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    sot831

    Contextual Info: Package outline Philips Semiconductors HLQFN30: plastic thermal enhanced low profile quad flat package; no leads; 30 terminals; body 10.1 x 8 x 1.5 mm SOT831-1 A D y terminal 1 index area E ZD1 16x b (19×) b3 D1 (4×) 10 11 12 ZE1 (15×) 13 14 15 9 16


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    HLQFN30: OT831-1 sot831 PDF