SOL 20 PACKAGE Search Results

Contextual Info: ftm D U IT Grounding Connectors Typesspfi andspf2 Bronze Service Post Connectors Type SPF1 _ Dimensions-lnches V Conductor Size Range Wire Diameter Range (In.) Stud Size SPF1-8-C #12 Sol.-#8 Str. .08 1-1 46 1/4-20 .50 Female-One Cable SPF1-7-C #10 Sol.—#7 Str.

Contextual Info: Signetics FAST74F381 Arithmetic Logic Unit FAST Products Product Specification TYPE TYPICAL PROPAGATION DELAY 74F381 TYPICAL SUPPLY CURRENT TOTAL 6.5 ns 59mA ORDERING INFORMATION 20-Pin Plastic DIP N74F381N 20-Pin Plastic SOL N74F381D INPUT AND OUTPUT LOADING AND FAN-OUT TABLE

LPKL

Contextual Info: Signetics FAST 74F539 Dual l-Of-4 Decoder 3-state Product Specification FAST Products TYPE TY P IC A L PROPAGATION DELAY 74F539 7.5 ns 40mA ORDERING INFORMATION COM M ERCIAL RANGE Vc c = 5V±10% ; Ta = 0CC to +70°C PACKAGES 20-Pin Plastic DIP N74F539N 20-Pin Plastic SOL

Contextual Info: THICK FILM SURFACE MOUNTED WIDE BODY 7.49MM MOLDED SOL STYLE / 16 AND 20 PINS • Standard E.I.A. package compatible with automatic placement equipment ■ Compliant leads to reduce solder joint fatiguing ■ Tape and reel packaging standard (see page 114 for dimensions)

Contextual Info: SURFACE MOUNTED RESISTOR NETWORK WIDE BODY .300 INCH WIDE MOLDED SOL STYLE / 16 AND 20 PINS • JEDEC package compatible with automatic placement equipment ■ Compliant leads to reduce solder joint fatiguing ■ High temperature design suitable for all popular soldering techniques

Contextual Info: THIN FILM RESISTOR NETWORK SOL WIDE BODY GULL WING/ 16 AND 20 PIN • Increased lead density ■ Custom circuits available per factory Model 4400T Resistor Networks Electrical Characteristics Resistance Range. 10 to 150K ohms Resistance Tolerance . ±0.1 %, ±0.5%, ±1 %

231-75PAB-14V

Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
Contextual Info: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube

Contextual Info: CCD board level camera OEutM ion Sol C10990 series SPECTRAL RESPONSE * This is typical, not guaranteed. 60 C10990-904 C10990-942 Quantum efficiency % C10990-901, -942 50 C10990-904 40 30 20 10 200 300 400 500 600 700 800 900 1000 1100 1200 Wavelength (nm)

Contextual Info: SURFACE MOUNTED RESISTOR NETWORK WIDE BODY .300 INCH WIDE MOLDED SOL-J STYLE / 16 AND 20 PINS • Board footprint identical to medium body (.220 wide) SOM gull wing ■ Compliant leads to reduce solder joint fatiguing ■ High temperature design suitable for all popular soldering techniques

217-36CTT6

Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

sfn065d

Abstract: itron 406
Contextual Info: 8368602 SOL ITRON DEVICES SFN065D INC 01990 SWITCH MOS PA CKA G E TO-3 IDM VGS PD XL T J oper T . stg UNITS Voltage, Drain to Source Drain Current, Clamped Inductive XDSS V 010 G fs VGS(th). IGSS C ISS CRSS coss ^d(on) t r td ( o f f ) Cf 16 W 20 A -55 to +150

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

N10015

Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

ebonol

Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: ANALOG DEVICES Programmable, Isolated Voltage-to-Current Converter 1B22 FEATURES FUNCTIONAL BLOCK DIAGRAM I n t er n al I sol a t e d Lo op S u p p l y Dr i v e s 1000 SI Load Pin P r o g r a m m a b l e I n p u t s: 0 V t o +5 V or 0 V t o +10 V Pin Program m able O u t p u t s : 4 to 20 m A or 0 to 20 m A

ebonol

Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

SOL package

Abstract: array, sol 20 Package 28719
Contextual Info: ASRA Vishay Beyschlag Application Specific Resistor Array FEATURES ASRA stands for Application Specific Resistor Array and is supplied in a SO-L package “Small Outline” . Gull wing shaped leads and the dimensions of the package are well known from standard integrated circuits.

74 Series Logic ICs

Abstract: transistor AC126 74HC octal bidirectional latch cx 4060 8pin hc257a TC7PG17AFE TC7SG07FE Transistor 123AP AC139 hc11a
Contextual Info: General-Purpose Logic ICs CMOS Logic ICs z 94 Low-Voltage CMOS Logic ICs z 100 CMOS Logic ICs in Ultra-Small US Packages z 104 Dual-Supply Level Shifters z 106 CMOS Bus Switch ICs z 108 Application-Specific Logic z 110 One-Gate CMOS L-MOS z 112 89 CMOS Logic ICs (74AC, 74VHC, 74HC and Standard Series) Quick Reference

tc9800

Abstract: P300
Contextual Info: 8. Packing at Shipping 8.1 Packing and ordering methods TC9800 series packages DIP or SOL come loaded in m agazines. Example) TC9802 FW L - Package type - M odel name Code No mark 8.2 Packing Magazine P (DIP) FW (SOL) O o M agazine packing

CLCC44

Abstract: CLCC-44 tube DK 92 G3 Package Trays package so-16 telefunken Telefunken Electronic 170DK trays sol
Contextual Info: Packaging Quantities Device per Cardboard Packaging Quantity Large Small Package Code Comets Name Ċ DP Ċ DP 11 Package Lead Pitch mm Pieces / Tube Tube / Cardboard Pieces / Cardboard Tube / Cardboard Pieces / Cardboard DIP 4 2.54 120 50 6000 10 1200 DIP 6

CoolRunner

Abstract: P3Z22V10 PZ3032 PZ3064 PZ5032 A-84 Pqfp 100 PQFP-100
Contextual Info: Philips CoolRunner Family Selection Guide Part Number Package s Pkg Designator Macrocells Gates Is & I/Os P3Z22V10 28 pin PLCC 24 pin SOL 24 pin TSSOP 28 pin PLCC 24 pin SOL 24 pin TSSOP 28 pin PLCC 24 pin SOL 24 pin TSSOP 28 pin PLCC 24 pin SOL 24 pin TSSOP