DS30093 Search Results

Contextual Info: BZT52C2V7S - BZT52C39S SURFACE MOUNT ZENER DIODE Features • • • • Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally suited for Automated Assembly Processes -HEh- -H Î J □ A B Mechanical Data_ • •

diode marking w8

Abstract: DIODE WJ SOD323
Contextual Info: BZT52C2V4S - BZT52C39S NEW PRODUCT SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally suited for Automated Assembly Processes E D A B Mechanical Data · · · · · G Case: SOD-323, Plastic

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0S BZT52C2V4S BZT52C2V7S BZT52C3V0S BZT52C3V3S BZT52C3V6S BZT52C3V9S BZT52C4V3S BZT52C4V7S BZT52C5V1S BZT52C5V6S BZT52C6V2S BZT52C6V8S BZT52C7V5S BZT52C8V2S BZT52C9V1S BZT52C10S BZT52C11S BZT52C12S BZT52C13S BZT52C15S BZT52C16S

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • Planar Die Construction Small Surface Mount Package Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2

Contextual Info: BZT52C2V0S - BZT52C39S Lead-free SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0S BZT52C2V4S BZT52C2V7S BZT52C3V0S BZT52C3V3S BZT52C3V6S BZT52C3V9S BZT52C4V3S BZT52C4V7S BZT52C5V1S BZT52C5V6S BZT52C6V2S BZT52C6V8S BZT52C7V5S BZT52C8V2S BZT52C9V1S BZT52C10S BZT52C11S BZT52C12S BZT52C13S BZT52C15S BZT52C16S

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • Planar Die Construction Small Surface Mount Package Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2

BZT52-C9V1S

Contextual Info: NEW PRODUCT BZT52C2V4S - BZT52C39S SURFACE MOUNT ZENER DIODE POWER SEMICONDUCTOR Features • • • • Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally suited for Automated Assembly Processes E D A B Mechanical Data •

BZT52C15S

Contextual Info: PRELIMINARY BZT52C2V7S - BZT52C39S SURFACE MOUNT ZENER DIODE POWER SEMICONDUCTOR Features • • • • Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally suited for Automated Assembly Processes E D A B Mechanical Data •

BZT52C2V0S

Abstract: BZT52C2V4S BZT52C2V7S BZT52C39S BZT52C3V0S BZT52C3V3S J-STD-020A
Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features • · · Planar Die Construction Ultra-Small Surface Mount Package Ideally suited for Automated Assembly Processes SOD-323 Mechanical Data · · · · · · · Case: SOD-323, Plastic Case material - UL Flammability Rating

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features • · · Planar Die Construction Ultra-Small Surface Mount Package Ideally suited for Automated Assembly Processes Mechanical Data · · · · · · SOD-323 D H Case: SOD-323, Plastic Case material - UL Flammability Rating

Contextual Info: BZT52C2V4S - BZT52C39S NEW PRODUCT SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally suited for Automated Assembly Processes E D A B Mechanical Data · · · · · G Case: SOD-323, Plastic

Zener Diode LF marking

Abstract: marking code zener diode wl marking WM diode zener WL diode cathode marking code 7-7-7-7 BZT52C2V4S BZT52C2V7S BZT52C39S DIODE WJ SOD323 BZT52C3V3S
Contextual Info: BZT52C2V4S - BZT52C39S SURFACE MOUNT ZENER DIODE Features • • • • Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally suited for Automated Assembly Processes • • • Case: SOD-323, Plastic Terminals: Solderable per MIL-STD-202,

