SOT713 Search Results

Contextual Info: Package outline TFBGA204: plastic thin fine-pitch ball grid array package; 204 balls; body 11 x 11 x 0.8 mm A B D SOT713-1 ball A1 index area A E A2 A1 detail X C e1 e Y V T P M K H F D B ball A1 index area ∅v ∅w b 1/2 e M M y y1 C C A B C W e U R N L

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA204 package SOT713-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

MO-195

Abstract: TFBGA204
Contextual Info: PDF: 2003 Mar 20 Philips Semiconductors Package outline TFBGA204: plastic thin fine-pitch ball grid array package; 204 balls; body 11 x 11 x 0.8 mm A B D SOT713-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e Y V T P M K H F D B ball A1 index area y y1 C

TFBGA204

Abstract: MO-195 sot713
Contextual Info: PDF: 2001 Jun 28 Philips Semiconductors Package outline TFBGA204: plastic thin fine-pitch ball grid array package; 204 balls; body 11 x 11 x 0.8 mm A B D SOT713-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C Y V T P M K