SURFACE MOUNT ASSEMBLY INSTRUCTION Search Results

BGA PACKAGE TOP MARK

Abstract: socket
Contextual Info: GHZ BGA Probe Adapter surface mount Assembly Instructions 1. Reflow Socket Base assembly to the target PCB (as per BGA surface mount foot soldering instructions). 2. Place the square piece of elastomer provided into the socket base (rotation and orientation as shown).

Contextual Info: GHZ BGA Probe Adapter surface mount Assembly Instructions 1. Reflow Socket Base assembly to the target PCB (as per BGA surface mount foot soldering instructions). 2. Place the square piece of elastomer provided into the socket base (rotation and 'side up' orientation are not critical).

BGA PACKAGE TOP MARK

Contextual Info: GHZ BGA Probe Adapter surface mount Assembly Instructions 1. Reflow Socket Base assembly to the target PCB (as per BGA surface mount foot soldering instructions). 2. Place the square piece of elastomer provided into the socket base (Note orientation mark on the socket base and the elastomer).

EIA-364-20

Contextual Info: Product Specification 108-1163-7 11Mar11 Rev B Inverted Six and Eight Position Surface Mount Shielded Modular Jack Assembly 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the TE Connectivity TE inverted six and eight position surface mount shielded modular jack assembly.

MIL-C-55302

Abstract: GLCP-30 GLCP-30F MIL-M-24519 530719-7 1-530744-9 1-530744-4 mil-m-24519 GLCP-30F
Contextual Info: Products for Surface Mount Assembly Catalog 65230 • Surface Mount Revised 11-95 Surface Mini-Box Pin Header Assemblies .050 [1.27] Centerline Board-to-Board Connectors M ount Box Contact Connectors Continued CD-ROM „Max. Style I Straddle M ount without

8 NARROW SO

Abstract: electronic assembly tape PLCC-20 PLCC-28 SO8 NARROW SO24 wide bar code component 16 Narrow SO
Contextual Info: Surface Mount Tape and Reel Specification General Description Tape-and-Reel is a method for shipment of surface mount devices. This approach simplifies the handling of semiconductors for automated circuit board assembly systems. A Tape-and-Reel holds hundreds-to-thousands of surface

national semiconductor pb-free suffix

Abstract: SB70A SQA40b TS5B-24 LM431ACM3X IEC 384 14 250 volts LM2734XMK UFBGA 176 datasheet M08A M14A
Contextual Info: Surface Mount - Tape & Reel • General Description Tape-and-Reel is one of the primary methods for shipping surface mount devices. This system simplifies the handling of semiconductors for automated circuit board assembly systems. Tape-and-Reel holds hundreds-to-thousands of surface mount devices so that pick-and-place machines have to

GDZ3V9LP3

Contextual Info: GDZ3V9LP3 - GDZ8V2LP3 ADVANCE INFORMATION ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • Ultra-Small Leadless Surface Mount Package 0.6 x 0.3mm   Ultra-Low Profile Package (0.3mm)   Ideally Suited for Automated Assembly Processes

Contextual Info: DDTC114ELP PRE-BIASED R1 = R2 SMALL SIGNAL SURFACE MOUNT 100mA NPN TRANSISTOR Features Mechanical Data • • • • • • • • Epitaxial Planar Die Construction Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes

Contextual Info: UDZ3V6B-UDZ15B SURFACE MOUNT PRECISION ZENER DIODE Features Mechanical Data • Small, Surface Mount Package  Case: SOD323  Ideally suited for Automated Assembly Processes  Case Material: UL Flammability Classification Rating 94V-0  Very Sharp Breakdown Characteristics

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • Planar Die Construction Small Surface Mount Package Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2

Contextual Info: DDTC114ELP PRE-BIASED R1 = R2 SMALL SIGNAL SURFACE MOUNT 100mA NPN TRANSISTOR Features Mechanical Data • • • • • • • • Epitaxial Planar Die Construction Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes

DDZ9689T

Contextual Info: DDZ9689T - DDZ9717T SURFACE MOUNT PRECISION ZENER DIODE Features Mechanical Data • • • • • • • • • Ultra-Small Surface Mount Package Very Sharp Breakdown Characteristics Very Tight Tolerance on VZ Ideally Suited for Automated Assembly Processes

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • Planar Die Construction Small Surface Mount Package Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2

c2v0

Abstract: WH 94V0 t G Zener diode sod323
Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • Planar Die Construction Ultra-Small Surface Mount Package Ideally Suited for Automated Assembly Processes Lead, Halogen and Antimony Free, RoHS Compliant Note 1

Contextual Info: DDTCxxxxLP R1≠R2 Series PRE-BIASED SMALL SIGNAL SURFACE MOUNT 100mA NPN TRANSISTOR Mechanical Data Features • • • • • • • • Epitaxial Planar Die Construction Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes

BZT52C3V9LP

Contextual Info: BZT52C2V4LP - BZT52C39LP SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Lead Free By Design/RoHS Compliant Note 1 "Green" Device (Note 2)

Contextual Info: MMBZ5221BTS - MMBZ5259BTS TRIPLE SURFACE MOUNT ZENER DIODE ARRAY Features Mechanical Data • Three Isolated Zeners in Ultra-Small Surface Mount Package   Ideally Suited for Automated Assembly Processes   Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2

Contextual Info: MMBZ5221BW - MMBZ5259BW 200mW SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • • Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally Suited for Automated Assembly Processes Lead Free/RoHS Compliant Note 2

LMV240

Abstract: national semiconductor pb-free suffix DS90C2501SLB LM431ACM3X DSP-92 TS5B-24 LM3351MM LM3351MMX M08A M14A
Contextual Info: Surface Mount - Tape & Reel General Description Tape-and-Reel is one of the primary methods for shipping surface mount devices. This system simplifies the handling of semiconductors for automated circuit board assembly systems. Tape-and-Reel holds hundreds-to-thousands of

DDZ9689T

Contextual Info: DDZ9689T - DDZ9717T SURFACE MOUNT ZENER DIODE Features Mechanical Data • Small, Low Profile Surface Mount Package • • Very Sharp Breakdown Characteristics • • Ideally Suited for Automated Assembly Processes Case: SOD523 Case Material: Molded Plastic, “Green” Molding Compound. UL

Contextual Info: TPD6V8LP 85W SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR Features • • • • • • • Mechanical Data • • Planar Die Construction Ultra-Small Leadless Surface Mount Package Unidirectional Ideally Suited for Automated Assembly Processes Lead Free By Design/RoHS Compliant Note 1

Contextual Info: TPD6V8LP SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR Features • • • • • • • Mechanical Data • • Planar Die Construction Ultra-Small Leadless Surface Mount Package Unidirectional Ideally Suited for Automated Assembly Processes Lead Free By Design/RoHS Compliant Note 1

umc4n

Contextual Info: UMC4N DUAL COMPLEMENTARY PRE-BIASED TRANSISTORS Features Mechanical Data • • • • • • • • • • Ultra-Small Surface Mount Package Epitaxial Planar Die Construction Surface Mount Package Suited for Automated Assembly Simplifies Circuit Design and Reduces Board Space