SOLDER Search Results

Contextual Info: Board to Board Connectors FH Free Height 0.8mm Pitch Connectors Board to Board SMT Typed/With Solder Peg Receptacle Assemblies Applicable Board Stacking Heights = 5mm/6mm/7mm/8mm Material and Finish: Housing- UL94V-0 rated, heat-resistant thermoplastic,

Contextual Info: h- .5 0 - - .2 5 0 |.0 7 5 — .19 r t 1 t 1 RF□ 0 5 5 -1 r .031 — c ri T -lo .38 T - .35 1 I IF MATERIAL El STANDARD □ SPECIAL ° BASE o COVER ° MARKING » FINISH F R -4 VECTRA LASER SOLDER TIN HIGH DYNAMIC RANGE DOUBLE BALANCED MIXER MAX

Contextual Info: 6 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. REVISIONS LOC DIST CM 00 LTR DESCRIPTION K .125/3 POST BOTH .225 + .010 II .005 MEASURED P LA S TIC PARTS D 05 APPLY AT TO SOLDER

Contextual Info: 5. Cleaning of Circuit Boards Circuit boards are cleaned a fte r devices have been soldered on. T h e follow ing points should be noted regarding cleaning. 1. These solvents are recom m ended for cleaning. ’ Freon TE, Freon T F Do not use chlorine based solvents triclene group, etc. .

Contextual Info: CO NOTES: 1 .MATERIAL: HOUSiNG : THERMOPLASTIC CONTACT : COPPER ALLOY. SHELL : COPPER ALLOY. CD O O + ü 15.2 0 1 4.50 2 .FINISH: CONTACT: GOLD PLATING SEE TABLE ON CONTACT AREA TIN-LEAD ON SOLDER TAILS. NICKEL UNDERPLATED OVER ALL SHELL: NICKEL PLATING OVER COPPER.

Contextual Info: 3 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 2 - LOC ALL RIGHTS RESERVED. CM DIST R E VIS IO N S LTR R DESCRIPTION EC 0G3B 0 2 4 9 DATE DWN 24SEP05 05 1. FITS SOCKET HOUSING 2. ASSEMBLY CONFORMS TO AMP SOLDERABILITY

ECRE

Contextual Info: 5 -7 Precaution of Assembly for Mini Flat Coupler 5 -7 -1 ) Soldering A vo id th e rise o f device te m p e ra tu re as m u ch as p ossible by th e fo llo w in g c o n d itio n s . a) S old e ring lead d ire c tly by so ld e r header) 26CTC M a x ., 1 0 second M ax.

Contextual Info: 4. Solder-mounting Flat Package ICs 1. Soldering conditions a. Soldering iron Solder a t lead tem p eratu re of 2 6 0 t for no m ore than 10 seconds or a t 350°C fo r no m ore th a n 3 seconds. b. Infrared reflow 1 W e recom m end heating m ethods in far-interm ediate infrared shown a t the top and bottom of

Contextual Info: Special Connectors Battery Connectors 2.5mm/3.0mm Pitch 3.0mm Pitch, Plug Assembly 8 Position, Material and Finish : Housing — Thermoplastic UL94V-0 rated, black Contact — Copper Alloy, Nickel-underplated all over, tin-lead plated on soldering area Housing

D325

Contextual Info: 8 Manufacturing date c o n s i s t i n g o f : 2 d i g i t s f o r the year Y Y , 2 d i g i t s old P/N Tyco (without the week ( WW) and 1 digit for the day -x-xxxxxxx-x V Code 0,6 P/N TYCO V Soldering/Wire-Wrap pins V42254-) 00 -0. 4 YYWWD +XXXX-+XXX

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. REVISIONS DIST CM LTR T DESCRIPTION DATE DWN BSV RCJ 27SEP05 EC 0G3B 0249 05 APVD ANTI SOLDER WICKING TAB FITS SOCKET HOUSING 640525.

OV 5693

Contextual Info: / j \ HOUSING & TINE PLATE - LIQUID CRYSTAL POLYMER LC P , UL 9 4 V —0 , BLACK. 2. CONNECTOR SOLDER TAILS WILL ACCOMMODATE PRINTED CIRCUIT BOARD THICKNESS OF 0 .8 TO 1.6 [.0 3 1 TO .0 6 3 ], ^ G, J, H INDICATE NUMBER OF POSITION MARKED ON ASSEMBLY. ALSO SEE TABLE.

Contextual Info: 3 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 2 - LOC ALL RIGHTS RESERVED. CM DIST R E VIS IO N S LTR N D o ASSEMBLY CONEORMS TO AMP SOLDERABILITY SPEC. 1 0 9 - 1 1 - 3 . C UL AND o .020 .0 6 3 BSV RCJ

Contextual Info: Electronics Standard Edge II Card Edge Connectors Solder Type Board-to-Board Connectors .100 [2.54] Centerline Vertical Solder Posts, Retention Feature, Without Mounting Ears M a te ria l and F in is h : .064 [1.63] Sq. X .130 [3.301 Dp. — Intercontact Key Slot

SMD 0402

Contextual Info: 2381 553 2.6/MLV0402E3.3T Vishay BCcomponents SMD 0402 Multilayer Varistor FEATURES • Surface mount multilayer surge suppressor  Inherent bidirectional clamping  Excellent energy/volume ratio  Suitable for reflow soldering  Compliant to RoHS directive 2002/95/EC

40MT160

Abstract: 40MT140 100mt160
Contextual Info: 40MT1.0P.PbF, 70MT1.0P.PbF, 100MT1.0P.PbF Series Vishay High Power Products Three Phase Bridge Power Module , 45 A to 100 A FEATURES • Low VF • Low profile package • Direct mounting to heatsink • Flat pin/round pin versions with PCB solderable terminals

Contextual Info: P/N 96-160M65 160-Position, 0.0256 [0.65] Pitch QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 15x15 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

BY252P

Contextual Info: BY251P thru BY255P Vishay General Semiconductor General Purpose Plastic Rectifier FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 A • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in

Contextual Info: Product Number: 3158-0-00-15-00-00-03-0 Description: 3158 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3158-0-00-15-00-00-03-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL:

9940

Abstract: mal215099xxxe3 MAL215099 99101E3 99804E3 150631-2 99103E3 99515E3 99603E3 MAL215
Contextual Info: 150 CRZ www.vishay.com Vishay BCcomponents Aluminum Capacitors SMD Chip , Very Low Z FEATURES • Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing • SMD-version with base plate, lead (Pb)-free reflow solderable • Very low impedance, very high ripple current

Contextual Info: P300A thru P300M Vishay General Semiconductor General Purpose Plastic Rectifier FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 A • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in

Vitreous enamel coating wirewound

Contextual Info: 210 Series Features • Terminals suitable for soldering or bolt connection. • Adjustable lug supplied. • High wattage applications. • All-welded construction. • Rugged lead free vitreous enamel coating. • Flame resistant coating. • Thumb-screw-adjustable lug

MILL-MAX

Contextual Info: Product Number: 3158-0-00-01-00-00-03-0 Description: 3158 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3158-0-00-01-00-00-03-0 200 - 300 " Tin/Lead over Nickel 00 RoHS Compliant SHELL MATERIAL:

2331-ZX

Abstract: Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650
Contextual Info: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than