SOCKET IC 4 PIN Search Results

28 pin ic base socket round pin type lead

Abstract: AXS100811 AXS101411 AXS101611 AXS101811 AXS102011 AXS102211 AXS102411 AXS102471 AXS102811
Contextual Info: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN FEATURES 1. With advanced design method of the frame, stress transmission from the PC board is greatly reduced. 2. This is a high reliability IC socket with round pin external contacts constructed with 4 point internal

AXS102013

Abstract: matsua catalog ic AXS101413
Contextual Info: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN FEATURES 1. With advanced design method of the frame, stress transmission from the PC board is greatly reduced. 2. This is a high reliability IC socket with round pin external contacts constructed with 4 point internal

AXS100811

Abstract: AXS101411 AXS101611 AXS101811 AXS102011 AXS102211 AXS102411 AXS102471 AXS102811 AXS103211
Contextual Info: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN FEATURES 1. With advanced design method of the frame, stress transmission from the PC board is greatly reduced. 2. This is a high reliability IC socket with round pin external contacts constructed with 4 point internal

sharp lsi pc 2002

Abstract: AXS628319C P28GM-50-450A1-2 FRAME32
Contextual Info: AXS6 SOP SOCKETS AXS6 µSOCKET SERIES IC SOCKETS FOR SMALL OUTLINE PACKAGE 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density mounting is possible even if the socket is used. 4. Automated mounting compatible The socket has an open flat construction

Contextual Info: PCB IC Socket Specifications: Connector Type Pitch Spacing Row Pitch Contact Termination Contact Material Contact Plating : DIP Socket : 2.54mm : 7.62mm : Through Hole Vertical : Beryllium Copper : Gold Technical Data Material: Pin outer sleeve Clip (contact 4 finger)

Contextual Info: RN ICPAK Nuaent QFP Sockets REMARKS 3 Check the IC’s pin pitch before insertion. If the IC’s pin pitch is uneven, it might not fit into the socket or the 1C may become damaged. 4) Check that the contacts are clean before mount­ ing. Poor contact may result if the socket contacts

Contextual Info: Connectors IC Sockets KLS1-209BA 2.0x2.8mm Pitch IC Socket SIP L=11.2mm I Material: Pin outer sleeve :Brass Clip(contact 4/6 finger):Beryllium copper,heat treated Plating(outer sleeve): Tin plated:1.25u" m/50u" nickel,50um/200u" Tin Gold plated:1.25u" m/50u" nicke,full gold

Contextual Info: ASSMANN IC-Special-Sockets Electronic C om ponents IC-Spedal-Sockets 6 4 pin Socket for adaption of: 7,62 mm 1C on 15,24 mm PCB 15,24 mm IC on 7,62 mm PCB for NEC Pitch 0,070 inch 0.8 . J ^ j* .0 8 i f .265 ,T3 «> ’.*5 ^ ,1. 1 ~C JTTaO I S p iecr b .000

Contextual Info: 100 1 2,5 4 m m S P E C IF IC A T IO N S SOCKET/TERMINAL For complete specifications see www.samtec.com?LST or www.samtec.com?HLST Insulator Material: Standard: Black T O Glass Filled Polyester HuaannsM High Temp: Top (Socket) Black LCP; Bottom (Terminal)

Contextual Info: AXS2 µSOCKET SERIES IC SOCKET WITH HIGH RELIABILITY µIC SOCKETS AXS2 CONSTRUCTION OF CONTACT Tulip-style µ contact, in which all contacts are arrayed facing the contact surface of the IC lead. Contact design using ABAQUS 4. Porosity treatment provides

8 pin ic base socket round pin type lead

Abstract: 28 pin ic base socket round pin type lead Socket IC 24 pin 40 pin ic base socket round pin type lead AXS200611K AXS200811K AXS201411K AXS201611K AXS201811K AXS202411K
Contextual Info: AXS2 µSOCKET SERIES IC SOCKET WITH HIGH RELIABILITY µIC SOCKETS AXS2 CONSTRUCTION OF CONTACT Tulip-style µ contact, in which all contacts are arrayed facing the contact surface of the IC lead. Contact design using ABAQUS 4. Porosity treatment provides

Contextual Info: QFP-Socket and Emulation-Adapter HHSÌ3 QFP/TQFP80 20 x 20 0.65 mm pitch IC - Dimensions Adapter PCB-Layout (View from Soldering Side) Socket PCB-Layout (Top View) 2-20. 50min .4-14. 70max .65 x 19.= ß. 6 5 * 1 9 = 1 2 . 3 5 ± 0 . 12.35 ±0. 4 - 1 3. 0 Ori I r

Contextual Info: SIMM IC-176 Series CHARACTERISTICS Insulation Resistance Breakdown Voltage Contact Resistance Operating Temperature ORDERING PROCEDURE IC-176- 4 MF: With Mounting Flange Design Number Socket Series 1,000MQ minimum at 500 VDC 700 VAC for one minute 30m£2 maximum at 10mA/20mV

