SOLDER POWDER Search Results

3.5mm Stereo Chassis Socket

Abstract: FDZ BT PCB Mounted 6.5mm Stereo Socket trs stereo jack female jack 3.5mm Stereo plug FEMALE PCB MOUNT 6.35mm audio black Socket 5 pin PCB Mounted 3.5mm Stereo jack TRS jack CONNECTOR Stereo phone plug solder 3.5MM PCB Mounted 3.5mm Stereo plug 4 pole switch
Contextual Info: CONTENTS CONTENTS CATEGORY SUB CATEGORY AX SERIES XLR CABLE CONNECTORS PAGE 3 METAL SHELL TYPE - SOLDER AC SERIES XLR CABLE CONNECTORS PAGE 9 METAL SHELL TYPE - SOLDER THERMOPLASTIC SHELL TYPE - SOLDER METAL SHELL TYPE RIGHT ANGLE - SOLDER METAL SHELL TYPE - IDC SOLDERLESS

PCB Mounted 6.5mm Stereo Socket

Abstract: 3.5mm Stereo plug FEMALE PCB MOUNT 3.5mm Stereo Chassis Socket trs stereo jack female jack layout pcb stk 070 PCB Mounted 3.5mm Stereo Socket chassis STEREO FEMALE CONNECTOR 3.5MM PCB MOUNT 6.35mm audio black Socket XLR-5 connector amphenol CHASSIS MOUNT d sub CONNECTORS
Contextual Info: CONTENTS CONTENTS CATEGORY SUB CATEGORY AX SERIES XLR CABLE CONNECTORS PAGE 3 METAL SHELL TYPE - SOLDER AC SERIES XLR CABLE CONNECTORS PAGE 9 METAL SHELL TYPE - SOLDER THERMOPLASTIC SHELL TYPE - SOLDER METAL SHELL TYPE RIGHT ANGLE - SOLDER METAL SHELL TYPE - IDC SOLDERLESS

GR-78-CORE

Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
Contextual Info: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased

sn63pb37 solder wire

Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Contextual Info: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information

full automatic Washing machines circuit diagram

Abstract: automatic washing machine control system circuit fully automatic washing machine electronic circuit A6S-4101-H A6S-1104-PH 9101h full automatic Washing machines state diagram 4 pole 3 way rotary switch diagram
Contextual Info: DIP Switch A6S-H Previous A6S Model Upgraded to Surface-mounting Type with Increased Solder Heat Resistance • Designed to enable replacement of previous (A6S) model, featuring the same dimensions and improved solder heat resistance (peak solder temperature: 260°C).

Kester 197

Contextual Info: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder

kester Sn62Pb36Ag02

Abstract: Sn63pB37 temp profile
Contextual Info: R500 Dispensable Water-soluble Solder Paste for Leaded Alloys Product Description Physical Properties Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting

senju solder paste

Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste

Contextual Info: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both

mutoh ip-220

Contextual Info: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK

Contextual Info: HM53-208R0VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester

Contextual Info: HM53-001R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester

Contextual Info: HM53-101R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester

Contextual Info: HM53-50370HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating

Contextual Info: HM53-40360HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating

Contextual Info: HM53-30150HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating

24-7068-1407

Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Contextual Info: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com

AIMTERGE-520A

Abstract: SN100C C425 BI14
Contextual Info: RA Cored Wire Solder Rosin Activated Cored Wire Solder Features: - High Activity Level - Good Thermal Transfer - Fully Activated Flux - Glycol-Free - Improved Wetting Properties Description: RA is a fully activated, general-purpose wire solder for use in applications where mildly activated fluxes are too weak. RA

Contextual Info: HM100-251R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 3 4 ADHESIVE COIL SOLDER Epoxy Resin Enamelled Copper Wire Lead Free Solder Element Composition CAS No Fe2O3 MnO ZnO Others

Contextual Info: HM88-10091R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 ADHESIVE Epoxy Resin 3 COIL Enamelled Copper Wire 4 5 SOLDER DUMMY Lead Free Solder Dummy Lead Element Composition CAS No

Delta EFD20

Abstract: 48V to 12V buck transformer EFD20 7W
Contextual Info: Application Notes Magnetics Recommended Solder Reflow Profiles Standard SnPb Solder 3°C/Second Max. Lead Pb Free Solder 3°C/Second Max. 100°C 150°C 60-120seconds 150°C 200°C 60-120seconds 3°C/Second Max. 183°C 60-150 Seconds 235°C +/-5°C 30 Seconds Max

iron powder

Contextual Info: 19-Aug-09 HM70-101R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 ADHESIVE Epoxy Resin 3 COIL Enamelled Copper Wire 4 SOLDER Lead Free Solder Dummy Lead 5 DUMMY Nickel Plating Tin Plating

TB2272

Contextual Info: 23-Jul-09 HM73-106R0LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Iron Powder 2 ADHESIVE Epoxy 3 WIRE Air Coil 4 BODY Ink 5 SOLDER Lead Free Solder CAS No Material Mass mg Composition (mg) 7439-89-6 - 855 846.45

FAY RF

Contextual Info: Development General NXP Semiconductors BL-Cellular Systems, MST RF Power Basestations DEV&QAS Title: Solder mounting recommendations for Ldmos Power Amplifiers Author: Josselin FAY / Raimond DUMOULIN Doc. Nr. Date: 2007/05/10 General solder mounting recommendations