SOT102 Search Results

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA169 package SOT1024-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-1 A ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13

Contextual Info: Package outline HUQFN60U: plastic thermal enhanced ultra thin quad flat package; no leads 60 terminals; UTLP based; body 4 x 6 x 0.55 mm B D SOT1025-1 A terminal 1 index area E A A1 detail X e2 v w C A B C M M e1 v w b M M C A B C C 1/2 e e L1 L D2 D6 eR A11

DIP18

Abstract: MS-011
Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; slim corner leads SOT102-2 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

0017C

Contextual Info: PDF: 1999 Jul 16 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; long body SOT102-4 ME seating plane D A2 A A1 L e Z c w M b1 (e 1) b MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

h 033

Abstract: DIP18 MS-001
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; slim corner leads SOT102-2 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

DIP18

Abstract: MS-001
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; long body SOT102-4 ME seating plane D A2 A A1 L e Z c w M b1 (e 1) b MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

Contextual Info: PA K SOT1023 LF LFPAK; Power-SO8; Tape reel; standard product orientation 12NC ending 115 Rev. 1 — 26 September 2012 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel

Contextual Info: Package outline DIP18: plastic dual in-line package; 18 leads 300 mil SOT102-1 ME seating plane D A2 A A1 L e Z b1 b 10 18 c w M (e 1) b2 MH pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max.

DIP18 package

Abstract: h 033 DIP18 MS-001
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

sot1023

Abstract: lfpak sot1023
Contextual Info: Package outline Plastic single-ended surface-mounted package LFPAK ; 4 leads A E SOT1023 E1 A b2 (3x) c1 b1 mounting base H D1 D L 1 2 3 4 b e A1 w A X c C θ Lp detail X 2.5 A A1 b b1 b2 c c1 D(1) D1(1) E(1) E1(1) max 1.10 0.15 0.50 4.41 0.25 0.30 4.70 4.45 5.30

Contextual Info: Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-2 A ball A1 index area E A2 A A1 detail X e1 e ∅v ∅w b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13

Contextual Info: Package outline LFBGA477: plastic low profile fine-pitch ball grid array package; 477 balls A B D SOT1022-1 ball A1 index area E A2 A A1 detail X e1 AB Y V T P M K H F D B ∅v ∅w b e M M C C A B C y y1 C AC AA W U e R N e2 L J G E C A ball A1 index area

SOT1023

Abstract: lfpak sot1023 sot669 footprint LFPAK footprint so8 footprint PSMN7R0-30YL PSMN1R2-25YL PSMN1R3-30YL PSMN3R0-30YL PSMN3R5-30YL
Contextual Info: Nine new Trench 6 MOSFETs in a Power-SO8 package The world’s first < 1 mΩ Power-SO8 MOSFETs at 25 V We’ve extended our range of Trench 6 MOSFETs with nine new devices at 25 V, 30 V, 40 V and 80 V in the LFPAK SOT669 and SOT1023 package. NXP leads the way with its range of Trench 6 MOSFETs in

Contextual Info: Package outline LFBGA256: plastic low profile fine-pitch ball grid array package; 256 balls B D SOT1020-1 A ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2

Contextual Info: Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; slim corner leads SOT102-2 ME seating plane D A2 A A1 L e Z b1 b 10 18 c w M (e 1) b2 MH pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

DIP18

Abstract: MS-001
Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

sot102

Abstract: SOT102-1
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: Package outline Plastic single-ended surface-mounted package LFPAK56 ; 4 leads A E SOT1023 E1 A b2 (3x) c1 b1 mounting base H D1 D L 1 2 3 4 b e A1 w A X c C θ Lp detail X 2.5 A A1 b b1 b2 c c1 D(1) D1(1) E(1) E1(1) max 1.10 0.15 0.50 4.41 0.25 0.30 4.70 4.45 5.30

Contextual Info: Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; long body SOT102-4 ME seating plane D A2 A A1 L e Z c w M b1 (e 1) b MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions)

Contextual Info: Package outline LFBGA161: plastic low profile fine-pitch ball grid array package; 161 balls B D SOT1029-1 A ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b M M C C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 12 13

Contextual Info: Package outline HWQFN28: plastic thermal enhanced very very thin quad flat package; no leads; 28 terminals; body 5 x 5 x 0.75 mm B D SOT1026-1 A terminal 1 index area E A A1 c detail X e1 b e 8 14 v w C C A B C M M y1 C y L 7 15 e e2 Eh 21 1 terminal 1 index area

DIP18

Abstract: MS-001 SOT102-4 sot102
Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; long body SOT102-4 ME seating plane D A2 A A1 L e Z c w M b1 (e 1) b MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions)

sot102

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; slim corner leads SOT102-2 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)