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54121-105051100LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch. |
PDF
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54111-405051000LF
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|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch. |
PDF
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|
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54111-405051250LF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch. |
PDF
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59112-R30-05-051LF
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Amphenol Communications Solutions
|
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions. |
PDF
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JM38510/05051BCA
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Texas Instruments
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CMOS Quad 2-Input NAND Gate 14-CDIP -55 to 125 |
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