Contextual Info: E LE C TR O N IC S, IN C ., IC SOCKET SCREW MACHINE HIGH DENSITY U.S .A FEATURES AND OPTIONS - For use with 64 pin devices on .750" centerline spacing .070 " between contacts Utilizes high quality screw machine contacts - SPECIFICATIONS MATERIALS Contact Spring: Copper alloy - 4 legs-gold plated

511 SIP

Abstract: K 511
Contextual Info: Single In-line "Snap SIP” Socket Strips ADVANCED INTERCONNECTIONS 5 E n e rg y W a y , P .O . Box 1 0 1 9 , W e s t W a rw ic k , R l 0 2 8 9 3 • T e l. 4 0 1 - 8 2 3 - 5 2 0 0 • F A X 4 0 1 -8 2 3 -8 7 2 3 Single In-line "Snap SIP” Socket Strips Socket Strip

torque of screw for pcb

Abstract: torque of 4-40 screw for pcb SG-BGA-6180 BGA OUTLINE DRAWING
Contextual Info: tapped for 4-40 machine screw x4 55.225mm BGA pad outline A A 5mm typ. 20mm typ. 55.225mm Bottom View Top View 7 Tighten lid screws and socket base screws gradually in an "X" pattern until they are torqued to 1 in-lb each. User's BGA IC 1 Socket Compression Lid: Black anodized Aluminum.

MDU-4F-10

Abstract: MDU-4F-15 MDU-4F-20 MDU-4F-25 MDU-4F-30 MDU-4F-35 MDU-4F-40 MDU-4F-45 MDU-4F-50
Contextual Info: data delay devicesYinc. EFasf L o g ic Multiple Digital Delay Units SERIES: MDU-4F 14 pins DIP TTL Interfaced Features: Completely interfaced for TTL & DTL application. P.C. board space economy achieved. Fits standard 14 pins DIP socket. 4 equal delay units/package.

Contextual Info: A IM Metrimate Pin and Socket Connectors M E T R IC Catalog 1307612 Dimensions are millimeters over inches. Revised 7-01 Drawer Connectors Receptacle Housing Standard Drawer Connector Panel Mount Accepts Pin Contacts Product Facts • 4-, 12-, 19- and 25-position

Contextual Info: P.G.A. Test & Burn-In Socket N P161 Series y a m a ic h i IS . s A 1 »•»« E 4-J4 -J-4-•l*4-4-+*f4 - f 4-1-4-* - ? -i+ktkkm fh imiEmEmi t JUjTj+i+tTmT i ~ 7 i tkk kt+ k m f ./PIN2 - ##3 0O .8 t 4 - • ;-: 4 H 4 T rr \ a> / j-f i-f <-

pogo pin

Abstract: pogo pins datasheet socket head cap screw SS-QFN20A-01 pin torlon
Contextual Info: 12.225mm 12.225mm 4 1 Materials: 11.2mm + IC height 7 1 2 2 6 8 3 4 10 11 Swivel Shell Lid: Black anodized Aluminum. Height = 2.5 mm. Socket Base: Black anodized Aluminum. Height = 5.0 mm. Compression Plate: Black anodized Aluminum. not shown Thickness = 2.5 mm.

Contextual Info: DS2Y Miniature Relay DS2Y RELAYS FEATURES TYPICAL APPLICATIONS 1. 2 Form C contact 2. High sensitivity-200 mW nominal operating power 3. High breakdown voltage 1500 V FCC surge between open contacts 4. DIP-2C type matching 16 pin IC socket 5. Sealed construction

relay 24v 2a

Abstract: DS2Y-S-DC24V DS2Y-S-DC5V DS2Y-S-DC12V RELAY
Contextual Info: DS2Y MINIATURE RELAY DS2Y RELAYS FEATURES TYPICAL APPLICATIONS 1. 2 Form C contact 2. High sensitivity-200 mW nominal operating power 3. High breakdown voltage 1500 V FCC surge between open contacts 4. DIP-2C type matching 16 pin IC socket 5. Sealed construction

DS2Y-S-DC24V

Abstract: DS2Y-S-DC12V RELAY DS2Y-S-DC5V DS2Y-S-DC9V relay 12v 40mA relay 6v 5 pin DS2Y-S-DC12V DS2Y-S-DC48V
Contextual Info: DS2Y MINIATURE RELAY DS2Y RELAYS FEATURES TYPICAL APPLICATIONS 1. 2 Form C contact 2. High sensitivity-200 mW nominal operating power 3. High breakdown voltage 1500 V FCC surge between open contacts 4. DIP-2C type matching 16 pin IC socket 5. Sealed construction

DS2Y-S-DC12V RELAY

Abstract: ds2y-s-dc24v DS2Y-S-DC5V DS2Y-S-DC12V DS2Y-S-DC5V RELAY DS2Y-S-DC48V relay 6v dc
Contextual Info: DS2Y MINIATURE RELAY DS2Y RELAYS FEATURES TYPICAL APPLICATIONS 1. 2 Form C contact 2. High sensitivity-200 mW nominal operating power 3. High breakdown voltage 1500 V FCC surge between open contacts 4. DIP-2C type matching 16 pin IC socket 5. Sealed construction