SOT766 Search Results
SOT766 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT766-1 | NXP Semiconductors | Plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad | Original | 252.06KB | 1 | ||
| SOT766-2 | NXP Semiconductors | Plastic thermal enhanced low profile quad flat package; 176 leads | Original | 395.23KB | 1 |
SOT766 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: Package outline HLQFP176: plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad SOT766-1 c y exposed die pad X Dh A 132 133 89 88 ZE e Eh E HE A A2 A1 A 3 θ wM Lp L bp detail X pin 1 index 176 45 1 44 |
Original |
hlqfp176ot766-1ms-026 | |
HLQFP176
Abstract: MS-026 sot766
|
Original |
hlqfp176ot766-1ms-026sot766 | |
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Contextual Info: Package outline HLQFP176: plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4; exposed die pad SOT766-2 c y exposed die pad X Dh A 132 133 89 88 ZE e A3 A A2 θ A1 Eh E Lp detail X HE L w bp pin 1 index 176 44 1 v ZD w bp |
Original |
hlqfp176ot766-2ms-026sot766-2 |