens 12-21/T3D-AQ2S2M/2C Features Package in 8mm tape on 7 diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process.

T3D 21 diode

Abstract: T3D 76 Diode T3D Diode T3D 57 T3D 70 diode
Contextual Info: Technical Data Sheet Chip LED with Right Angle Resin 27-21/T3D-AP2Q2HY/3C Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type.

Contextual Info: Technical Data Sheet 0603 Package Chip LED 0.2mm Height 19-219/T3D-AQ2R2TY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type.

Contextual Info: Technical Data Sheet Chip LED with Right Angle Resin 27-21/T3D-AP2Q2HY/3C Features Package in 8mm tape on 7 diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. Mono-color type. Pb-free.

16216

Abstract: 16-216
Contextual Info: SMD • B 16-216/T3D-AQ1R2TY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS

1N914

Contextual Info: T3D J> • ALLEGRO MICROSYSTEMS INC D50433fl 00037^5 0 ■ ALGR PROCESS TTU Process TTU High-Speed Switching Diode A gold-doped silicon epitaxial diode used primarily in high-speed switching applications, Process TTU, with its P-type substrate, is the N P counterpart of PN

Contextual Info: SMD • B 16-219A/T3D-AR2T1QY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version.

Contextual Info: SMD ƒ B 19-219/T3D-AQ2R2TY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version.

indium gallium arsenide phosphide

Abstract: 090Q PREAMPLIFIER TRANSIMPEDANCE optic fet C30617 C30986-010 C30986-090QC-01 C30986-350 35XL 30306 3008D2
Contextual Info: E 6 & 6 / C A N A D A / O P T OELEK I t C / € l 3030bl0 000ülb3 ID T3D * C A N A InGaAs Photodiodes C30986 Series DATA SHEET Optics For Detection of 1000 to 1700 nm Radiation Transimpedance Preamplifier Modules With or Without Integral Fiber Optic Pigtails

Contextual Info: b5E D TOKO AMERICA/ SIGNAL SIGNAL PROCESSING TECHNOLOGIES flEMÖTl? DDÜB2SÖ T3D « S P T SPT78 I O 10-BIT, 20 MSPS, ECL OUTPUT A/D CONVERTER FEATURES APPLICATIONS • • • • • • • • • • • • • Monolithic 20 MSPS Converter On-Chip Track/Hold

t3d 66

Abstract: T3D 22, ts 3110 TRANSISTOR T3D 55 T3D 85 T3d 22 T3D 65 T3D 45 t3d 18 2N3906
Contextual Info: A L L E GR O M I C R O S Y S T E M S INC T3D D • 0 S Q 4 3 3 A D D D 3 7 1 7 2 ■ ALGR PROCESS SMN Process SMN PNP High-Speed Switching Transistor Process SM N is a P N P double-diffused silicon epi­ taxial planar transistor with gold diffusion. It is pri­

LTN243R-10

Abstract: LXL242-G DDS7153 LTN243F-10 LTN243R-50 Philips LCD circuit TI SR 51 2 DISPLAY LTN243 LCD Display 40 pin
Contextual Info: PHILIPS INTERNATIONAL bDE D • 7110flBb DD57152 T3D IPH IN P h ilip s C o m p o n e n ts LTN243 D a ta s h e e t s ta tu s P ro d u c t s p e c ific a tio n d a te of iss u e July 1990 Liquid crystal display M ODULE DESCRIPTION Q UICK REFERENCE DATA O utline dim ensions

T3D+53

Abstract: t3d 05 T3D 53
Contextual Info: SPRAGUE/SEMICOND GR OU P T3 85 14 01 9 SPRAGUE. D • 0513050 OGGBSTfl T ■ S E M I C O N D S / ICS D 93D 03598 PLASTIC-CASE BIPOLAR TRANSISTORS PNP Transistors ‘MPS’ Device Types ELECTRICAL CHARACTERISTICS atTA = 25°C DC Current Gain IcBO Device Type

T3D DIODE

Abstract: T3D 36 diode T3D 43 diode T3D 28 DIODE Diode T3D 24 Diode T3D 44 T3D 34 diode Kodak KAI 2000 T3D 21 diode T3D 37 DIODE
Contextual Info: Performance Specification KAI-2093M KAI - 2093M 1920 H x 1080 (V) Pixel Megapixel Interline CCD Image Sensor Performance Specification Eastman Kodak Company Image Sensor Solutions Rochester, New York 14650-2010 Revision 2 February 11, 2002 Eastman Kodak Company – Image Sensor Solutions

T3D DIODE

Abstract: T3D 45 diode diode T3D diode T3D 25 T3D 40 DIODE Diode T3D 08 T3D 18 diode T3D 77 diode Diode T3D 30 Diode T3D 35
Contextual Info: S P RAG UE /S EM IC ON D GROUP 8 5 14019 SPRAGUE, D • S E M I C O N D S / ICS 0513550 0003b27 S 93 D 0 3 6 2 7 SMALL-OUTLINE DIODES i ‘TMPD’ General-Purpose and Low-Leakage Diodes ELECTRICAL CHARACTERISTICS at TA = 25°C VF Device Type »rr Max. ns

T3D 24

Abstract: T3D 05 T3D 45 Sn10Pb88Ag2 333 1kv T3D 30 T3D+45 T3D+53
Contextual Info: www.amccaps.com High Temperature Radial Leaded Capacitors Key Features • • • • • For Use at Temperatures Up to 200°C Rated Working Voltages from 25V to 4KV Rugged Premolded Case with Hi-Temp Epoxy Fill Compact MLC Designs Utilizing Military Grade Ceramics

Contextual Info: www.amccaps.com HIGH TEMPERATURE RADIAL LEADED CAPACITORS KEY FEATURES • • • • • For Use at Temperatures Up to 200°C Rated Working Voltages from 25V to 4KV Rugged Premolded Case with Hi-Temp Epoxy Fill Compact MLC Designs Utilizing Military Grade Ceramics