SOT777 Search Results
SOT777 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT777-1 |
|
Plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm | Original | 247.95KB | 1 | ||
| SOT777-1 |
|
Footprint for reflow soldering SOT777-1 | Original | 11.34KB | 1 |
SOT777 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm D SOT777-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C K J H e G F e2 E 1/2 e D C B A ball A1 index area 1 2 |
Original |
TFBGA100: OT777-1 MO-195 | |
|
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA100 package SOT777-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
TFBGA100 OT777-1 OT777-1 | |
TFBGA100
Abstract: MO-195 sot777
|
Original |
TFBGA100: OT777-1 MO-195 TFBGA100 MO-195 sot777 |