SOT638 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-1 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-4 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-3 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 wM θ A1 bp pin 1 index Lp L detail X 26 100 1 25 wM bp e

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp L pin 1 index detail X 26 100 1 25 w M bp

HTQFP100

Abstract: a7551
Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HTQFP100 package SOT638-3 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

philips l 6.1

Abstract: HTQFP100 MS-026 sot638
Contextual Info: Package outline Philips Semiconductors HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index L detail X

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-6 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD

HTQFP100

Abstract: MS-026 sot638
Contextual Info: Package outline Philips Semiconductors HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-2 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A3 A A2 w M θ bp pin 1 index A1 Lp L detail X

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-2 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-2 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A3 A A2 w M θ bp pin 1 index A1 Lp L detail X 26 100 1 25 w M bp

HTQFP100

Contextual Info: PDF: 2001 Mar 30 Philips Semiconductors Package outline HTQFP100: plastic, heatsink thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT638-1 c y heatsink side X Dh A 75 51 76 50 ZE e E HE Eh A2 A A3 A1 w M θ bp Lp pin 1 index L detail X 26 100

MRF581

Abstract: 2SK163 BFG480W NB b6 smd transistor 2SK508 SMD transistor n36 bf998 TEF6860HL 3SK290 baw 92
Contextual Info: RF᠟‫ݠ‬㄀8⠜ RF RFׂ೗‫ڦ‬ᆌᆩࢅยऺ๮֩ 2006౎6ሆ ݀քන೺ǖ2006౎6ሆ ࿔ॲຩႾࡽǖ9397 750 15589 Henk RoelofsLjޭጺ֋&ጺঢ়૙RFׂ೗ ०঻ ௅ᅃӲԨ࿢்‫ࣷۼ‬ၠጲम༵‫؜‬཈቟ᅜ߀฀࿢்‫ڦ‬RF๮֩ă‫ڼ‬8Ӳᄺփ૩ྔă࿢்ᅙཁेକ߸‫ܠ‬एᇀ

Motorola transistor smd marking codes

Abstract: walkie-talkie transceiver diagram BFM505 BF256B spice model 2SK163 UAF3000 BGO807C FET marking code 365 marking code M2 SOT23 SOT56
Contextual Info: RF Manual 8 edition th Application and design manual for RF products June 2006 date of release: June 2006 document order number: 9397 750 15589 Henk Roelofs,Vice President & General Manager RF Products Introduction Every edition we challenge ourselves to improve our RF manual. This 8th edition is no exception.

uaf4000

Abstract: toshiba smd marking code transistor smd code marking wl sot23 RF LNB C band chipset M74 marking BFG480W SMD transistor n36 vHF amplifier module 2450Mhz TOSHIBA DIODE CATALOG DIODE RF DETECTOR
Contextual Info: RFマニュアル第9版 RF製品用のアプリケーションおよび設計マニュアル 2006年11月 date of release: November 2006 document order number: 9397 750 15817 Henk RoelofsRF製品担当副社長兼ゼネラル・マネージャー はじめに

DAC1205D650

Abstract: HTQFP100 MS-026
Contextual Info: DAC1205D650 Dual 12-bit DAC, up to 650 Msps; 2x 4× and 8× interpolating Rev. 01 — 28 July 2009 Product data sheet 1. General description The DAC1205D650 is a high-speed 12-bit dual-channel Digital-to-Analog Converter DAC with selectable 2×, 4× or 8× interpolating filters optimized for multi-carrier wireless

Contextual Info: DAC1405D750 Dual 14-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 5 — 31 January 2012 Product data sheet 1. General description The DAC1405D750 is a high-speed 14-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless

Contextual Info: DAC1005D750 Dual 10-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 4 — 31 January 2012 Product data sheet 1. General description The DAC1005D750 is a high-speed 10-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless

dac1405d750

Contextual Info: DAC1405D750 Dual 14-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 5 — 31 January 2012 Product data sheet 1. General description The DAC1405D750 is a high-speed 14-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless

Contextual Info: DAC1005D750 Dual 10-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 05 — 2 July 2012 Product data sheet 1. General description The DAC1005D750 is a high-speed 10-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless

Contextual Info: DAC1005D750 Dual 10-bit DAC, up to 750 Msps; 4x and 8× interpolating Rev. 1 — 27 July 2010 Product data sheet 1. General description The DAC1005D750 is a high-speed 10-bit dual channel Digital-to-Analog Converter DAC with selectable 4× or 8× interpolating filters optimized for multi-carrier wireless

2SK43 transistor

Abstract: smd transistor m29 sot343 UXA23465 Motorola transistor smd marking codes walkie-talkie transceiver diagram UXA23476 diode SMD WL sot23 BF862 AM LNA uaf3000 2SK163
Contextual Info: th 1 ed ition 10 th editio n t h 1 e d th i t i o n RF manual 10 edition 10 Application and design manual for RF products TH September 2007 www.nxp.com 2007 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written

UPC8236

Abstract: MRFE6VP m74 7 segment display Mounting and Soldering of RF transistors MOBILE jammer GSM 1800 MHZ circuit diagram BLF4G08LS-160A rf Amplifier mhz Doherty 470-860 RF transceiver 802.11AC AN10882 m74 7 segment display input
Contextual Info: RF Manual 16 edition th Application and design manual for High Performance RF products June 2012 NXP enables you to unleash the performance of next-generation RF and microwave designs NXP's RF Manual is one of the most important reference tools on the market for today’s

PNX8511

Abstract: MDB65 DVI demux RGB DAC pnx8510 HTQFP100 YUV422 input analog CVBS output Philips DN 10-5 crt SMD CODES 1002 19-AUDIO mdb643
Contextual Info: PNX8510; PNX8511 Analog companion chip Rev. 04 – 12 January 2004 Product data 1. General description The PNX8510; PNX8511 is an analog backend companion chip to digital ICs processing video and audio signals. The primary difference between the PNX8510 and the PNX8511 is: