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    SOT411 PACKAGE Search Results

    SOT411 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH1R306PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    XPH2R106NC
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Datasheet

    SOT411 PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SOT411

    Abstract: DBS23P
    Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS23P: plastic DIL-bent-SIL power package; 23 leads lead length 12 mm SOT411-2 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 c Q v M 23 e1 Z e e2 m w M bp 5 10 mm


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    DBS23P: OT411-2 SOT411 DBS23P PDF

    DBS23P

    Abstract: SOT411
    Contextual Info: PDF: 2002 Apr 24 Philips Semiconductors Package outline DBS23P: plastic DIL-bent-SIL power package; 23 leads lead length 12 mm SOT411-2 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 c Q v M 23 e1 Z e e2 m w M bp 5 10 mm


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    DBS23P: OT411-2 DBS23P SOT411 PDF

    DBS23P

    Abstract: SOT411
    Contextual Info: PDF: 2002 Apr 24 Philips Semiconductors Package outline DBS23P: plastic DIL-bent-SIL power package; 23 leads straight lead length 3.2 mm SOT411-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β E2 B j E E1 L2 L3 L1 L 1 e1 Z e 5 v M e2 m w M


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    DBS23P: OT411-1 DBS23P SOT411 PDF

    DBS23P

    Abstract: SOT411
    Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS23P: plastic DIL-bent-SIL power package; 23 leads straight lead length 3.2 mm SOT411-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β E2 B j E E1 L2 L3 L1 L 1 e1 Z e 5 v M e2 m w M


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    DBS23P: OT411-1 DBS23P SOT411 PDF

    Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA8567Q 4 x 25 W BTL quad car radio power amplifier Product specification Supersedes data of 1997 Feb 12 File under Integrated Circuits, IC01 1998 Sep 23 Philips Semiconductors Product specification 4 × 25 W BTL quad car radio power


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    TDA8567Q TDA8567Q/N2 OT411 TDA8567Q/N3 TDA8567QU PDF

    Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA8567Q 4 x 25 W BTL quad car radio power amplifier Product specification Supersedes data of 1997 Feb 12 File under Integrated Circuits, IC01 1998 Sep 23 Philips Semiconductors Product specification 4 × 25 W BTL quad car radio power


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    TDA8567Q TDA8567Q/N2 OT411 TDA8567Q/N3 TDA8567QU PDF

    SAA7136E

    Abstract: saa7136 SAA7135 TO-220F JEDEC SAA7134 hso16 philips SAA7134 SAA7131E Philips SAA7130 SAA7133
    Contextual Info: PCI Digital A/V Decoders PCI DIGITAL AUDIO/VIDEO DECODERS Typenumber SAA7130H SAA7134H SAA7133H SAA7135H SAA7131E SAA7136E SAA7136HS PCI PCI PCI PCI PCI PCI PCI Description Digital Audio/Video Decoders Digital Audio/Video Decoders Digital Audio/Video Decoders


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    SAA7130H SAA7134H SAA7133H SAA7135H SAA7131E SAA7136E SAA7136HS OT425 LQFP128) SAA7136E saa7136 SAA7135 TO-220F JEDEC SAA7134 hso16 philips SAA7134 SAA7131E Philips SAA7130 SAA7133 PDF

    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


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    PDF

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


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    manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package PDF