SOT783 Search Results

MS-034

Abstract: sot783
Contextual Info: PDF: 2002 Aug 13 Philips Semiconductors Package outline HBGA1172: plastic thermal enhanced ball grid array package; 1172 balls; body 40 x 40 x 2.4 mm; heatsink B D SOT783-1 A ball A1 index area A A2 E A1 detail X C e1 C A B ∅w M C b e AV AT AP AM AK AH AF