SURFACE MOUNT HTCC Search Results

K612

Abstract: underfill FR4 epoxy dielectric constant 3.2 Dielectric Constant Silicon Nitride K810 FR4 substrate height and thickness ltcc chip fine line bga thermal cycling reliability
Contextual Info: Bourns Microelectronic Modules Packaging Solutions Device Mounting Technology Surface Mount Technology Surface mounting is still the most common and economical approach for many applications. Bourns® Microelectronic Module products offer the latest in surface mount technology:

Contextual Info: RF Components 1 FSMS0210D1, Module Spec • Scope • This specification applies to the intermediate filter for CDMA systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA systems. Ceramic base material HTCC for Surface Mount Technology (SMD).

Contextual Info: RF Components 1 FSMS0210D6, Module Spec • Scope • This specification applies to the intermediate filter for CDMA systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA systems. Ceramic base material HTCC for Surface Mount Technology (SMD).

Contextual Info: RF Components 1 FSRS1575B2, Module Spec • Scope • This specification applies to the low loss GPS Rx filter. ■ Features • • • Low loss Rx filter for GPS systems. Ceramic base material HTCC for Surface Mount Technology (SMD). Reliable Performance.

8904C-F delta

Abstract: S0183C1 20/8904C-F delta max 1786 smd FSMS0183C1 smd marking m4
Contextual Info: RF Components 1 FSMS0183C1, Module Spec • Scope • This specification applies to the intermediate filter for CDMA systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA systems. Ceramic base material HTCC for Surface Mount Technology (SMD).

FSMS0085G4

Abstract: smd marking m4 S0085G
Contextual Info: RF Components 1 FSMS0085G4, Module Spec • Scope • This specification applies to the intermediate filter for CDMA Cellular systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA (Cellular) systems. Ceramic base material (HTCC) for Surface Mount Technology (SMD).

s0085g2

Abstract: FSMS0085G2 marking smd m7 S0085G 40938 CE5C J-54 MAX 8038 lg 8838
Contextual Info: RF Components 1 FSMS0085G2, Module Spec • Scope • This specification applies to the intermediate filter for CDMA Cellular systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA (Cellular) systems. Ceramic base material (HTCC) for Surface Mount Technology (SMD).

S0085F6

Contextual Info: RF Components 1 FSMS0085F6, Module Spec • Scope • This specification applies to the intermediate filter for CDMA Cellular systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA (Cellular) systems. Ceramic base material (HTCC) for Surface Mount Technology (SMD).

Contextual Info: RF Components 1 FSRS0836H1, Module Spec • Scope • This specification applies to the low loss Tx filter for Cellular AMPS/CDMA systems. ■ Features • • • Low loss Tx filter for mobile telephone CDMA / AMPS systems. Ceramic base material (HTCC) for Surface Mount Technology (SMD).

baw 62 ph

Abstract: saw 881.5mhz
Contextual Info: RF Components 1 FSRS0881H1, Module Spec • Scope • This specification applies to the low loss Rx filter for Cellular AMPS/CDMA systems. ■ Features • • • Low loss Rx filter for mobile telephone CDMA / AMPS systems. Ceramic base material (HTCC) for Surface Mount Technology (SMD).

smd transistor marking 12W

Abstract: 15j 3kv Carbon Layer resistor 0.5W 2410 smd fuse 1.5A SMD resistors 1K ohm - 0.25W 1 1206 AEC Make Ceramic disc Capacitor datasheet glass transponder chip bussed resistors 100 ohm - 0.25W per element MARKING WF smd sot23 AEC-Q200 BEADS FILTER
Contextual Info: Leaded Resistors Surface Mount Resistors The industryʼs broadest line of leaded resistors and networks includes designs with various material composition and structure for use in general purpose, precision, anti-surge, high voltage, high resistance applications.

