SOT588 Search Results

BGA656

Abstract: sot588
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA656: plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm SOT588-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 b e AJ AG AE AC AA W U R N L J G E C v M B ∅w M y y1 C

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA656 package SOT588-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline BGA656: plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm SOT588-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E

k 3683

Abstract: MS-034 BGA656
Contextual Info: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA656: plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm SOT588-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AK AJ AH AG AF AE AD AC