SOT754 Search Results
SOT754 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT754-1 |
|
Footprint for reflow soldering SOT754-1 | Original | 11.49KB | 1 | ||
| SOT754-1 |
|
Plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm | Original | 274.98KB | 1 |
SOT754 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm B D SOT754-1 A ball A1 index area A E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V e U T R P N M K L F D B e2 J H 1/2 e G E C A ball A1 |
Original |
TFBGA256: OT754-1 MO-216 | |
|
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA256 package SOT754-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
TFBGA256 OT754-1 OT754-1 | |
TFBGA256
Abstract: TfBGA-256 MO-216 sot754
|
Original |
TFBGA256: OT754-1 MO-216 TFBGA256 TfBGA-256 MO-216 sot754 |