SOLDER PASTE INDIUM REFLOW PROCESS CONTROL Search Results
SOLDER PASTE INDIUM REFLOW PROCESS CONTROL Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| 9519ADM/B |
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9519A - Universal Interrupt Controller |
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| D8274 |
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8274 - Multi-Protocol Serial Controller (MPSC) |
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| MD82510/B |
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82510 - Serial I/O Controller, CMOS, CDIP28 |
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| MD8259A/B |
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8259A - Interrupt Controller, 8086, 8088, 80186 Compatible |
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| MR82510/B |
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82510 - Serial I/O Controller, CMOS |
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SOLDER PASTE INDIUM REFLOW PROCESS CONTROL Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching |
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POLE--15 FBR161 FBR166 FBR161: | |
lf 12201
Abstract: Solder Paste, Indium, Type 3
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POLE--15 FBR161 FBR166 FBR161: lf 12201 Solder Paste, Indium, Type 3 | |
fujitsu relay 57d24
Abstract: 57D24-N
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POLE--12 FBR57 FBR57: fujitsu relay 57d24 57D24-N | |
LGA rework
Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
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AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework | |
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Contextual Info: RMPA2265 28dBm WCDMA Power Amplifier Module General Description Features The RMPA2265 power amplifier module PAM is designed for WCDMA applications. The 2 stage PAM is internally matched to 50Ω to minimize the use of external components and features a low-power mode to reduce |
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RMPA2265 28dBm RMPA2265 | |
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Contextual Info: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the |
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RMPA2263 RMPA2263 | |
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Contextual Info: April 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local |
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RMPA1963 RMPA1963 CDMA2000-1X IS-95/CDMA2000-1XRTT/WCDMA | |
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Contextual Info: February 2005 RMPA0963 i-Lo Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout ■ 14% CDMAA/WCDMA efficiency 80 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm |
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RMPA0963 CDMA2000-1X | |
CDMA2000-1X
Abstract: ECJ-1VB1H102K RMPA0966 fairchild microwave power transistor
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RMPA0966 CDMA2000-1X ECJ-1VB1H102K fairchild microwave power transistor | |
GRM39Y5V104Z16VContextual Info: February 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout ■ 14% CDMA/WCDMA efficiency 85 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm |
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RMPA1963 CDMA2000-1X GRM39Y5V104Z16V | |
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Contextual Info: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the |
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RMPA2263 RMPA2263 | |
Solder Paste, Indium 5.8
Abstract: ECJ-1VB1H102K RMPA1966 SN63 SN96 grm39
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RMPA1966 16dBm) 16dBm Solder Paste, Indium 5.8 ECJ-1VB1H102K SN63 SN96 grm39 | |
ECJ-1VB1H102K
Abstract: RMPA0966
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RMPA0966 28dBm ECJ-1VB1H102K | |
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Contextual Info: RMPA1967 US-PCS CDMA, CDMA2000-1X and WDCMA Power Edge Power Amplifier Module Features General Description • Single positive-supply operation and low power and shutdown modes The RMPA1967 power amplifier module PAM is designed for CDMA, CDMA2000-1X, WCDMA and HSDPA personal communications system (PCS) applications. The 2-stage PAM is internally matched to 50 Ohms to minimize the use of external |
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RMPA1967 CDMA2000-1X CDMA2000-1XRTT/WCDMA RMPA1965 CDMA2000-1X, | |
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Contextual Info: RMPA1967 US-PCS CDMA, CDMA2000-1X and WDCMA Power Edge Power Amplifier Module Features General Description • Single positive-supply operation and low power and shutdown modes ■ 40% CDMA/WCDMA efficiency at +28 dBm average output power ■ Compact lead-free compliant, LCC package 3.0 x 3.0 x 1.0 mm nominal |
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RMPA1967 CDMA2000-1X CDMA2000-1XRTT/WCDMA RMPA1965 | |
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Contextual Info: RMPA0967 Cellular CDMA, CDMA2000-1X and WCDMA Power Edge Power Amplifier Module Features General Description • Single positive-supply operation with low power and shutdown modes ■ 39% CDMA/WCDMA efficiency at +28 dBm average output power ■ 52% AMPS mode efficiency at +31 dBm output power |
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RMPA0967 CDMA2000-1X CDMA2000-1XRTT/WCDMA RMPA0965 | |
CDMA2000-1X
Abstract: ECJ-1VB1H102K RMPA1765
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RMPA1765 CDMA2000-1X RMPA1765 CDMA2000-1X, ECJ-1VB1H102K | |
tamura tlf-206-93f
Abstract: SAC387 IPC-7711 Tamura kaken TLF-206-93F tamura solder paste tamura tlf tamura No clean solder paste S131CL-5-RMM-2450S TLF 206-93F lead free
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ZMXM-400 100mW, tamura tlf-206-93f SAC387 IPC-7711 Tamura kaken TLF-206-93F tamura solder paste tamura tlf tamura No clean solder paste S131CL-5-RMM-2450S TLF 206-93F lead free | |
GRX-1525
Abstract: Sn63pB37 temp profile DRS-22 omega 600smd Vitronics xpm2 programming smt machine ABC-2400 heller PCB monitor spc DRS22
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600SMD ABC-2400 GRX-1525 Sn63pB37 temp profile DRS-22 omega 600smd Vitronics xpm2 programming smt machine heller PCB monitor spc DRS22 | |
relay power door 24V 582D24-Y
Abstract: 582D24-Y 582D24 y
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28VDC) FBR572, FRL-270 FBR572: FBR582: FBR572 FBR582 relay power door 24V 582D24-Y 582D24-Y 582D24 y | |
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Contextual Info: RMPA1967 US-PCS CDMA, CDMA2000-1X and WDCMA Power Edge Power Amplifier Module Features General Description • Single positive-supply operation and low power and shutdown modes The RMPA1967 power amplifier module PAM is designed for CDMA, CDMA2000-1X, WCDMA and HSDPA personal communications system (PCS) applications. The 2-stage PAM is internally matched to 50 Ohms to minimize the use of external |
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RMPA1967 CDMA2000-1X CDMA2000-1XRTT/WCDMA RMPA1965 CDMA2000-1X, | |
SSG 23 TRANSISTOR
Abstract: CDMA2000-1X ECJ-1VB1H102K RMPA1965 grm39
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RMPA1965 CDMA2000-1X RMPA1965 CDMA2000-1X, SSG 23 TRANSISTOR ECJ-1VB1H102K grm39 | |
p10 LED matrix single color module
Abstract: tamura tlf-206-93f ZMXM-400 SAC-387
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ZMXM-400 100mW, p10 LED matrix single color module tamura tlf-206-93f SAC-387 | |
CDMA2000-1X
Abstract: ECJ-1VB1H102K RMPA1965 PAM 120
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RMPA1965 CDMA2000-1X RMPA1965 CDMA2000-1X, ECJ-1VB1H102K PAM 120 | |