SOT714 Search Results
SOT714 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT714-1 |
|
Footprint for reflow soldering SOT714-1 | Original | 11.54KB | 1 | ||
| SOT714-1 |
|
Plastic thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink | Original | 266.52KB | 1 |
SOT714 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA329 package SOT714-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
HBGA329 OT714-1 OT714-1 | |
MS-034
Abstract: sot714 e213
|
Original |
HBGA329: OT714-1 MS-034 MS-034 sot714 e213 | |
|
Contextual Info: Package outline HBGA329: plastic, thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink SOT714-1 B D A D1 ball A1 index area A j A2 A1 E1 E detail X C e1 b e AC AB AA Y W V U T R P N M L K J H G F E D C B A e heatsink e2 1 shape |
Original |
HBGA329: OT714-1 OT71XP |