T3181 Search Results

Contextual Info: DATE REV ECN APP’D. BY 1/23/06 A2 7454 JM 3/1/06 A3 7521 JM 6/2 3/06 A4 7663 JM -.4 55 [11.56] M A X-.6 50 [16.51] MAX 125 T3181 + '°20 .125 L-5.1ÖJ _ 010 [[0'51] 0 25] B B .125 [3.175] 2 NOTES: .100 [2.54] ( 2 )— 1. CONNECTOR MATERIALS: .050 [1.27] (3)

ss-6546-nf

Abstract: by123
Contextual Info: .650 [16.51] DATE REV ECN APP'D. BY 1/23/06 A2 7454 JM 6/23/06 A3 7663 JM r 125 T3181 + '020 [0'51] LJ-18J -.010 [0.25] B B -.251 [6.38] -.125 [3.175] 2 NOTES: .100 [2.54] (2) 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS: COPPER ALLOY

Contextual Info: -.6 35 [16.13] MAX — DATE REV ECN APP’D. BY 1 /2 3 /0 6 A2 7454 JM 6 /2 3 /0 6 A3 7663 JM 6 /8 /1 2 A4 9501 SMN 125 T3181 + ' 020 [a 5 1 ] -1" LJ' 1ÖJ -.0 1 0 [0.25] 650 [16.51] M AX- .535 [13.59] MAX - . 1 2 5 [3.18] rf? T B 4+ ° LO LO y—p STEWART

Contextual Info: -.635 [16.13] MAX- DATE REV ECN APP’D. BY 1/23/06 A2 7454 JM 6/23/06 A3 7663 JM 125 T3181 + '020 i 0'51] - 125 [3' 18] -.010 [0.25] 650 [16.51] MAX- .535 [13.59] MAX -.125 [3.18] T w B B m Ln y—p STEWART r n I H i IL U PATENTED .251 [6.38] 3 o S. .050 [1.27] —

80C51

Abstract: P80CE558 P80CE558EBB P80CE558EFB P83CE558 P89CE558 QFP80
Contextual Info: Philips Sem iconductors Prelim inary specification Single-chip 8-bit microcontroller 1. P83CE558/P80CE558/P89CE558 FEATURES • 80C51 central processing unit • 32 K X 8 ROM respectively FEEPROM Flash-EEPROM , expandable externally to 64 Kbytes • ROM /FEEPROM Code protection

tda 2032

Abstract: APC UPS CIRCUIT DIAGRAM rs 1500 APC UPS WIRING DIAGRAM "APC 1500" UPS CIRCUIT DIAGRAM ha 13627 80C51 P80CE598 P80CE598FFB P83CE598 P87CE598
Contextual Info: 1 IN TEG R A TED C IR C U ITS P8XCE598 8-bit microcontroller with on-chip CAN Product specification S upersedes data of A ugust 1993 File under Integrated C ircuits, IC20 January 1995 Philips Semiconductors PHILIPS • 7 1 1 0 OOf i bf i l S £ 3 6 ■ This Material Copyrighted By Its Respective Manufacturer

Contextual Info: DATE REV ECN APP'D. BY 1 -2 7 -0 3 A2 5801 TRM 1 1 -1 8 -0 5 A3 7387 TRM 1 -1 6 -0 6 A4 7436 JM 3 -2 0 -0 6 A5 7548 TRM B t í P.C.B. RECOMMENDED HOLE LAYOUT SEEN FROM COMPONENT SIDE ALL CENTERLINE DIMENSIONS ARE BASIC. <5=1 NOTES: — .650 [16.51] M A X-

Contextual Info: DATE — REV ECN APP'D. BY 1 -3 1 -0 6 AO - - 3 -2 1 -0 6 A1 7548 TRM .100 [2.54] TYP. 050 [1.27] TYP. .050 [1.27]— — 1.035 [0.89] ±.003 [0.08] 8 — 0.006 [0.15] PIN #1 • .128 [3.25] .125 [3.18] t í $ -e (2) 0.006 [0.15] B .450 [11.43] P.C.B. RECOMMENDED HOLE LAYOUT

Contextual Info: DATE REV ECN 2/1/06 A2 7456 JM 12 -2 8 -1 0 A3 9110 TRM APP’D. BY 448 [11.38] B B .135 [3.43] 2 - h 503 [12.78] MAX NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA