SOT810 Search Results
SOT810 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT810-1 |
|
Plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm | Original | 226.73KB | 1 | ||
| SOT810-1 |
|
Footprint for reflow soldering SOT810-1 | Original | 14.07KB | 1 |
SOT810 Price and Stock
Nexperia NSF060120T2A0JSiC MOSFETs SOT8107 1200V 36A N-CH |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NSF060120T2A0J | Reel | 800 |
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Buy Now | ||||||
SOT810 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HSSON18 package SOT810-1 0.55 1.55 1.00 11x 2.55 4.80 6.40 9.00 9.25 8.30 3.40 1.50 0.95 1.05 1.80 3.40 4.60 7.00 solder lands 7.80 10.20 solder resist 0.075 clearance |
Original |
HSSON18 OT810-1 OT810-1 | |
|
Contextual Info: Package outline HSSON18: plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm SOT810-1 X B D A E A A1 c terminal 1 index area detail X e1 C e2 e3 b2 1 e b1 b v M C A B w M C 9 y y1 C L terminal 1 index area Eh |
Original |
HSSON18: OT810-1 | |
HSSON18
Abstract: sot810
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Original |
HSSON18: OT810-1 HSSON18 sot810 |