SOLDER PASTE, INDIUM, TYPE 3 Search Results
SOLDER PASTE, INDIUM, TYPE 3 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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54L74/BCA |
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54L74 - Flip-Flop, D-Type, Dual - Dual marked (M38510/02105BCA) |
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5474/BCA |
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5474 - Flip-Flop, D-Type, Dual - Dual marked (M38510/00205BCA) |
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54F374/BRA |
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54F374 - Octal D-Type Flip-Flop with TRI-STATE Outputs |
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54175/BEA |
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54175 - Flip-Flop, D-Type, 4-Bit - Dual marked (M38510/01702BEA) |
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54F273/QSA |
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54F273 - Flip-Flop, D-Type, 8-Bit, Edge-Triggered, With Asynchronous Master Reset - Dual marked (5962-8855001SA) |
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SOLDER PASTE, INDIUM, TYPE 3 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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72116
Abstract: tamura solder paste solder paste tlf 204 29 tamura solder paste PROFILE NC-SMQ92J solder paste solder paste tamura tlf 204 29 UP78 multicore RP15 tamura No clean solder paste Loctite rp15
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AN825 15-Dec-03 72116 tamura solder paste solder paste tlf 204 29 tamura solder paste PROFILE NC-SMQ92J solder paste solder paste tamura tlf 204 29 UP78 multicore RP15 tamura No clean solder paste Loctite rp15 | |
Solder Paste, Indium, Type 3
Abstract: d012 relay d012 w32 transistor fbr166 W32 MARKING FBR160
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POLE--15 FBR161 FBR166 Solder Paste, Indium, Type 3 d012 relay d012 w32 transistor W32 MARKING FBR160 | |
Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching |
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POLE--15 FBR161 FBR166 FBR161: | |
lf 12201
Abstract: Solder Paste, Indium, Type 3
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POLE--15 FBR161 FBR166 FBR161: lf 12201 Solder Paste, Indium, Type 3 | |
fujitsu relay 57d24
Abstract: 57D24-N
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POLE--12 FBR57 FBR57: fujitsu relay 57d24 57D24-N | |
fujitsu relay 57d24
Abstract: 57D24 FBR57 DC-12 FBR57ND24-W 57D24-N MICRO TX1
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POLE--30 FBR57 FBR57: fujitsu relay 57d24 57D24 DC-12 FBR57ND24-W 57D24-N MICRO TX1 | |
Chattering relay
Abstract: MARKING W1 FBR56 FBR56ND12-Y FBR56Nn-Y
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POLE--30 FBR56 FBR56: Chattering relay MARKING W1 FBR56ND12-Y FBR56Nn-Y | |
Contextual Info: Advance Product Information April 12, 2005 5.6 Watt 3.5GHz Packaged HPA TGA2925-EPU-SD\SG Key Features TGA2925 • • • • • • • • • 3.5 GHz Application Frequency Range 11 dB Nominal Gain 3%EVM @27dBm OFDM signal at 3.5GHz 37.5 dBm Nominal Psat |
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TGA2925-EPU-SD\SG TGA2925 27dBm TGA2925 TGA2925-SD\SG TGA2703 TGA2925-EPU-SD TGA2925-EPU-SG | |
LGA voiding
Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
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LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325 | |
Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—30 A FOR AUTOMOTIVE APPLICATIONS FBR56 SERIES RoHS compliant n FEATURES l High power contact capacity (carrying current: 40 A/10 minutes, 30 A/1 hour) l High heat resistance and extended operating voltage l RoHS compliant since date code: 0627 |
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POLE--30 FBR56 FBR56: | |
AN1035
Abstract: tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602
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AN-1035 065mm. pp1509-1523 AN1035 tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602 | |
Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—30 A FOR AUTOMOTIVE APPLICATIONS FBR56 SERIES RoHS compliant n FEATURES NO High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l High heat resistance and extended operating voltage l l RoHS compliant since date code: 0627 |
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POLE--30 FBR56 FBR56: | |
RO4350B
Abstract: RO4350 Thermagon Rogers RO4350B 62NCLR-A Solder Paste, Indium 5.1, Type 3 RO4350 properties pcb fabrication process of multilayer pcb pcb layout computer motherboard
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AMMP-6408 AMMP-6408 AMMC-6408 mus350 10mil T2905C RO4350B RO4350 Thermagon Rogers RO4350B 62NCLR-A Solder Paste, Indium 5.1, Type 3 RO4350 properties pcb fabrication process of multilayer pcb pcb layout computer motherboard | |
relay power door 24V 582D24-Y
Abstract: 582D24-Y 582D24 y
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28VDC) FBR572, FRL-270 FBR572: FBR582: FBR572 FBR582 relay power door 24V 582D24-Y 582D24-Y 582D24 y | |
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C4493Contextual Info: Advance Product Information Sept. 1, 2004 5.6 Watt 3.5GHz Packaged HPA TGA2925-EPU-SD Key Features TGA2925 • • • • • • • • 3.5 GHz Application Frequency Range 11 dB Nominal Gain 37.5 dBm Nominal Psat Internally Partially Matched IMD3 -50 dBc @ 24 dBm SCL, Typical |
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TGA2925-EPU-SD TGA2925 TGA2925-SD TGA2925 TGA2925-EPU-SD C4493 | |
relay power door 24V 582D24-Y
Abstract: 572ND24-N SPDT relay rl1
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28VDC) FBR572, FRL-270 FBR572: FBR582: FBR572 FBR582 relay power door 24V 582D24-Y 572ND24-N SPDT relay rl1 | |
Contextual Info: STEVAL-TDR028V1 RF power amplifier demonstration board based on the STAC2942B Features • Excellent thermal stability ■ Frequency: 87.5 - 108 MHz ■ Supply voltage: 48 V ■ Output power: 370 W min. ■ Gain: 20 dB typ. ■ Efficiency: 77% typ. ■ Harmonics: - 30 dBc max. |
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STEVAL-TDR028V1 STAC2942B STEVAL-TDR028V1 STAC2942B | |
stac2942
Abstract: STAC2942B STEVAL-TDR028V1 austerlitz C10100 Solder Paste, Indium 5.8 STAC265B
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STEVAL-TDR028V1 STAC2942B STEVAL-TDR028V1 STAC2942B stac2942 austerlitz C10100 Solder Paste, Indium 5.8 STAC265B | |
stac2942
Abstract: STAC2942B dow corning silicone compound C10100 STAC244 STAC265B "power semiconductor" phillips austerlitz
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STEVAL-TDR029V1 STAC2942B STEVAL-TDR029V1 STAC2942B stac2942 dow corning silicone compound C10100 STAC244 STAC265B "power semiconductor" phillips austerlitz | |
Contextual Info: STEVAL-TDR029V1 RF power amplifier demonstration board based on the STAC2942B Features • Excellent thermal stability ■ Frequency: 87.5 - 108 MHz ■ Supply voltage: 48 V ■ Output power: 700 W min ■ Gain: 20 dB typ. ■ Efficiency: 77 % typ ■ Harmonics: - 36 dBc max |
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STEVAL-TDR029V1 STAC2942B STEVAL-TDR029V1 STAC2942B | |
Indium tin oxideContextual Info: 100% Material Declaration Data Sheet for 7 Series FF900 PK560 v1.1 October 19, 2012 Average Weight: 11.6843g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis |
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FF900 PK560 6843g Indium tin oxide | |
FFG1761
Abstract: AI203 PB SN SOLDER Solder Paste, Indium, Type 3
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FFG1761 PK554 FFG1761 AI203 PB SN SOLDER Solder Paste, Indium, Type 3 | |
FFG900
Abstract: bt 1690 Indium tin oxide
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FFG900 PK524 5795g FFG900 bt 1690 Indium tin oxide | |
arctic silver thermal adhesive
Abstract: LOCTITE ACTIVATOR 7387 NC-SMQ92J SN62 PB36 ag2 Loctite ADHESIVE GAP PAD HUmiseal 1B73 hydrocarbon polymeric Loctite 406 Loctite sumo
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CLD-AP36 arctic silver thermal adhesive LOCTITE ACTIVATOR 7387 NC-SMQ92J SN62 PB36 ag2 Loctite ADHESIVE GAP PAD HUmiseal 1B73 hydrocarbon polymeric Loctite 406 Loctite sumo |