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    SOT-80 Search Results

    SOT-80 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MKZ30V
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 30 V, SOT-23 Datasheet
    MSZ36V
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 36 V, SOT-346 Datasheet
    MKZ24V
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 24 V, SOT-23 Datasheet
    MSZ30V
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 30 V, SOT-346 Datasheet
    MKZ5V6
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 5.6 V, SOT-23 Datasheet

    SOT-80 Datasheets (16)

    NXP Semiconductors
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT800-1
    		NXP Semiconductors Flanged ceramic package; 2 mounting holes; 4 leads Original PDF 341.72KB 1
    SOT800-2
    		NXP Semiconductors Flanged ceramic package; 2 mounting holes; 4 leads Original PDF 341.4KB 1
    SOT800a
    		NXP Semiconductors Flanged double-ended ceramic package; 2 mounting holes; 4 leads Original PDF 229.14KB 1
    SOT802-1
    		NXP Semiconductors Plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.8 mm Original PDF 243.28KB 1
    SOT802-2
    		NXP Semiconductors Plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.7 mm Original PDF 243.39KB 1
    SOT803-1
    		NXP Semiconductors Footprint for reflow soldering SOT803-1 Original PDF 11.49KB 1
    SOT803-1
    		NXP Semiconductors Plastic quad flat package; 44 leads (lead length 1.6 mm); body 10 x 10 x 2 mm Original PDF 239.49KB 1
    SOT804-1
    		NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm Original PDF 235.54KB 1
    SOT804-1
    		NXP Semiconductors Footprint for reflow soldering SOT804-1 Original PDF 19.25KB 1
    SOT804-2
    		NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm Original PDF 234.9KB 1
    SOT804-3
    		NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm Original PDF 230.34KB 1
    SOT804-4
    		NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals Original PDF 225.98KB 1
    SOT804-5
    		NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals Original PDF 356.96KB 1
    SOT807-1
    		NXP Semiconductors Plastic thermal enhanced ball grid array package; 156 balls; body 15 x 15 x 1.15 mm; heatsink Original PDF 245.83KB 1
    SOT807-1
    		NXP Semiconductors Footprint for reflow soldering SOT807-1 Original PDF 11.56KB 1
    SOT809-1
    		NXP Semiconductors Plastic low profile ball grid array package; 224 balls; body 17 x 17 x 1.05 mm Original PDF 282.07KB 1