SOT83 Search Results

Contextual Info: Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y V T P M K H F D B AJ AG AE e AC heatsink AA W U e2 R N

Contextual Info: Package outline XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4x 2 L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 1 2 mm scale DIMENSIONS (mm are the original dimensions)

sot831

Contextual Info: Package outline Philips Semiconductors HLQFN30: plastic thermal enhanced low profile quad flat package; no leads; 30 terminals; body 10.1 x 8 x 1.5 mm SOT831-1 A D y terminal 1 index area E ZD1 16x b (19×) b3 D1 (4×) 10 11 12 ZE1 (15×) 13 14 15 9 16

SOT833

Abstract: sot833-1 NXP 12NC ending nxp Tape and Reel Information
Contextual Info: SOT833-1 Standard product orientation 12NC ending 115 Rev. 01 — 17 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT833 115 180 x 8

Contextual Info: Package outline LFBGA240: plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 0.95 mm SOT832-1 B D A ball A1 index area A E A2 A1 C e1 e T P M K H F D B detail X y y1 C ∅v M C A B b ∅w M C U R N e L e2 J G E C A ball A1 index area

Contextual Info: Package outline LFBGA167: plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm SOT836-1 B D A ball A1 index area A E A2 A1 detail X C e1 e AF AD AB Y 1/2 e y1 C ∅v M C A B b AE e AC AA V T P M K H F D B W U R e2 N L 1/2 e

Contextual Info: Package outline HLLGA68R: plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 10 x 1.4 mm D SOT838-1 A B land 1 index area E e1 L1 L v w b e 18 M M y1 C C A B C A C y 34 35 17 e e2 Eh 1 land 1 index area 51 68 52

sot834

Abstract: HSOP16F
Contextual Info: PDF: 2003 Oct 22 Philips Semiconductors Package outline HSOP16F: plastic, heatsink small outline package; 16 leads flat SOT834-1 D A E E2 c y X HE v M A D1 e3 (2x) D2 w M bp2 16 12 A2 E1 pin 1 index Q1 detail X 1 11 w M Z bp1 (5×) e1 (2×) e (6×) e2 (4×)

MO-252

Abstract: SOT833 6E-15 SOT-833 sot833-1
Contextual Info: Package outline Philips Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4x 2 L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 1 2 mm scale DIMENSIONS (mm are the original dimensions)

sot832

Abstract: LFBGA240
Contextual Info: PDF: 2003 Oct 22 Philips Semiconductors Package outline LFBGA240: plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 0.95 mm SOT832-1 B D A ball A1 index area A E A2 A1 C e1 e ∅v M b T P M K H F D B detail X ∅w M y y1 C C A B

sot839

Contextual Info: PDF: 2004 Jan 15 Philips Semiconductors Package outline WQCCN32: plastic window quad chip carrier; no leads; 32 terminals; body 8 x 8 x 1.55 mm D D1 SOT839-1 B A A E1 E A1 detail X C e1 v w b e 5 M y y1 C C A B C M 12 L 13 4 e 1 e2 32 29 20 28 21 X 2.5 5 mm

sot836

Contextual Info: PDF: 2003 Oct 20 Philips Semiconductors Package outline LFBGA167: plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm SOT836-1 B D A ball A1 index area A E A2 A1 detail X C e1 e AF AD AB Y 1/2 e ∅v M b ∅w M AE y1 C

sot830

Contextual Info: PDF: 2004 Jan 07 Philips Semiconductors Package outline HTSSON16T: plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; body 5.4 x 3.9 x 1.2 mm SOT830-1 X A B D A c E1 E detail X terminal 1 index area L1 v M C A B

sot838

Contextual Info: PDF: 2004 Feb 19 Philips Semiconductors Package outline HLLGA68: plastic thermal enhanced low profile land grid array package; 68 lands; body 10 x 10 x 1.4 mm D SOT838-1 A B land 1 index area E e1 v w b e L1 18 M M y1 C C A B C A y 34 L C 35 17 e e2 Eh 1 land 1

Contextual Info: SOT833-1 Standard product orientation 12NC ending 115 Rev. 03 — 28 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT833 115 180 x 8

Contextual Info: Package outline HTSSON16TR: plastic thermal enhanced thin shrink small outline package; no leads; 16 terminals; transparent; resin based; body 5.4 x 3.9 x 1.2 mm SOT830-1 X A B D A c E1 E detail X terminal 1 index area L1 b1 v M C A B w M C b v M C A B w M C

MS-034

Abstract: sot835
Contextual Info: PDF: 2003 Nov 21 Philips Semiconductors Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e ∅v M C A B b y1 C y ∅w M C AL

nz104

Contextual Info: 74LVC2G66 Bilateral switch Rev. 7 — 22 June 2012 Product data sheet 1. General description The 74LVC2G66 is a low-power, low-voltage, high-speed Si-gate CMOS device. The 74LVC2G66 provides two single pole, single-throw analog switch functions. Each switch has two input/output terminals nY and nZ and an active HIGH enable input (nE).

MARKING V7 6-PIN

Contextual Info: 74LVC3G14 Triple inverting Schmitt trigger with 5 V tolerant input Rev. 11 — 6 July 2012 Product data sheet 1. General description The 74LVC3G14 provides three inverting buffers with Schmitt trigger input. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

Marking code V7

Contextual Info: 74LVC2G00 Dual 2-input NAND gate Rev. 11 — 22 June 2012 Product data sheet 1. General description The 74LVC2G00 provides a 2-input NAND gate function. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 V and 5 V environment.

JESD22-A114E

Abstract: NX3L1G53GD NX3L1G53GM NX3L1G53GT
Contextual Info: NX3L1G53 Low-ohmic single-pole double-throw analog switch Rev. 03 — 17 April 2009 Product data sheet 1. General description The NX3L1G53 provides one low-ohmic single-pole double-throw analog switch, suitable for use as an analog or digital multiplexer/demultiplexer. It has a digital select input S ,

74LVC1G53

Abstract: 74LVC1G53DC 74LVC1G53DP 74LVC1G53GD 74LVC1G53GT JESD22-A114E MO-187 V53 TSSOP8
Contextual Info: 74LVC1G53 2-channel analog multiplexer/demultiplexer Rev. 05 — 11 June 2008 Product data sheet 1. General description The 74LVC1G53 is a low-power, low-voltage, high-speed, Si-gate CMOS device. The 74LVC1G53 provides one analog multiplexer/demultiplexer with a digital select

74AUP2G125

Abstract: 74AUP2G125DC 74AUP2G125GT JESD22-A114E JESD78
Contextual Info: 74AUP2G125 Low-power dual buffer/line driver; 3-state Rev. 05 — 2 February 2009 Product data sheet 1. General description The 74AUP2G125 provides the dual non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input nOE . A HIGH level at pin nOE

74AUP1G126

Abstract: 74AUP1G32 JESD22-A114E 74AUP1T1326
Contextual Info: 74AUP1T1326 Low-power dual supply buffer/line driver; 3-state Rev. 01 — 20 January 2009 Product data sheet 1. General description The 74AUP1T1326 is a high-performance, low-power, low-voltage, single-bit, dual supply buffer/line driver with output enable circuitry.