SOT784 Search Results
SOT784 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT784-1 |
|
Footprint for reflow soldering SOT784-1 | Original | 11.49KB | 1 | ||
| SOT784-1 |
|
Plastic low profile quad flat package; 100 leads; body 14 x 20 x 1.4 mm | Original | 240.86KB | 1 |
SOT784 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Package outline LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 20 x 1.4 mm SOT784-1 c y X A 80 51 81 50 ZE e A A2 E HE A 3 A1 w M θ Lp bp pin 1 index L 31 100 detail X 1 30 e w M bp v M A ZD D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions) |
Original |
LQFP100: OT784-1 136E27 MS-026 ED-7311PD | |
LQFP100
Abstract: MS-026 sot784 7311P
|
Original |
LQFP100: OT784-1 136E27 MS-026 ED-7311PD LQFP100 MS-026 sot784 7311P | |
LQFP100 footprintContextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP100 package SOT784-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land |
Original |
LQFP100 OT784-1 OT784-1 LQFP100 footprint |