| SOT684-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm |
Original |
PDF
|
230.42KB |
1 |
| SOT684-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT684-1 |
Original |
PDF
|
19.25KB |
1 |
| SOT684-10 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals |
Original |
PDF
|
223.83KB |
1 |
| SOT684-11 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals |
Original |
PDF
|
341.97KB |
1 |
| SOT684-1_118 |
|
NXP Semiconductors
|
HVQFN56; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
Original |
PDF
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184.53KB |
4 |
