SOLDERING PROCESS Search Results

profile wave soldering

Contextual Info: yA V - y A TANTALUM CAPACITORS Soldering Methods SOLDERING METHODS Solid tantalum chip capacitors can be attached by wave soldering or reflow soldering methods. The reflow soldering method however has become more popular since this process has been developed specifically for SMT components. Hand soldering is not

Contextual Info: Recommended Soldering Conditions Surface mounting type 1. Mounting method with solder 1-1 Recommended reflow soldering condition In reflow soldering process, exact temperature-cycle management is essential. We recommend pre-heating before soldering, so that you can prevent not only package

Contextual Info: VISHAY SEMICONDUCTORS www.vishay.com Rectifiers Application Note Soldering Process Notes WAVE SOLDERING THROUGH HOLE ONLY Sn-Pb Wave Soldering Profile Lead (Pb)-free Wave Soldering Profile 235 °C to 260 °C wave temperature 250 300 Maximum temperature can not exceed 265 °C

Melf composition

Contextual Info: Recommended Soldering Techniques Recommended Soldering Techniques by David B. Hutchins, Senior Applications Engineer Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original

Contextual Info: Soldering Conditions Recommended Pattern Pattern Dimensions Unit: mm LL2012-F Series a b c Flow Soldering 1.0-1.4 0.8 - 1.2 0.8 ~ 1.0 Reflow Soldering 1.0- 1.2 0 .6 - 1.0 0.8 - 1.2 LL1608-F/FH Series Flow Soldering 0.8 - 1.0 0.8 - 1.0 0.6 - 0.8 Reflow Soldering

Contextual Info: 31 SMD Handling Precautions 1. S oldering T h ere are generally tw o types o f SM D soldering m ethods: reflow soldering and flow dip sodering. N ecessary precautions for these soldering m ethods are as follow s: 1.1 (1) Soldering M ethods R eflow Soldering

Systems

Abstract: systemtechnik 60352-5 component data SAC305 laser soldering through hole technology SAC305 DIN EN 60352-5 din mount pcb connector mini din 9 male
Contextual Info: Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering - Reflow Soldering of Surface Mount Devices THR soldering - Through Hole Components, reflow soldered

Reflow Soldering Guide

Abstract: berex
Contextual Info: BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo

Contextual Info: AN11120 Application and soldering information for the PCA2129T automotive TCXO RTC Rev. 2 — 23 January 2013 Application note Document information Info Content Keywords PCA2129T soldering, application, timekeeping, timestamp Abstract This application note gives additional information about soldering and

AN10857

Abstract: PCF2127
Contextual Info: AN10857 Application and soldering information for PCF2127AT and PCF2129AT TCXO RTCs Rev. 3 — 25 January 2013 Application note Document information Info Content Keywords PCF2127AT, PCF2129AT, soldering, application, timekeeping, timestamp Abstract This application note gives additional information about soldering and

AN10857

Abstract: PCF2129A PCF2129 PCF2127A pcf2127 AN1085 rtc circuit diagram pcf2127A RTC i2c application notes SO20 package BBS 01
Contextual Info: AN10857 Application and soldering information for PCF2127A and PCF2129A TCXO RTCs Rev. 01 — 11 December 2009 Application note Document information Info Content Keywords PCF2127A, PCF2129A, soldering, application, timekeeping, timestamp Abstract This application note gives additional information about soldering and

Contextual Info: BRIGHT VIEW ELECTRONICS CO.,LTD HIGH BRIGHTNESS SMD LED BVS-166RU2 PACKAGE CONFIGURATION Cathode mark LED die 0.8 0.6 Soldering terminal Cathode line 1.6 1.0 Soldering Pattem 0.8 0.8 1.0 P C .board 0.3 0.4 Resin 0.8 Polarity 0.7 0.8 0.4 Soldering terminal

bvs-166

Abstract: BVS-167
Contextual Info: BRIGHT VIEW ELECTRONICS CO.,LTD SUPER BRIGHTNESS SMD LED BVS-166UG2-12 Cathode mark LED die 0.8 PACKAGE CONFIGURATION 0.6 Soldering terminal Cathode line 1.6 1.0 Soldering Pattem 0.8 0.8 1.0 P C .board 0.3 0.4 Resin 0.8 Polarity 0.7 0.8 0.4 Soldering terminal

tips ape

Abstract: 20-0110-HW
Contextual Info: Desoldering Tip - Air-Vac, A.P.E., Pace 20 Plato is one of the largest manufacturers of soldering tips in the world, producing tips to fit all of the most popular soldering stations. The long life and fast heat recovery of Plato soldering tips increases user

latex

Contextual Info: Wondermask PL Temporary Solder Mask 2218 Prevent soldering protected areas in a wave soldering process by applying temporary solder mask. Designed to apply smoothly, dry quickly, withstand high leadfree process temperatures, and then be removed easily. Also used for masking conformal coating.

49SMD

Contextual Info: VM6SSM3 VM6SSM3 Metal Housing Crystal Unit with 4 Soldering Pads F E AT U R E S Cost Effective Interchangeable with Plastic Molded SMD Crystals • Ideal for Consumer Product Applications • Withstand IR or Vapor Phase Reflow Soldering Process • • Parameter

Omron

Contextual Info: XH3 Half-pitch Fine-fit and Stacking Connectors Half-pitch Fine-fit Connectors Achieve High-density Mounting without Soldering • Solderless connection eliminates soldering and washing processes. ■ Multi-level stacking conserves board space. ■ Requires half the space of conventional DIN con-

PACE

Abstract: SX-70 SX-90 Soldering and desoldering
Contextual Info: Desoldering Tip - 3/16" Pace 30 COMPATIBLE STATIONS:Pace SX90, Pace SX-80, Pace SX-70 Plato is one of the largest manufacturers of soldering tips in the world, producing tips to fit all of the most popular soldering stations. The long life and fast heat recovery of Plato soldering tips increases user

Contextual Info: c?#r Sealed* Miniature Key Switches KT Series ‘ Process sealed-withstands soldering and cleaning processes. • ULTRA-MINIATURE LOW PROFILE DESIGN— APPROX. .250 IN. 6 mm SQ • PROCESS COMPATIBLE— WITHSTANDS SOLDERING AND CLEANING PROCESSES— HIGH TEMPERATURE MATERIALS (UL 94V-0)

NFL18ST207X1C3

Abstract: NFL21SP106X1C3 NFL18ST507X1C3 NFL18SP NFL18SP157X1A3 NFL18ST NFL18ST107X1C3 NFL18ST157X1C3 NFL18ST307X1C3 5050 RGB
Contextual Info: C31E11.pdf 04.3.8 catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF

Contextual Info: catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF catalog to prevent

MAGNETIC HEAD banknote

Abstract: BS05M1HFAL PC317 BS05C BS05C1HFAA BS05C1HGCA BS05N1HFAA BS05N1HGAA BS05N1NFAA S31E4
Contextual Info: S31E4.pdf 04.8.30 catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF

Contextual Info: C31E13.pdf 05.3.14 catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF

13005 D

Abstract: 13005d K322V
Contextual Info: Light Touch Switches General Information - Surface Mount Type Taping/Packaging Specifications Packaging Specifications Standard soldering method Standard Packing Quantity Flow soldering \ Style Type \ EVQPA1 EVQQF EVQPH EVQQHi EVQPJ Embossed Taping Inner Outer