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    SOLDER PASTE, INDIUM REFLOW PROCESS CONTROL Search Results

    SOLDER PASTE, INDIUM REFLOW PROCESS CONTROL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GRT155C81A475ME13J
    Murata Manufacturing Co Ltd AEC-Q200 Compliant Chip Multilayer Ceramic Capacitors for Infotainment PDF
    GRT155D70J475ME13D
    Murata Manufacturing Co Ltd AEC-Q200 Compliant Chip Multilayer Ceramic Capacitors for Infotainment PDF
    GRT155C81A475ME13D
    Murata Manufacturing Co Ltd AEC-Q200 Compliant Chip Multilayer Ceramic Capacitors for Infotainment PDF
    GRT155D70J475ME13J
    Murata Manufacturing Co Ltd AEC-Q200 Compliant Chip Multilayer Ceramic Capacitors for Infotainment PDF
    D1U54T-M-2500-12-HB4C
    Murata Manufacturing Co Ltd 2.5KW 54MM AC/DC 12V WITH 12VDC STBY BACK TO FRONT AIR PDF

    SOLDER PASTE, INDIUM REFLOW PROCESS CONTROL Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    72116

    Abstract: tamura solder paste solder paste tlf 204 29 tamura solder paste PROFILE NC-SMQ92J solder paste solder paste tamura tlf 204 29 UP78 multicore RP15 tamura No clean solder paste Loctite rp15
    Contextual Info: AN825 Vishay Siliconix The Solderability of the PowerPAKr SO-8 and PowerPAK 1212-8 When Using Different Solder Pastes and Profiles Jess Brown and Kandarp Pandya INTRODUCTION Next-generation PowerPAK packages from Vishay Siliconix feature very low thermal resistances, enabling higher power


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    AN825 15-Dec-03 72116 tamura solder paste solder paste tlf 204 29 tamura solder paste PROFILE NC-SMQ92J solder paste solder paste tamura tlf 204 29 UP78 multicore RP15 tamura No clean solder paste Loctite rp15 PDF

    Solder Paste, Indium, Type 3

    Abstract: d012 relay d012 w32 transistor fbr166 W32 MARKING FBR160
    Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching


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    POLE--15 FBR161 FBR166 Solder Paste, Indium, Type 3 d012 relay d012 w32 transistor W32 MARKING FBR160 PDF

    Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching


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    POLE--15 FBR161 FBR166 FBR161: PDF

    lf 12201

    Abstract: Solder Paste, Indium, Type 3
    Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching


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    POLE--15 FBR161 FBR166 FBR161: lf 12201 Solder Paste, Indium, Type 3 PDF

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Contextual Info: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


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    LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325 PDF

    fujitsu relay 57d24

    Abstract: 57D24 FBR57 DC-12 FBR57ND24-W 57D24-N MICRO TX1
    Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—30 A 28 VDC (FOR 24 V BATTERY AUTOMOTIVE APPLICATIONS) FBR57 SERIES RoHS compliant n FEATURES High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l Suitable for controlling 24 V motors in trucks and other


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    POLE--30 FBR57 FBR57: fujitsu relay 57d24 57D24 DC-12 FBR57ND24-W 57D24-N MICRO TX1 PDF

    fujitsu relay 57d24

    Abstract: 57D24-N
    Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—12 A 28 VDC (FOR 24 V BATTERY AUTOMOTIVE APPLICATIONS) FBR57 SERIES RoHS compliant n FEATURES High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l Suitable for controlling 24 V motors in trucks and other


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    POLE--12 FBR57 FBR57: fujitsu relay 57d24 57D24-N PDF

    LGA rework

    Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
    Contextual Info: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules


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    AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework PDF

    entek Cu-56

    Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
    Contextual Info: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


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    20ppm/ 5989-0834EN AV02-0769EN entek Cu-56 bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile PDF

    AN1035

    Abstract: tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602
    Contextual Info: AN-1035 DirectFET TM Technology Board Mounting Application Note page Device construction 2 Design considerations 3 Assembly considerations 4 Mechanical test results 5 International Rectifier AN-1035 DirectFET Technology Board Mounting Application Note Introduction


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    AN-1035 065mm. pp1509-1523 AN1035 tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602 PDF

    Contextual Info: RMPA2265 28dBm WCDMA Power Amplifier Module General Description Features The RMPA2265 power amplifier module PAM is designed for WCDMA applications. The 2 stage PAM is internally matched to 50Ω to minimize the use of external components and features a low-power mode to reduce


