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    sot704

    Contextual Info: PDF: 2002 Nov 22 Philips Semiconductors Package outline HBGA380: plastic thermal enhanced ball grid array package; 380 balls; body 31 x 31 x 1.42 mm; heatsink A B D SOT704-1 ball A1 index area A A2 A1 E detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C


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    HBGA380: OT704-1 sot704 PDF