BZT52C27S

Abstract: BZT52C4V3S
Contextual Info: BZT52C2V4S - BZT52C39S NEW PRODUCT SURFACE MOUNT ZENER DIODE Features • · · Planar Die Construction Ultra-Small Surface Mount Package Ideally suited for Automated Assembly Processes E D A B Mechanical Data · · · · · G Case: SOD-323, Plastic Terminals: Solderable per MIL-STD-202,

wk 2 94v-0

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features • • • • • Planar Die Construction Ultra-Small Surface Mount Package Ideally suited for Automated Assembly Processes Lead Free/RoHS Compliant Note 3 Qualified to AEC-Q101 Standards for High Reliability

marking code zener diode wl

Abstract: marking WM wk marking diode diode marking w8 marking code w6 marking W6 diode VISHAY WL ZENER zener code wn BZT52C2V7S BZT52C39S
Contextual Info: PRELIMINARY BZT52C2V7S - BZT52C39S VISHAY SURFACE MOUNT ZENER DIODE Ì LITEM ZI POWER SEMICONDUCTOR Features • • • • Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally suited for Automated Assembly Processes H He|^ □

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features • · · Planar Die Construction Ultra-Small Surface Mount Package Ideally suited for Automated Assembly Processes E D A B Mechanical Data · · · · · G Case: SOD-323, Plastic Terminals: Solderable per MIL-STD-202,

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Please click here to visit our online spice models database. Features • • • • • Planar Die Construction Ultra-Small Surface Mount Package Ideally suited for Automated Assembly Processes Lead Free/RoHS Compliant Note 3

c2v0

Abstract: WH 94V0 t G Zener diode sod323
Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • Planar Die Construction Ultra-Small Surface Mount Package Ideally Suited for Automated Assembly Processes Lead, Halogen and Antimony Free, RoHS Compliant Note 1

DIODE marking W4 38

Abstract: BZT52C2V0S
Contextual Info: BZT52C2V0S - BZT52C39S Lead-free SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0S BZT52C2V4S BZT52C2V7S BZT52C3V0S BZT52C3V3S BZT52C3V6S BZT52C3V9S BZT52C4V3S BZT52C4V7S BZT52C5V1S BZT52C5V6S BZT52C6V2S BZT52C6V8S BZT52C7V5S BZT52C8V2S BZT52C9V1S BZT52C10S BZT52C11S BZT52C12S BZT52C13S BZT52C15S BZT52C16S

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE Features • · · Planar Die Construction Ultra-Small Surface Mount Package Ideally suited for Automated Assembly Processes E D A B Mechanical Data · · · · · @ IF = 10mA Power Dissipation Note 1 Thermal Resistance, Junction to Ambient Air (Note 1)

c27 zener diode

Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE SPICE MODEL: BZT52C36S Features • · · Planar Die Construction Ultra-Small Surface Mount Package Ideally suited for Automated Assembly Processes SOD-323 Mechanical Data · · · · · · · Case: SOD-323, Plastic

BZT52C10S

Abstract: diode marking w8 marking WM BZT52C2V0S BZT52C3V0S 4 PC marking W6 diode BZT52C3V6S BZT52C3V9S BZT52C4V3S
Contextual Info: BZT52C2V0S - BZT52C39S SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0S BZT52C2V4S BZT52C2V7S BZT52C3V0S BZT52C3V3S BZT52C3V6S BZT52C3V9S BZT52C4V3S BZT52C4V7S BZT52C5V1S BZT52C5V6S BZT52C6V2S BZT52C6V8S BZT52C7V5S BZT52C8V2S BZT52C9V1S BZT52C10S BZT52C11S BZT52C12S BZT52C13S BZT52C15S BZT52C16S

diode marking code W5

Abstract: BZT52-C2V7S
Contextual Info: ADVANCE INFORMATION BZT52C2V7S - BZT52C39S SURFACE MOUNT ZENER DIODE POWER SEMICONDUCTOR Features • • • • Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally suited for Automated Assembly Processes E D A B Mechanical Data

wm 294

Contextual Info: BZT52C2V0S - BZT52C39S Lead-free SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0S BZT52C2V4S BZT52C2V7S BZT52C3V0S BZT52C3V3S BZT52C3V6S BZT52C3V9S BZT52C4V3S BZT52C4V7S BZT52C5V1S BZT52C5V6S BZT52C6V2S BZT52C6V8S BZT52C7V5S BZT52C8V2S BZT52C9V1S BZT52C10S BZT52C11S BZT52C12S BZT52C13S BZT52C15S BZT52C16S