SOT605 Search Results

Contextual Info: Package outline HBGA600: plastic thermal enhanced ball grid array package; 600 balls; body 40 x 40 x 0.9 mm; heatsink B D SOT605-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y F B AJ AG AE e AC heatsink AA e2 R M D AL U T P H N L J

11 ak 30 a4

Abstract: HBGA600 MS-034
Contextual Info: PDF: 2003 Mar 25 Philips Semiconductors Package outline HBGA600: plastic thermal enhanced ball grid array package; 600 balls; body 40 x 40 x 0.9 mm; heatsink B D SOT605-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e ∅v M C A B b y1 C y ∅w M C AL

HBGA600

Abstract: A3 AH sot605
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline HBGA600: plastic, heatsink ball grid array package; 600 balls; body 40 x 40 x 0.9 mm A B D SOT605-1 ball A1 index area A2 E A A1 A3 detail X e1 b e C v M B ZD1 ∅w M v M A y y1 C AL AJ AG AE AC AA W