| SOT972-1 |
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm |
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Original |
PDF
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| SOT972-2 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT972-2 |
|
Original |
PDF
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| SOT972-2 |
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NXP Semiconductors
|
Plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals |
|
Original |
PDF
|
| SOT972-2_115 |
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NXP Semiconductors
|
Standard product orientation 12NC ending 115 |
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Original |
PDF
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| SOT973-1 |
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NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.35 x 2.5 x 0.5 mm |
|
Original |
PDF
|
| SOT973-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT973-2 |
|
Original |
PDF
|
| SOT973-2_115 |
|
NXP Semiconductors
|
HXSON12U; Reel pack; SMD, 7"Q1/T1 Standard product orientationOrderable part number ending ,115 or XOrdering code (12NC) ending 115 |
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Original |
PDF
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| SOT974-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
|
Original |
PDF
|
| SOT974-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT974-2 |
|
Original |
PDF
|
