SOIC 28 WIDE BODY Search Results

ir2131

Contextual Info: IR2131 28 Lead PDIP wide body 28 Lead SOIC (wide body) 01-3024 02

soic 28 wide body

Contextual Info: IR2131 28 Lead PDIP wide body 28 Lead SOIC (wide body) 01-3024 02

soic 28 wide body

Abstract: ir2131
Contextual Info: IR2131 28 Lead PDIP wide body 28 Lead SOIC (wide body) 8 01-3040 01

MS-013-AE

Abstract: 7126 RW-28 MS-013AE
Contextual Info: a 28-Lead Standard Small Outline Package [SOIC] Wide Body RW-28 Dimensions shown in millimeters and (inches) 18.10 (0.7126) 17.70 (0.6969) 28 15 7.60 (0.2992) 7.40 (0.2913) 1 14 10.65 (0.4193) 10.00 (0.3937) 2.65 (0.1043) 2.35 (0.0925) 0.75 (0.0295) ؋ 45؇

DIMENSIONS soic 28

Contextual Info: a 28-Lead Standard Small Outline Package [SOIC] Wide Body R-28 Dimensions shown in millimeters and (inches) 18.10 (0.7126) 17.70 (0.6969) 28 15 7.60 (0.2992) 7.40 (0.2913) 1 14 10.65 (0.4193) 10.00 (0.3937) 2.65 (0.1043) 2.35 (0.0925) 0.75 (0.0295) ؋ 45؇

SOIC-16

Abstract: PLCC-20 SIP 9 SOIC-8 lr 014
Contextual Info: PACKAGE DESIGNATORS A DIP 14 to 40 pins B (Semi-Tab DIP) 8 to 24 pins Dwg. OA-004-18 Dwg. OA-004-17 K (SIP) 4 pins KA (SIP) 5 pins LL, LR, or LT (SOT) Dwg. OA-014-64 L (SOIC) 8, 14, or 16 leads Dwg. OA-008-3 LB (Semi-Tab SOIC) 16 to 24 leads LW (Wide-Body SOIC) 16 to 28 leads

Contextual Info: Package Information www.vishay.com Vishay Siliconix SOIC WIDE-BODY : 28-LEADS 0.06 0.002D CAVITY NO. 0.3525 0.001 0.334 0.005 28 27 26 25 24 23 22 21 20 19 18 R0.004 17 16 15 0.010 0.1475 0.001 R0.008 0.295 0.001 R0.009 1 2 3 4 5 6 7 8 9 10 11 12 13 14 4°

Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- A D h x 45o a e A1

MS-013-AE

Abstract: 28 MS-013 Package
Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- e

28 MS-013 Package

Abstract: MS-013-AE
Contextual Info: Plastic Package Small Outline Plastic Package SOIC M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)

MS-013-AE

Abstract: 751F-01 soic 28 wide body
Contextual Info: F R E E S C A L E SEMICONDUCTOR, A L L RIG H TS RESERVED. TITLE: SOIC. INC. WIDE BODY. 28 L E A D C A S E O U T L I NE MECHANICAL OUTLINE P R IN T VERSIO N NOT TO S C A LE DOCUMENT NO: 9 8 A S B 4 2 3 4 5 B REV: G CASE NUMBER: 7 5 1 F - 0 5 10 MAR 2005

IR2110 application note

Abstract: IR2101 full bridge IR2113 APPLICATION NOTE h bridge ir2110 full bridge ir2110 Full-bridge IR2110 IR2112 application note IR2104 APPLICATION NOTE h bridge ir2113 ballast Self-Oscillating
Contextual Info: International Rectifier Control IC Navigator Function Features Voltage Offset 8 Lead DIP 14 Lead DIP 14 Lead DIP w/o leads 4 & 5 16 Lead DIP w/o leads 4 & 5 28 Lead DIP 9 Pin SIP w/o leads 5&7 8 Lead SOIC Narrow Body Basic 600 IR2117 G IR2118 (G) IR2117S (G)

