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    SOT636-1 Search Results

    SOT636-1 Datasheets (2)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT636-1
    NXP Semiconductors Footprint for reflow soldering SOT636-1 Original PDF 11.54KB 1
    SOT636-1
    NXP Semiconductors Plastic heatsink ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink Original PDF 274.2KB 1