5BA DIODE

Contextual Info: SiC SCHOTTKY DIODE SML01SC06D3A/SML01SC06D3B • • • • • • • Low Leakage Fast Switching Low Forward Voltage Hermetic Ceramic Surface Mount Package Suitable for general purpose, switching applications. Space Level and High-Reliability Screening Options Available

Contextual Info: SiC SCHOTTKY DIODE SML02SC06D3A/SML02SC06D3B • • • • • • • Low Leakage Fast Switching Low Forward Voltage Hermetic Ceramic Surface Mount Package Suitable for general purpose, switching applications. Space Level and High-Reliability Screening Options Available

Contextual Info: ULTRA FAST RECOVERY POWER RECTIFIER 1N5809D3A / 1N5809D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package† • Ultra Fast Reverse Recovery • Switching Power Supply Applications

LE17

Abstract: MIL-PRF19500 QR217
Contextual Info: ULTRA FAST RECOVERY POWER RECTIFIER 1N5809D3A / 1N5809D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package† • Ultra Fast Reverse Recovery • Switching Power Supply Applications

D-5B layout

Abstract: MELF pad layout D5B type diode QR217 1N4954US 1N5811US LE17 MIL-PRF19500 melf diode marking 1N5811D3B-JQRS
Contextual Info: DIODE LEADLESS CHIP CARRIER DLCC3 • Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “MELF-5.7 D-5B ” / “E-MELF” packages† • Designed For High Reliability Military, Aerospace and Space Applications

LE17

Abstract: MIL-PRF19500 QR217 e-MELF
Contextual Info: ULTRA FAST RECOVERY POWER RECTIFIER 1N5811D3A / 1N5811D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package† • Ultra Fast Reverse Recovery • Switching Power Supply Applications

D-5B layout

Abstract: LE17 MIL-PRF19500 QR217 marking D3B e-MELF
Contextual Info: ULTRA FAST RECOVERY POWER RECTIFIER 1N5811D3A / 1N5811D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package† • Ultra Fast Reverse Recovery • Switching Power Supply Applications

DIODE marking 5ba

Contextual Info: POWER RECTIFIER DIODE 1N5550D3A / 1N5550D3B • VBR = 220V, IF = 5A, Standard Reverse Recovery Rectifier Diode • Light Weight Hermetic Ceramic Surface Mount Package Designed as a Drop In Replacement for “D-5B” / “E-MELF” Package† • Switching Power Supply Applications

D-5B layout

Abstract: LE17 MIL-PRF19500 QR217 8814 "Power rectifier Diode"
Contextual Info: POWER RECTIFIER DIODE 1N5550D3A / 1N5550D3B • VBR = 220V, IF = 5A, Standard Reverse Recovery Rectifier Diode • Light Weight Hermetic Ceramic Surface Mount Package Designed as a Drop In Replacement for “D-5B” / “E-MELF” Package† • Switching Power Supply Applications

"Power rectifier Diode"

Abstract: power rectifier diode D-5B layout LE17 MIL-PRF19500 QR217 1N5551D3A 1n5551d3
Contextual Info: POWER RECTIFIER DIODE 1N5551D3A / 1N5551D3B • VBR = 440V, IF = 5A, Standard Reverse Recovery Rectifier Diode • Light Weight Hermetic Ceramic Surface Mount Package Designed as a Drop In Replacement for “D-5B” / “E-MELF” Package† • Switching Power Supply Applications

Contextual Info: ULTRA FAST RECOVERY POWER RECTIFIER 1N6627D3A / 1N6627D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package. • High forward current surge current capability. • Switching power supplies or other applications requiring

LE17

Abstract: MIL-PRF19500 QR217 1N6627 D5B type diode D-5B layout
Contextual Info: ULTRA FAST RECOVERY POWER RECTIFIER 1N6627D3A / 1N6627D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package. • High forward current surge current capability. • Switching power supplies or other applications requiring

Contextual Info: SiC SCHOTTKY DIODE SML05SC06D3A / SML05SC06D3B • VR max = 600V • IF(avg) = 5A • VF(typ) = 1.5V • DLCC3 Hermetic Ceramic Surface Mount Package Designed as a Drop In Replacement for “D-5B”/ “E-MELF” Package † No Reverse Recovery No Forward Recovery