SOL 20 PACKAGE Search Results

Contextual Info: ftm D U IT Grounding Connectors Typesspfi andspf2 Bronze Service Post Connectors Type SPF1 _ Dimensions-lnches V Conductor Size Range Wire Diameter Range (In.) Stud Size SPF1-8-C #12 Sol.-#8 Str. .08 1-1 46 1/4-20 .50 Female-One Cable SPF1-7-C #10 Sol.—#7 Str.

Contextual Info: Signetics FAST74F381 Arithmetic Logic Unit FAST Products Product Specification TYPE TYPICAL PROPAGATION DELAY 74F381 TYPICAL SUPPLY CURRENT TOTAL 6.5 ns 59mA ORDERING INFORMATION 20-Pin Plastic DIP N74F381N 20-Pin Plastic SOL N74F381D INPUT AND OUTPUT LOADING AND FAN-OUT TABLE

LPKL

Contextual Info: Signetics FAST 74F539 Dual l-Of-4 Decoder 3-state Product Specification FAST Products TYPE TY P IC A L PROPAGATION DELAY 74F539 7.5 ns 40mA ORDERING INFORMATION COM M ERCIAL RANGE Vc c = 5V±10% ; Ta = 0CC to +70°C PACKAGES 20-Pin Plastic DIP N74F539N 20-Pin Plastic SOL

Xr 1075

Abstract: SFNF123 BD 266 S
Contextual Info: / 836860 2 SOL ITRON D E VI CE S TOC 02014 INC SFNF123 ' " \ T-39-09 SWITCH MOS 70 tEl S3tatDa 0002014 1 • PACKAGE TO-39 POWER MOS MAXIMUM RATINGS VDS S tg V Power Dissipation 0 Tc«25°C 20 W Drain Current, Clamped Inductive 20 A Voltage, Gate-to-Source

Contextual Info: THICK FILM SURFACE MOUNTED WIDE BODY 7.49MM MOLDED SOL STYLE / 16 AND 20 PINS • Standard E.I.A. package compatible with automatic placement equipment ■ Compliant leads to reduce solder joint fatiguing ■ Tape and reel packaging standard (see page 114 for dimensions)

Contextual Info: SURFACE MOUNTED RESISTOR NETWORK WIDE BODY .300 INCH WIDE MOLDED SOL STYLE / 16 AND 20 PINS • JEDEC package compatible with automatic placement equipment ■ Compliant leads to reduce solder joint fatiguing ■ High temperature design suitable for all popular soldering techniques

Contextual Info: THIN FILM RESISTOR NETWORK SOL WIDE BODY GULL WING/ 16 AND 20 PIN • Increased lead density ■ Custom circuits available per factory Model 4400T Resistor Networks Electrical Characteristics Resistance Range. 10 to 150K ohms Resistance Tolerance . ±0.1 %, ±0.5%, ±1 %

231-75PAB-14V

Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
Contextual Info: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube

Contextual Info: CCD board level camera OEutM ion Sol C10990 series SPECTRAL RESPONSE * This is typical, not guaranteed. 60 C10990-904 C10990-942 Quantum efficiency % C10990-901, -942 50 C10990-904 40 30 20 10 200 300 400 500 600 700 800 900 1000 1100 1200 Wavelength (nm)

Contextual Info: SURFACE MOUNTED RESISTOR NETWORK WIDE BODY .300 INCH WIDE MOLDED SOL-J STYLE / 16 AND 20 PINS • Board footprint identical to medium body (.220 wide) SOM gull wing ■ Compliant leads to reduce solder joint fatiguing ■ High temperature design suitable for all popular soldering techniques

sfnf423

Contextual Info: 8368602 SOL ITRON DEVICES SFNF423 70C 0 20 7 8 INC _ SWITCH MOS PACKAGE TO-39 ?o 0 r T-39-09 tE.|a3tat,Gg odosotis s F POWER MOS MAXIMUM RATINGS SYMBOL VDS XD XDM VGS PD XL TJ oper T stg UNITS PARAMETER Voltage, Drain to Source A Drain Current, Continuous @ Tc«25°C

ebonol

Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ipc sm 782

Abstract: 4420p-002
Contextual Info: THICK FILM SURFACE MOUNTED WIDE BODY 7.49MM MOLDED SOL STYLE / 16 AND 20 PINS • P ackage com patible with autom atic placem ent equipm ent ■ C om pliant leads to reduce solder joint fatiguing W ß P O U H N S ■ High tem perature lead attachm ent designed to withstand reflow

217-36CTT6

Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

sfn065d

Abstract: itron 406
Contextual Info: 8368602 SOL ITRON DEVICES SFN065D INC 01990 SWITCH MOS PA CKA G E TO-3 IDM VGS PD XL T J oper T . stg UNITS Voltage, Drain to Source Drain Current, Clamped Inductive XDSS V 010 G fs VGS(th). IGSS C ISS CRSS coss ^d(on) t r td ( o f f ) Cf 16 W 20 A -55 to +150

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

05683

Abstract: 587H
Contextual Info: T H IS COPY IS PROVIDED ON A RES TR IC TED B A S IS AND IS NOT TO BE USED IN ANY WAY DETRIM ENTAL TO THE Listed os o PRESSURE -TYPE wire connector on the Pol lowing sol id and/or stranded wire comb ¡notions Cu-Cu . 2 #14 w/1 or 2 #16 4 to 6 #22 5 # 18 w/ #20

N10015

Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

ebonol

Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: ANALOG DEVICES Programmable, Isolated Voltage-to-Current Converter 1B22 FEATURES FUNCTIONAL BLOCK DIAGRAM I n t er n al I sol a t e d Lo op S u p p l y Dr i v e s 1000 SI Load Pin P r o g r a m m a b l e I n p u t s: 0 V t o +5 V or 0 V t o +10 V Pin Program m able O u t p u t s : 4 to 20 m A or 0 to 20 m A

ebonol

Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

SOL package

Abstract: array, sol 20 Package 28719
Contextual Info: ASRA Vishay Beyschlag Application Specific Resistor Array FEATURES ASRA stands for Application Specific Resistor Array and is supplied in a SO-L package “Small Outline” . Gull wing shaped leads and the dimensions of the package are well known from standard integrated circuits.