SOLDER PASTE, INDIUM, TYPE 3 Search Results

72116

Abstract: tamura solder paste solder paste tlf 204 29 tamura solder paste PROFILE NC-SMQ92J solder paste solder paste tamura tlf 204 29 UP78 multicore RP15 tamura No clean solder paste Loctite rp15
Contextual Info: AN825 Vishay Siliconix The Solderability of the PowerPAKr SO-8 and PowerPAK 1212-8 When Using Different Solder Pastes and Profiles Jess Brown and Kandarp Pandya INTRODUCTION Next-generation PowerPAK packages from Vishay Siliconix feature very low thermal resistances, enabling higher power

Solder Paste, Indium, Type 3

Abstract: d012 relay d012 w32 transistor fbr166 W32 MARKING FBR160
Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching

Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching

lf 12201

Abstract: Solder Paste, Indium, Type 3
Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching

AN3505

Abstract: TG-170 APP3505 DS2502
Contextual Info: Maxim > App Notes > 1-Wire Devices ResourceSmart: Green Design Circuit Protection General Engineering Topics Keywords: flip chip, DS2502, DS2502 flip-chip, RoHS, lead, Pb, lead free, Pb free, DS25o2, ds25m02, app note 3505 May 09, 2005 APPLICATION NOTE 3505

fujitsu relay 57d24

Abstract: 57D24-N
Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—12 A 28 VDC (FOR 24 V BATTERY AUTOMOTIVE APPLICATIONS) FBR57 SERIES RoHS compliant n FEATURES High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l Suitable for controlling 24 V motors in trucks and other

fujitsu relay 57d24

Abstract: 57D24 FBR57 DC-12 FBR57ND24-W 57D24-N MICRO TX1
Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—30 A 28 VDC (FOR 24 V BATTERY AUTOMOTIVE APPLICATIONS) FBR57 SERIES RoHS compliant n FEATURES High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l Suitable for controlling 24 V motors in trucks and other

Chattering relay

Abstract: MARKING W1 FBR56 FBR56ND12-Y FBR56Nn-Y
Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—30 A FOR AUTOMOTIVE APPLICATIONS FBR56 SERIES RoHS compliant n FEATURES l High power contact capacity (carrying current: 40 A/10 minutes, 30 A/1 hour) l High heat resistance and extended operating voltage l RoHS compliant since date code: 0627

Contextual Info: Advance Product Information April 12, 2005 5.6 Watt 3.5GHz Packaged HPA TGA2925-EPU-SD\SG Key Features TGA2925 • • • • • • • • • 3.5 GHz Application Frequency Range 11 dB Nominal Gain 3%EVM @27dBm OFDM signal at 3.5GHz 37.5 dBm Nominal Psat

LGA voiding

Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
Contextual Info: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print

Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—30 A FOR AUTOMOTIVE APPLICATIONS FBR56 SERIES RoHS compliant n FEATURES l High power contact capacity (carrying current: 40 A/10 minutes, 30 A/1 hour) l High heat resistance and extended operating voltage l RoHS compliant since date code: 0627

AN1035

Abstract: tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602
Contextual Info: AN-1035 DirectFET TM Technology Board Mounting Application Note page Device construction 2 Design considerations 3 Assembly considerations 4 Mechanical test results 5 International Rectifier AN-1035 DirectFET Technology Board Mounting Application Note Introduction

Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—30 A FOR AUTOMOTIVE APPLICATIONS FBR56 SERIES RoHS compliant n FEATURES NO High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l High heat resistance and extended operating voltage l l RoHS compliant since date code: 0627

RO4350B

Abstract: RO4350 Thermagon Rogers RO4350B 62NCLR-A Solder Paste, Indium 5.1, Type 3 RO4350 properties pcb fabrication process of multilayer pcb pcb layout computer motherboard
Contextual Info: AMMP-6408 Thermal Application Examples Application Note 5351 Introduction Typical Application The AMMP-6408 is a 1 watt power amplifier operating over the 6 to 18 GHz frequency range and is housed in a 5 x 5 mm surface mount package. The AMMP-6408 is the packaged version of Avago’s AMMC-6408 PHEMT MMIC.

LGA voiding

Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D
Contextual Info: Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor, Inc. Austin, TX Freescale has introduced the High Coefficient of Thermal

C4493

Contextual Info: Advance Product Information Sept. 1, 2004 5.6 Watt 3.5GHz Packaged HPA TGA2925-EPU-SD Key Features TGA2925 • • • • • • • • 3.5 GHz Application Frequency Range 11 dB Nominal Gain 37.5 dBm Nominal Psat Internally Partially Matched IMD3 -50 dBc @ 24 dBm SCL, Typical

relay power door 24V 582D24-Y

Abstract: 572ND24-N SPDT relay rl1
Contextual Info: COMPACT POWER RELAY 1 POLE X 2—12A 28VDC (FOR 24V BATTERY AUTOMOTIVE APPLICATIONS) FBR572, 582 SERIES RoHS compliant n FEATURES Two independent relays mounted in a single package (43% of the volume of the two FRL-270 relays) l High current contact capacity

Contextual Info: STEVAL-TDR028V1 RF power amplifier demonstration board based on the STAC2942B Features • Excellent thermal stability ■ Frequency: 87.5 - 108 MHz ■ Supply voltage: 48 V ■ Output power: 370 W min. ■ Gain: 20 dB typ. ■ Efficiency: 77% typ. ■ Harmonics: - 30 dBc max.

stac2942

Abstract: STAC2942B STEVAL-TDR028V1 austerlitz C10100 Solder Paste, Indium 5.8 STAC265B
Contextual Info: STEVAL-TDR028V1 RF power amplifier demonstration board based on the STAC2942B Features • Excellent thermal stability ■ Frequency: 87.5 - 108 MHz ■ Supply voltage: 48 V ■ Output power: 370 W min. ■ Gain: 20 dB typ. ■ Efficiency: 77% typ. ■ Harmonics: - 30 dBc max.

stac2942

Abstract: STAC2942B dow corning silicone compound C10100 STAC244 STAC265B "power semiconductor" phillips austerlitz
Contextual Info: STEVAL-TDR029V1 RF power amplifier demonstration board based on the STAC2942B Features • Excellent thermal stability ■ Frequency: 87.5 - 108 MHz ■ Supply voltage: 48 V ■ Output power: 700 W min ■ Gain: 20 dB typ. ■ Efficiency: 77 % typ ■ Harmonics: - 36 dBc max

Contextual Info: STEVAL-TDR029V1 RF power amplifier demonstration board based on the STAC2942B Features • Excellent thermal stability ■ Frequency: 87.5 - 108 MHz ■ Supply voltage: 48 V ■ Output power: 700 W min ■ Gain: 20 dB typ. ■ Efficiency: 77 % typ ■ Harmonics: - 36 dBc max

Indium tin oxide

Contextual Info: 100% Material Declaration Data Sheet for 7 Series FF900 PK560 v1.1 October 19, 2012 Average Weight: 11.6843g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis

FFG1761

Abstract: AI203 PB SN SOLDER Solder Paste, Indium, Type 3
Contextual Info: 100% Material Declaration Data Sheet for 7 Series FFG1761 PK554 v1.1 October 26, 2012 Average Weight: 20.7610 g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis

FFG900

Abstract: bt 1690 Indium tin oxide
Contextual Info: 100% Material Declaration Data Sheet for 7 Series FFG900 PK524 v1.2 October 12, 2012 Average Weight: 11.5795g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis