SOLDER JOINT RELIABILITY Search Results

G017

Abstract: als244c hipotted IPC-TP-787 perkin cte table E5007 IPC-SM-786 PE-68051 PE-69037
Contextual Info: OPTIMIZING SOLDER JOINT RELIABILITY for Surface Mount Magnetic Components Pulse’s Mechanical Design for Thermal Expansion and Optimal Lead Compliance Deliver Empirically-Measurable Solder Joint Reliability 1998, Pulse Engineering, Inc. G017.A © 1998, Pulse Engineering, Inc.

CU-106A

Abstract: entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement
Contextual Info: Pb-Free Solder Joint Evaluation Contact Us Buy About TI TI Worldwide my.TI Advanced Search Keyword Part Number >> Semiconductor Home > Products > Digital Logic > Digital Logic Overview > Texas Instruments Palladium Lead Finish Pb-Free Solder Joint Evaluation

Contextual Info: SMD Film Capacitors Production process basic suggestions In case of: no solder joint on one end termination no solder joint on both end terminations capacitor’s body mechanical deformation capacitance drop up to 20% capacitance drop (over 20%) Typical cause

Contextual Info: SMD Film Capacitors Production process basic suggestions In case of: no solder joint on one end termination no solder joint on both end terminations capacitor’s body mechanical deformation capacitance drop up to 20% capacitance drop (over 20%) Typical cause

Contextual Info: SMD Film Capacitors Production process basic suggestions In case of: no solder joint on one end termination no solder joint on both end terminations capacitor’s body mechanical deformation capacitance drop up to 20% capacitance drop (over 20%) Typical cause

JIS C7021

Abstract: JIS-C-7021 JIS C7021 B-10 JIS C 7021B-10 C7021A
Contextual Info: • Soldering Instructions Iron soldering with 1.5mm iron tip Dip and flow soldering Types Temperature of the soldering bath Maximum soldering time Distance from solder joint to case Temperature of soldering iron Maximum soldering time Distance from solder joint

TEKAS00056

Contextual Info: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering

Contextual Info: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering

AN3298

Abstract: FREESCALE PACKING J-STD-020B
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3298 Rev. 0, 07/2006 Solder Joint Temperature and Package Peak Temperature Determining Thermal Limits during Soldering 1 Processability of Integrated Circuits JEDEC/IPC J-STD-020 http://www.jedec.org is a Joint

all ic data

Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Contextual Info: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile

Intel reflow soldering profile BGA

Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Contextual Info: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.

all ic data

Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Contextual Info: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile

mutoh ip-220

Contextual Info: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK

solder joint

Abstract: joint TA65
Contextual Info: LEAD FREE SOLDER JOINT RELIABILITY QUALITY ENG : REPORT DATE: Herb Grimm 3/4/2004 PACKAGE TYPE: TEST DESCRIPTION: SOLDER PASTE SAMPLE SIZE: RESULT: INSPECTION METHOD: 20L TSSOP Temperature Cycle Sn,Ag.Cu 5 samples board mounted using +260C peak reflow PASS

datasheet of BGA Staggered pins

Abstract: of BGA Staggered pins Samtec Connector Reliability Samtec Cross reference
Contextual Info: HIGH SPEED CONNECTOR OPTIMIZES BANDWIDTH PER SQUARE INCH System allows 1 Terabit of data or 4 GHz per Differential Pair solder joint reliability. This technology is superior to standard BGA/solder ball attachment in that the connectors will only be subjected to extreme heat once - during

Contextual Info: F -2 0 2 -1 m sarnle c GFZ— 2 0 -0 1 -G -1 0 -A D c SOLDERLESS INTERFACES Board Stacking Modular-to-Board LGA Interfaces Solderless Interconnects No solder pad delamination Minimizes Coefficient of Thermal Expansion CTE issues No solder joint reliability

Solderability Tests

Abstract: AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002
Contextual Info: AN2036 APPLICATION NOTE Solderability Tests Lead-free devices, from STMicroelectronics, are warranted to pass the solderability tests, and to form a reliable solder joint with the base material of the circuit board, using Leaded Sn-Pb solder or Lead-free

Contextual Info: SURFACE MOL Surface mount sockets for 1C packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high temperature LCP body is ideal for vapor phase or infrared soldering. Precision stamped

Contextual Info: Surface mount sockets for 1C packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high temperature LCP body is ideal for vapor phase or infrared soldering. ROW SPACING & NO. OF CONTACTS

Contextual Info: S O L D E R IN G A N D C L E A N IN G PROCESSES 1 — Solder Paste Printing Roflow GENERAL Use the optimum solder paste for the pattern, printing pi-ocess, solderpaste density and solder joint quality. RECOMMENDED Use Sn 63% Pb 37% solder paste. Use 8 to 10 mil thickness for

Contextual Info: F -2 0 4 SURFACE MOUNT DIP SOCKET SERIES Surface mount sockets for 1C packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high temperature LCP body is ideal for vapor phase or

Contextual Info: FACTSHEET F-202-1 ICF–648–S–I ICF–324–S–O SURFACE MOUNT DIP SOCKET ICF SERIES Surface mount sockets for IC packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high

Contextual Info: FACTSHEET F-201 ICF–648–S–I ICF–324–S–O SURFACE MOUNT DIP SOCKETS ICF SERIES Surface mount sockets for IC packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high

Contextual Info: FACTSHEET F-200 ICF–648–S–I ICF–324–S–O SURFACE MOUNT DIP SOCKETS ICF SERIES Surface mount sockets for IC packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high