SOT63 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA388 package SOT636-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-1 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline TFBGA112: plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm D SOT630-1 A B ball A1 index area A A2 E A1 detail X C e1 e y1 C ∅v M C A B b 1/2 e y ∅w M C M L K e J H G e2 F E 1/2 e D C B A ball A1 index area

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-4 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD

Contextual Info: Package outline Plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads SOT637 HE1 E A F1 Q1 R L1 bp1 F D D3 1 D2 L D3 (1) A A HE SENSOR DIE POSITION centre of reading point D1 * B L4(1) Q1 L3 A L2 1 2 3 4 5 bp e v A 0.4 c bp2 HE2 E1

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-3 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 wM θ A1 bp pin 1 index Lp L detail X 26 100 1 25 wM bp e

Contextual Info: Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT633-1 E D A X c y exposed die pad side HE v M A Dh Z 38 20 A2 Eh A3 A1 A pin 1 index θ Lp L detail X

Contextual Info: Package outline HBGA596: plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink SOT635-1 B D A D1 ball A1 index area j A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AH AF AD AB Y V T P M AJ AG AC

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp L pin 1 index detail X 26 100 1 25 w M bp

HTQFP100

Abstract: a7551
Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index

HBCC16

Abstract: SOT639-2 sot639
Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b D B SOT639-2 v M C A B w M C A f terminal 1 index area v M C A B w M C b1 E b3 b2 v M C A B w M C v M C A B w M C

HBCC16

Abstract: sot639
Contextual Info: PDF: 2000 Aug 30 Philips Semiconductors Package outline HBCC16: plastic, heatsink bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm SOT639-1 x B D b1 w M w M Pin A1 index area b E b3 w M b2 w M detail X x C A e1 B e C y v A e2 E1 e4 1 16 D1 A1 X e3 A2

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA596 package SOT635-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HTQFP100 package SOT638-3 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: PDF: 2002 Jan 18 Philips Semiconductors Package outline Plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads SOT637 HE1 A E F1 Q1 R L1 bp1 F D D3 D2 L D3 A B HE SENSOR DIE POSITION centre of reading point D1 * L4 L3 L2 1 2 3 4 5 bp

HTSSOP38

Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT633-1 E D A X c y exposed die pad side HE v M A Dh Z 38 20 A2

philips l 6.1

Abstract: HTQFP100 MS-026 sot638
Contextual Info: Package outline Philips Semiconductors HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index L detail X

HBCC16

Contextual Info: PDF: 2003 Mar 18 Philips Semiconductors Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b v M C A B w M C x B D SOT639-1 terminal 1 index area v M C A B w M C b1 E b3 b2 v M C A B w M C detail X x C

HTSSOP-38

Abstract: sot633
Contextual Info: PDF: 2000 Nov 13 Philips Semiconductors Package outline HTSSOP38: plastic, heatsink thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm SOT633-1 E D A X c y heatsink side HE v M A Dh Z 38 20 A2 Eh A3 A1 A pin 1 index θ Lp

BGY282

Abstract: ECEV1VA101P GSM1800 GSM900 v-band P925
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET M3D727 BGY282 dual band UHF amplifier module for GSM900 and GSM1800 Preliminary specification 2001 Dec 04 Philips Semiconductors Preliminary specification dual band UHF amplifier module for GSM900 and GSM1800 BGY282 PINNING - SOT632A

Contextual Info: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm SOT631-3 B D A ball A1 index area A A2 A1 E detail X C e1 y1 C ∅v M C A B b e y ∅w M C U T R P e N M L K e2 J H G F E D C B A ball A1 index area

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-6 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD

Contextual Info: Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT634A D A F 3 D1 U1 B q C c 1 L p U2 E1 E w1 M A M B M A 2 L Q w2 M C M b 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions UNIT A b c D D1 mm