| SOT1340-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 217 balls |
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Original |
PDF
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| SOT1341-1 |
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NXP Semiconductors
|
Plastic extremely thin small outline package; no leads; 16 terminals; body 2.5 x 3.2 x 0.5 mm |
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Original |
PDF
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| SOT1342-1 |
|
NXP Semiconductors
|
Plastic, extremely thin fine-pitch ball grid array package; 24 balls |
|
Original |
PDF
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| SOT1342-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1342-1 |
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Original |
PDF
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| SOT1347-1 |
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NXP Semiconductors
|
DIP7: plastic dual in-line package; 7 leads (300 mil) |
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Original |
PDF
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| SOT1349-1 |
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NXP Semiconductors
|
Plastic very-very-thin profile fine-pitch ball grid array package; 32 balls |
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Original |
PDF
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