SOT97 Search Results
SOT97 Datasheets (9)
NXP Semiconductors
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT972-1 |
|
Plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm | Original | 221.36KB | 1 | ||
| SOT972-2 |
|
Footprint for reflow soldering SOT972-2 | Original | 292.21KB | 1 | ||
| SOT972-2 |
|
Plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals | Original | 338.94KB | 1 | ||
| SOT972-2_115 |
|
Standard product orientation 12NC ending 115 | Original | 87.12KB | 4 | ||
| SOT973-1 |
|
Plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.35 x 2.5 x 0.5 mm | Original | 222.21KB | 1 | ||
| SOT973-2 |
|
Footprint for reflow soldering SOT973-2 | Original | 331.48KB | 1 | ||
| SOT973-2_115 |
|
HXSON12U; Reel pack; SMD, 7"Q1/T1 Standard product orientationOrderable part number ending ,115 or XOrdering code (12NC) ending 115 | Original | 255.68KB | 4 | ||
| SOT974-1 |
|
Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals | Original | 223.47KB | 1 | ||
| SOT974-2 |
|
Footprint for reflow soldering SOT974-2 | Original | 334.8KB | 1 |