SOT638 Search Results
SOT638 Datasheets (8)
NXP Semiconductors
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT638-1 |
|
Footprint for reflow soldering SOT638-1 | Original | 15.67KB | 1 | ||
| SOT638-1 |
|
Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | Original | 247.9KB | 1 | ||
| SOT638-2 |
|
Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | Original | 247.94KB | 1 | ||
| SOT638-2 |
|
Footprint for reflow soldering SOT638-2 | Original | 15.35KB | 1 | ||
| SOT638-3 |
|
Footprint for reflow soldering SOT638-3 | Original | 330.46KB | 1 | ||
| SOT638-3 |
|
Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | Original | 251.01KB | 1 | ||
| SOT638-4 |
|
Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | Original | 252.03KB | 1 | ||
| SOT638-6 |
|
Plastic thermal enhanced thin quad flat package; 100 leads; exposed diepad | Original | 252.1KB | 1 |