Ablestik 8290

Abstract: C194 G600 MS-013 Amkor Wafer level mold compound PPF leadframe
Contextual Info: LEADFRAME data sheet SOIC Features: Small Outline IC Packages: Amkor has a broad portfolio of Small Outline ICs SOIC packages, including .150", .208" and .300" body sizes. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best

ir2110

Abstract: ir2110 application AN IR2110 IR2112 IR2112-2 IR2110-2 IR4427 IC IR2110S IR2186S IR3220S
Contextual Info: International Rectifier Automotive IC Navigator MOSFET GATE DRIVERS 8 Lead SOIC Narrow Body 14 Lead SOIC Narrow Body 16 Lead SOIC Wide Body Features Voltage Offset 8 Lead DIP Dual Low Side b a si c n/a IR4426 IR4427 IR4428 IR4426S IR4427S IR4428S High Side

DIP to SOIC Adapter Modules

Contextual Info: ACCUTEK DIP to SOIC Adapter Modules MICROCIRCUIT CORPORATION DIP to SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of older Dual-Inline-Packages onto circuit board sites which are designed for standard pitch SOIC devices.

Contextual Info: ACCUTEK Wide SOIC to Narrow SOIC Adapter Modules MICROCIRCUIT CORPORATION SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek family of SOIC Adapter Modules permit the connection

Contextual Info: Wide SOIC to Narrow SOIC Adapter Modules ACCUTEK MICROCIRCUIT CORPORATION SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek family of SOIC Adapter Modules permit the connection

qsop 16 pcb footprint

Abstract: qsop 24 footprint 16 QSOP pcb footprint 16 soic pcb footprint qsop 20 pcb footprint footprint soic AKB163237 AKL163220 footprint soic 20 AKB203237
Contextual Info: Accutek Microcircuit Corporation SOIC Adapter Modules SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of smaller fine pitch TSOP and SSOP packages onto circuit board

dram zip

Abstract: Z03 Series AK14Z-N AK16Z-N AK16Z-W AK20Z-N AK20Z-W AK24Z-W AK28Z-W
Contextual Info: Accutek Microcircuit Corporation ZIP Adapter Modules DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace

AK14Z-N

Abstract: AK16Z-N AK16Z-W AK20Z-N AK20Z-QSOP AK20Z-QSOP-LH AK20Z-QSOP-WPC AK20Z-SOIC-WPC AK20Z-SOJ AK20Z-W
Contextual Info: ACCUTEK ZIP Adapter Modules MICROCIRCUIT CORPORATION DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace

Contextual Info: ZIP Adapter Modules ACCUTEK MICROCIRCUIT CORPORATION DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace

soic 28 wide body

Abstract: 28 MS-013 Package MS-013
Contextual Info: 300 mil Wide Body SOIC SYMBOL A A1 A2 B C D E e H h L N α In Millimeters COMMON DIMENSIONS MIN MAX -2.65 0.10 -2.05 2.55 0.33 0.51 0.18 0.32 SEE VARIATIONS 7.40 7.60 1.27 BASIC 10.00 10.65 0.25 0.75 0.40 1.27 SEE VARIATIONS 0° 8° In Inches* COMMON DIMENSIONS

40-pin EPROM pinout

Abstract: lcc 28 socket AD303 uPD78P138GF 28C513 32 pin plcc socket to dil AD-303 hitachi h8 DIL 28 32 plcc 8751 EPROM
Contextual Info: tmcnra I ul li I T - | J [ j p ELECTRONICS PACKAGE CONVERTERS FOR USE WITH PROGRAMMERS □ Increase the versatility of your programming system with our economical solutions MQP Electronics manufacture a complete range of package converters for use with device programming equipment.

DIMENSIONS soic 28

Abstract: 40 PIN CERDIP ADM231
Contextual Info: 5 V-Powered CMOS RS-232 Drivers/Receivers ADM231L–ADM234L/ADM236L–ADM241L FEATURES ADM236L TYPICAL OPERATING CIRCUIT Single 5 V power supply Meets all EIA-232-E and V.28 specifications 120 kbps data rate On-board dc-to-dc converters ±9 V output swing with 5 V supply