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    RMPA2265 28dBm RMPA2265 PDF

    Contextual Info: RMPA2265 28dBm WCDMA Power Amplifier Module General Description Features The RMPA2265 power amplifier module PAM is designed for WCDMA applications. The 2 stage PAM is internally matched to 50Ω to minimize the use of external components and features a low-power mode to reduce


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    RMPA2265 28dBm RMPA2265 PDF

    SN62

    Abstract: 210C RO4003 TGA2702 TGA2702-SM
    Contextual Info: Advance Product Information November 2, 2004 802.16 Driver / Power Amplifier TGA2702-SM Key Features • • • • • • • • • 2.4-2.8 GHz Bandwidth 2.5% EVM @ 23dBm 802.11g OFDM signal 39 dBc IMD3 @ 21 dBm Pout/tone 24 dB Nominal Gain 29.5 dBm Nominal P1dB


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    TGA2702-SM 23dBm TGA2702-SM TGA2702 SN62 210C RO4003 PDF

    Contextual Info: February 2005 RMPA2263 i-Lo WCDMA Power Amplifier Module 1920–1980 MHz Features General Description • 40% WCDMA efficiency at +28 dBm Pout ■ 14% WCDMA efficiency 85 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm


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    RMPA2263 PDF

    Solder Paste Indium reflow process control

    Contextual Info: April 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local


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    RMPA1963 RMPA1963 CDMA2000-1X IS-95/CDMA2000-1XRTT/WCDMA Solder Paste Indium reflow process control PDF

    CDMA2000-1X

    Abstract: ECJ-1VB1H102K RMPA1963 ECJ1VB1C104K
    Contextual Info: May 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local


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    RMPA1963 CDMA2000-1X RMPA1963 ECJ-1VB1H102K ECJ1VB1C104K PDF

    Contextual Info: April 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local


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    RMPA1963 RMPA1963 CDMA2000-1X IS-95/CDMA2000-1XRTT/WCDMA PDF

    Contextual Info: February 2005 RMPA0963 i-Lo Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout ■ 14% CDMAA/WCDMA efficiency 80 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm


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    RMPA0963 CDMA2000-1X PDF

    CDMA2000-1X

    Abstract: ECJ-1VB1H102K RMPA0966 fairchild microwave power transistor
    Contextual Info: November 2005 RMPA0966 i-Lo Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 42% CDMA/WCDMA efficiency at +28 dBm Pout ■ 21% CDMA/WCDMA efficiency 56 mA total current at +16 dBm Pout ■ Meets HSDPA performance requirements


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    RMPA0966 CDMA2000-1X ECJ-1VB1H102K fairchild microwave power transistor PDF

    GRM39Y5V104Z16V

    Contextual Info: February 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout ■ 14% CDMA/WCDMA efficiency 85 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm


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    RMPA1963 CDMA2000-1X GRM39Y5V104Z16V PDF

    Contextual Info: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the


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    RMPA2263 RMPA2263 PDF

    Solder Paste, Indium 5.8

    Abstract: ECJ-1VB1H102K RMPA1966 SN63 SN96 grm39
    Contextual Info: PRELIMINARY RMPA1966 i-Lo tm WCDMA Band II Power Amplifier Module Features General Description • 40% WCDMA efficiency at +28.5dBm Pout The RMPA1966 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA


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    RMPA1966 16dBm) 16dBm Solder Paste, Indium 5.8 ECJ-1VB1H102K SN63 SN96 grm39 PDF

    ECJ-1VB1H102K

    Abstract: RMPA0966
    Contextual Info: PRELIMINARY RMPA0966 i-Lo WCDMA Band V Power Amplifier Module tm Features General Description • 42% CDMA/WCDMA efficiency at +28dBm Pout The RMPA0966 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting Cellular CDMA/WCDMA/HSDPA,


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    RMPA0966 28dBm ECJ-1VB1H102K PDF

    GTO MODULE

    Abstract: ECJ-1VB1H102K SN63 SN96 Solder Paste, Indium 5.8
    Contextual Info: PRELIMINARY RMPA1766 i-Lo tm WCDMA Band IV Power Amplifier Module Features General Description • 40% WCDMA efficiency at +28dBm Pout The RMPA1766 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA


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    RMPA1766 28dBm 16dBm) 16dBm GTO MODULE ECJ-1VB1H102K SN63 SN96 Solder Paste, Indium 5.8 PDF