SOT317 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP100 package SOT317-3 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

MO-112

Abstract: QFP100
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-3 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD

MO-112

Abstract: QFP100
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-2 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD

Contextual Info: PDF: 1999 Dec 15 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-3 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD

MO-112

Abstract: QFP100
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT317-1 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X

sot317

Abstract: yx80
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT317-1 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X

Contextual Info: Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT317-1 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD v M A D B HD v M B

sot317

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-2 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD

MO-112

Abstract: QFP100
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-2 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP100 package SOT317-2 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

MO-112

Abstract: QFP100
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT317-1 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X

Contextual Info: Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-2 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-3 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

MO-112

Abstract: QFP100 sot317
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-3 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD

LQFP64. footprint

Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

SIEMENS AVR GENERATOR

Abstract: philips dect Siemens metro brazil 80CL51 philips rf manual 80C51 PCD5032 PCD5093 PCD5093H PCD5096
Contextual Info: INTEGRATED CIRCUITS DATA SHEET PCD5093 DECT baseband controller Objective specification File under Integrated Circuits, IC17 1997 Jul 21 Philips Semiconductors Objective specification DECT baseband controller PCD5093 CONTENTS 1 FEATURES 1.1 DSP software features

vcd player block diagram

Abstract: block diagram of VCD block diagram of VCD and its functions colour tv power supply system ic SAA7185 circuits video player circuit diagram CCIR601 CCIR656 DR14 QFP100
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA2510 Video CD VCD decoder Preliminary specification File under Integrated Circuits, IC02 1996 May 21 Philips Semiconductors Preliminary specification Video CD (VCD) decoder SAA2510 FEATURES (With standard microcode loaded)

philips HD11

Abstract: SAA7388GP LC89510 QFP80 SAA7388
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA7388 Error correction and host interface IC for CD-ROM ELM Preliminary specification File under Integrated Circuits, IC01 1996 Apr 26 Philips Semiconductors Preliminary specification Error correction and host interface IC for

SAA2521

Abstract: SAA2520 SAA2520GP MLB125
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA2520 Stereo filter and codec for MPEG layer 1 audio applications Preliminary specification File under Integrated Circuits, IC01 August 1993 Philips Semiconductors Preliminary specification Stereo filter and codec for MPEG layer 1

interface of T9 with microcontroller

Abstract: SAA2520 SAA2521 SAA2521GP compression mpeg 1 layer 2 audio compression layer 2 MBC140 audio compression
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA2521 Masking threshold processor for MPEG layer 1 audio compression applications Preliminary specification File under Integrated Circuits, IC01 August 1993 Philips Semiconductors Preliminary specification Masking threshold processor for MPEG

SAA7121HB

Abstract: SAA7121 TTX12
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA7120; SAA7121 Digital Video Encoder ConDENC Preliminary specification File under Integrated Circuits, IC22 1997 Jan 06 Philips Semiconductors Preliminary specification Digital Video Encoder (ConDENC) SAA7120; SAA7121 FEATURES

sor pressure switch

Abstract: lg flat screen tv electronic diagram avr vr3 A2x smd
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA9852 I2C-bus controlled BTSC stereo/SAP decoder and audio processor Preliminary specification Supersedes data of 1996 Feb 28 File under Integrated Circuits, IC02 1997 Mar 11 Philips Semiconductors Preliminary specification

LC89510

Abstract: QFP80 SAA7382 SAA7382GP philips HD15
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA7382 Error correction and host interface IC for CD-ROM ELM Preliminary specification File under Integrated Circuits, IC01 1996 Apr 25 Philips Semiconductors Preliminary specification Error correction and host interface IC

SAA5247

Abstract: SAA5244 DIP48 QFP64 SAA5244A SAA5249 SAA5254 SAA5281 Video Output Graphics Controller 2636 tv philips 20 gr 1356
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA5249 Integrated VIP and Teletext with Background Memory Controller IVT1.1BMCX Preliminary specification Supersedes data of December 1993 File under Integrated Circuits, IC02 1996 Nov 07 Philips Semiconductors Preliminary specification