SOT97 Search Results

Contextual Info: Package outline DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-2 X A B D A E A1 c terminal 1 index area detail X terminal 1 index area e e1 1 6 C C A B C v w b y1 C y L k Eh

DIP8

Abstract: SOT97-1 MO-001 SC-504-8
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline DIP8: plastic dual in-line package; 8 leads 300 mil SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Philips 9708

Abstract: sot248 philips HE 4071 BP T313-2 T-238
Contextual Info: Philips Semiconductors Package outlines OIP8: plastic dual in-line package; 8 leads 300 mil 1 1 • » 5 ■ I SOT97-1 10 mm ■ ■ I ■ » scale DIM ENSIONS (inch dim ensions are derived from the original mm dim ensions) UNIT A max. Ai min. A2 max. b

Contextual Info: Package outline HXSON8: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-1 X B D A E A A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area v w b e 1 4 M M C C A B C y y1 C

Contextual Info: Package outline HXSON16: plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; body 1.35 x 3.3 x 0.5 mm SOT974-1 X B D A E A A1 c terminal 1 index area detail X e1 terminal 1 index area e v w b 1/2 e 1 8 M M C C A B C y y1 C

Contextual Info: Package outline DIP8: plastic dual in-line package; 8 leads 300 mil SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b 5 8 MH b2 pin 1 index E 1 4 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1

SOT97-1

Abstract: SOT-97
Contextual Info: Philips Semiconductors Package outlines DIP8: plastic dual in-line package; 8 leads 300 mil 1995 Feb 04 5-4 SOT97-1

pmfp

Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
Contextual Info: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

Contextual Info: Package outline DIP8: plastic dual in-line package; 8 leads 300 mil SOT97-2 ME seating plane D A2 A A1 L e Z c w b1 (e1) b MH b2 8 5 pin 1 index E 1 4 2.5 5 mm scale Dimensions (inch dimensions are derived from the original dimensions) Unit(1) mm max nom

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXSON16 package SOT974-2 Hx Gx D 0.05 P 0.05 Ay SPy By Gy SPy tot SLy nSPy Hy nSPx SPx SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land

sot979

Contextual Info: Ceramic packages for RF Power Transistors SOT975B L x W x H (mm SOT538A (5.5 x 4.1 x 2.2 (mm) SOT1227A (7.1 x 6.9 x 3.3 (mm) SOT975C (7.1 x 6.9 x 3.3 (mm) (14.0 x 4.1 x 2.9 (mm) SOT1227B SOT467B (9.7 x 5.8 x 4.3 (mm) SOT467C (20.3 x 5.8 x 4.3 (mm)

Contextual Info: Package outline HXSON12: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.35 x 2.5 x 0.5 mm SOT973-1 X B D A E A A1 c terminal 1 index area detail X e1 e terminal 1 index area v w b 1/2 e 1 6 M M C C A B C y y1 C

PHILIPS OQ 0501

Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
Contextual Info: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body

sot267

Contextual Info: Philips Semiconductors Package information Package outlines INDEX VERSION DESCRIPTION NAME PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ; SOT97 593 DIP16 plastic dual in-line package; 16 leads (300 mil); long body

SC-504-8

Abstract: MO-001 050G01 sc5048 SOT97-1
Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP8: plastic dual in-line package; 8 leads 300 mil SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: Philips Semiconductors Package outlines DIP8: plastic dual in-line package; 8 leads 300 mil 1995 Feb 04 3080 SOT97-1

050G01

Abstract: MO-001AN
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline DIP8: plastic dual in-line package; 8 leads 300 mil SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A 3120 optocoupler

Abstract: 3120 8 pin optocoupler OPTOCOUPLER dc t4183e CNS35 sot97f
Contextual Info: b fe > 5 3 ,ì 3 i DEVELOPMENT DATA Q o a a a ? 1! t • CNS35 This data sheet contain» advance Inform ation and specifications ara subject »o change w ith o u t notice. N AMER PHILIPS/DISCRETE SSE D DUAL OPTOCOUPLER The CNS35 is a DUALoptocouplerin a SOT97F dual-in-line D1L 8 pin plastic envelope. Itconsistsof

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXSON12 package SOT973-2 Hx Gx D 0.05 P 0.05 Ay Gy SPy By SPy tot SLy nSPy Hy nSPx SPx SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: HX SO N1 2 SOT973-2 HXSON12U; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering code 12NC ending 115 Rev. 1 — 23 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

Contextual Info: SOT972-2 Standard product orientation 12NC ending 115 Rev. 01 — 28 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT972-2 115 180 x 8

SOT97-1

Contextual Info: Philips Semiconductors Package outlines DIP8: plastic dual in-line package; 8 leads 300 mil 1995 Feb 04 SOT97-1 1

P8563

Abstract: NXP 8563T 8563t PCF8563T PCF8563P 8563S
Contextual Info: PCF8563 Real-time clock/calendar Rev. 10 — 3 April 2012 Product data sheet 1. General description The PCF8563 is a CMOS1 Real-Time Clock RTC and calendar optimized for low power consumption. A programmable clock output, interrupt output, and voltage-low detector are

P82B715 equivalent

Contextual Info: P82B715 I2C-bus extender Rev. 08 — 9 November 2009 Product data sheet 1. General description The P82B715 is a bipolar IC intended for application in I2C-bus and derivative bus systems. While retaining all the operating modes and features of the I2C-bus it permits