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    philips e3

    Abstract: sot877
    Contextual Info: Package outline Philips Semiconductors HLQFN18: plastic thermal enhanced low profile quad flat package; no leads; 18 terminals; body 10 x 8 x 1.4 mm SOT877-1 A D y terminal 1 index area E D2 2x D3 (2×) ZE1 (10×) b (15×) 7 8 9 6 10 5 11 4 12 3 13 2 14


    Original
    HLQFN18: OT877-1 philips e3 sot877 PDF