SOT81 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HSSON18 package SOT810-1 0.55 1.55 1.00 11x 2.55 4.80 6.40 9.00 9.25 8.30 3.40 1.50 0.95 1.05 1.80 3.40 4.60 7.00 solder lands 7.80 10.20 solder resist 0.075 clearance

Contextual Info: 24 DH VQ FN SOT815-1 DHVQFN24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 4 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e y ∅w M C T R P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B b e e2 1/2 e

Contextual Info: Package outline HLLGA28R: plastic thermal enhanced low profile land grid array package; 28 lands; resin based; body 6 x 6 x 1.4 mm D SOT819-1 A B land 1 index area E e1 L1 v w b e 8 M M y1 C C A B C A C y 14 L 15 7 e e2 Eh 21 1 land 1 index area 28 22 Dh 2.5

HVQFN72

Abstract: MO-220 EE19 sot813
Contextual Info: Package outline Philips Semiconductors HVQFN72: plastic thermal enhanced very thin quad flat package; no leads; 72 terminals; body 10 x 10 x 0.85 mm A B D SOT813-2 terminal 1 index area A A1 E c detail X C e1 1/2 e e 19 36 L y y1 C v M C A B w M C b 37 18

BGA288

Abstract: MS-034 sot812
Contextual Info: PDF: 2003 May 20 Philips Semiconductors Package outline BGA288: plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm SOT812-1 B D D1 A ball A1 index area A2 A1 A E1 E detail X C e1 e 1/2 e ∅v M b ∅w M AB AA Y W V U T R P N M L K J H G F E

HVQFN36

Abstract: MO-220 sot818
Contextual Info: PDF: 2003 Jun 13 Philips Semiconductors Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 5 x 5 x 0.85 mm SOT818-1 B D A terminal 1 index area A E A1 c detail X C e1 e y1 C v M C A B w M C b 10 y 18

BGA256 17 X 17

Abstract: BGA256 MS-034 BGA-256 sot811 BGA256 17
Contextual Info: PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M T R P N M L K J H G F E D C B A shape

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN72 package SOT813-4 Hx Gx D P 0.105 SPx tot drill 0.3 mm (x45) SPx SPy Hy SPy tot Gy SLy By Ay (0.065) 0.55 mm SLx Bx Ax solder land solder resist solder paste deposit occupied area

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT811-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline HVQFN72: plastic thermal enhanced very thin quad flat package; no leads; 72 terminals; body 10 x 10 x 0.85 mm A B D SOT813-2 terminal 1 index area A E A1 c detail X C e1 1/2 e e 19 L 36 y y1 C v M C A B w M C b 37 18 e e2 Eh 1/2 e 1 terminal 1

HVQFN36

Contextual Info: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 5 x 5 x 0.85 mm SOT818-1 B D A terminal 1 index area A E A1 c detail X C e1 e y1 C v M C A B w M C b 10 y 18 L 19 9 e e2 Eh 1 27 terminal 1 index area

Contextual Info: Package outline HSSON18: plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm SOT810-1 X B D A E A A1 c terminal 1 index area detail X e1 C e2 e3 b2 1 e b1 b v M C A B w M C 9 y y1 C L terminal 1 index area Eh

Contextual Info: Package outline HVQFN100: plastic thermal enhanced very thin quad flat package; no leads; 100 terminals; body 12 x 12 x 0.85 mm SOT817-1 B D D1 A terminal 1 index area A4 A E1 E c A1 detail X C e1 e 26 y1 C v M C A B w M C b 50 L y 51 25 e e2 Eh 1 terminal 1

MO-220

Abstract: sot817
Contextual Info: PDF: 2003 Jun 13 Philips Semiconductors Package outline HVQFN100: plastic thermal enhanced very thin quad flat package; no leads; 100 terminals; body 12 x 12 x 0.85 mm SOT817-1 B D D1 A terminal 1 index area A4 A E1 E c A1 detail X C e1 e y1 C v M C A B w M C

Contextual Info: Package outline HVQFN72: plastic thermal enhanced very thin quad flat package; no leads; 72 terminals; body 10 x 10 x 0.85 mm B D SOT813-5 A terminal 1 index area A E A1 c detail X e1 Ds L C A B C v w b C Dt 19 36 37 18 y y1 C L1 Et e Eh 1/2 e e2 Es 1 terminal 1

HVQFN36

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN36 package SOT818-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

SOT815-1

Contextual Info: SOT815-1 Standard product orientation 12NC ending 118 Rev. 01 — 23 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT815-1 118

DHVQFN24

Abstract: SOT815-1 L121 sot815
Contextual Info: PDF: 2003 Apr 29 Philips Semiconductors Package outline DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm B D SOT815-1 A A E A1 c detail X terminal 1 index area C e1 terminal 1

HSSON18

Abstract: sot810
Contextual Info: Package outline Philips Semiconductors HSSON18: plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm SOT810-1 X B D A E A A1 c terminal 1 index area detail X e1 C e2 e3 b2 1 e b1 b 9 y y1 C v M C A B w M C L terminal 1

MO-220

Abstract: HVQFN72 sot813
Contextual Info: PDF: 2003 Jul 16 Philips Semiconductors Package outline HVQFN72: plastic thermal enhanced very thin quad flat package; no leads; 72 terminals; body 10 x 10 x 0.85 mm A B D SOT813-1 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 36 L y y1 C v M C A B

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of DHVQFN24 package SOT815-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline BGA288: plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm SOT812-1 B D D1 A ball A1 index area A2 A1 A E1 E detail X C e1 e 1/2 e y1 C ∅v M C A B b y ∅w M C AB AA Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e 1 shape

sot814

Contextual Info: PDF: 2003 Nov 24 Philips Semiconductors Package outline HTSSON16T: plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; body 6.6 x 5.2 x 1.1 mm SOT814-1 X D D1 D2 B A A E2 E1 E c detail X terminal 1 index area C e1