| SOT78 |
|
NXP Semiconductors
|
AN11172 - Mounting instructions for SOT78 (TO-220AB); SOT186A (TO-220F) |
Original |
PDF
|
1.32MB |
11 |
| SOT780-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 52 leads; body 10 x 10 x 1 mm; exposed die pad |
Original |
PDF
|
238.96KB |
1 |
| SOT78_127 |
|
NXP Semiconductors
|
Tube pack; standard product orientation; 12NC ending 127 |
Original |
PDF
|
118.55KB |
2 |
| SOT782-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin small outline package; no leads; 8 terminals |
Original |
PDF
|
223.06KB |
1 |
| SOT782-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT782-1 |
Original |
PDF
|
319.53KB |
1 |
| SOT782-1_115 |
|
NXP Semiconductors
|
HVSON8; reel pack; standard product orientation; 12NC ending 115 |
Original |
PDF
|
304.12KB |
4 |
| SOT782-1_118 |
|
NXP Semiconductors
|
HVSON8; reel pack; SMD; 13"; standard product orientation Orderable part number ending, 118 or J Ordering code (12NC) ending 118 |
Original |
PDF
|
266.05KB |
4 |
| SOT782-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT782-2 |
Original |
PDF
|
307.51KB |
1 |
| SOT782-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin small outline package; no leads; 8 terminals |
Original |
PDF
|
334.83KB |
1 |
| SOT784-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT784-1 |
Original |
PDF
|
11.49KB |
1 |
| SOT784-1 |
|
NXP Semiconductors
|
Plastic low profile quad flat package; 100 leads; body 14 x 20 x 1.4 mm |
Original |
PDF
|
240.86KB |
1 |
| SOT785-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 0.9 mm |
Original |
PDF
|
248.03KB |
1 |
| SOT785-2 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 1 mm |
Original |
PDF
|
244.66KB |
1 |
| SOT786-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced small outline package; 8 leads; body width 3.9 mm; exposed die pad |
Original |
PDF
|
359.32KB |
1 |
|
|
| SOT786-3 |
|
NXP Semiconductors
|
Plastic thermal enhanced small outline package; 8 leads; body width 3.9 mm; exposed die pad |
Original |
PDF
|
354.46KB |
1 |
| SOT788-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT788-1 |
Original |
PDF
|
19.25KB |
1 |
| SOT788-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 6 x 6 x 0.85 mm |
Original |
PDF
|
228.68KB |
1 |
| SOT788-1_118 |
|
NXP Semiconductors
|
HVQFN28; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
Original |
PDF
|
184.14KB |
4 |
| SOT789a |
|
NXP Semiconductors
|
leadless surface mounted package; plastic cap; 32 terminations |
Original |
PDF
|
231.88KB |
1 |
