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    T1LF-05051 Search Results

    T1LF-05051 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54121-105051100LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch. PDF
    54111-405051250LF
    Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch. PDF
    54111-405051000LF
    Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch. PDF
    59112-R30-05-051LF
    Amphenol Communications Solutions Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions. PDF
    20021211-00010T1LF
    Amphenol Communications Solutions Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 10 Positions, 1.27 mm (.050in) Pitch. PDF