SOT846 Search Results
SOT846 Datasheets (1)
NXP Semiconductors
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT846-1 |
|
Plastic thermal enhanced ball grid array package; 760 balls; body 40 x 40 x 1.75 mm; heatsink | Original | 320.69KB | 1 |
SOT846 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Package outline HBGA760: plastic thermal enhanced ball grid array package; 760 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT846-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M AJ AG e AE AC |
Original |
hbga760ot846-1 | |
MS-034
Abstract: sot846
|
Original |
hbga760ot846-1ms-034sot846 |